KR102475422B1 - 커패시터 필름, 이의 제조방법 및 이로부터 제조된 물품 - Google Patents

커패시터 필름, 이의 제조방법 및 이로부터 제조된 물품 Download PDF

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KR102475422B1
KR102475422B1 KR1020197037200A KR20197037200A KR102475422B1 KR 102475422 B1 KR102475422 B1 KR 102475422B1 KR 1020197037200 A KR1020197037200 A KR 1020197037200A KR 20197037200 A KR20197037200 A KR 20197037200A KR 102475422 B1 KR102475422 B1 KR 102475422B1
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film
polyetherimide
less
weight
extruded
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KR20190141799A (ko
Inventor
로이 레이 오들
매튜 프랭크 니마이어
마크 에이. 새너
앤 이. 볼바리
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에스에이치피피 글로벌 테크놀러지스 비.브이.
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/04—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets uniaxial, e.g. oblique
    • B29C55/06—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets uniaxial, e.g. oblique parallel with the direction of feed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Organic Insulating Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
KR1020197037200A 2013-05-31 2014-05-30 커패시터 필름, 이의 제조방법 및 이로부터 제조된 물품 Active KR102475422B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361829500P 2013-05-31 2013-05-31
US61/829,500 2013-05-31
KR1020157031347A KR102058217B1 (ko) 2013-05-31 2014-05-30 커패시터 필름, 이의 제조방법 및 이로부터 제조된 물품
PCT/US2014/040261 WO2014194212A1 (en) 2013-05-31 2014-05-30 Capacitor films, methods of manufacture, and articles manufactured therefrom

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020157031347A Division KR102058217B1 (ko) 2013-05-31 2014-05-30 커패시터 필름, 이의 제조방법 및 이로부터 제조된 물품

Publications (2)

Publication Number Publication Date
KR20190141799A KR20190141799A (ko) 2019-12-24
KR102475422B1 true KR102475422B1 (ko) 2022-12-07

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KR1020197037200A Active KR102475422B1 (ko) 2013-05-31 2014-05-30 커패시터 필름, 이의 제조방법 및 이로부터 제조된 물품
KR1020157031347A Active KR102058217B1 (ko) 2013-05-31 2014-05-30 커패시터 필름, 이의 제조방법 및 이로부터 제조된 물품

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Country Status (5)

Country Link
EP (1) EP3003686B1 (OSRAM)
JP (1) JP6329253B2 (OSRAM)
KR (2) KR102475422B1 (OSRAM)
CN (1) CN105473309B (OSRAM)
WO (1) WO2014194212A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3245244A4 (en) * 2015-02-03 2018-06-06 SABIC Global Technologies B.V. Polyetherimide miscible polymer blends for capacitor films
CN107531901B (zh) * 2015-02-03 2020-04-17 沙特基础全球技术有限公司 用于电容器膜的聚醚酰亚胺混溶聚合物共混物
EP3397672A1 (en) 2015-12-31 2018-11-07 SABIC Global Technologies B.V. Polyetherimide compositions, methods of manufacture, and articles prepared therefrom
US20190240868A1 (en) * 2016-07-12 2019-08-08 Sabic Global Technologies B.V. Method of making an extruded thin film, thin film so produced and its use
EP3904048A4 (en) * 2018-12-27 2022-09-28 Oji Holdings Corporation Amorphous thermoplastic resin film, capacitor metalized film, film roll, and capacitor
WO2021009727A1 (en) * 2019-07-18 2021-01-21 Shpp Global Technologies B.V. Thermoplastic composition and metallized articles prepared therefrom
EP4047620A1 (de) * 2021-02-22 2022-08-24 Siemens Aktiengesellschaft Isolationssystem mit festem isolationsstoff und imprägnierharz

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012155083A1 (en) 2011-05-12 2012-11-15 Sabic Innovative Plastics Ip B.V. Amorphous polyetherimide films for capacitors, methods of manufacture, and articles manufactured therefrom

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US3484664A (en) * 1968-11-21 1969-12-16 Hercules Inc Electrical capacitors
US3740623A (en) * 1972-01-14 1973-06-19 Trw Inc Self-healing non-metallized polystyrene capacitor
JPS59210939A (ja) * 1983-05-13 1984-11-29 Toyobo Co Ltd 架橋したポリエ−テルイミド成形物
JPH05320339A (ja) * 1992-05-15 1993-12-03 Mitsui Toatsu Chem Inc 熱安定性良好なポリイミドおよびその製造方法
JP2000071268A (ja) * 1998-08-31 2000-03-07 Du Pont Toray Co Ltd ポリイミドフィルムおよびその製造方法
US6919422B2 (en) * 2003-06-20 2005-07-19 General Electric Company Polyimide resin with reduced mold deposit
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US20080044639A1 (en) * 2006-06-26 2008-02-21 Kwok Pong Chan Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US8034857B2 (en) * 2007-07-12 2011-10-11 Sabic Innovative Plastics Ip B.V. Polyetherimide/polyphenylene ether sulfone blends
JP2009173847A (ja) * 2007-12-27 2009-08-06 Toray Ind Inc 熱可塑性樹脂組成物および成形品
US8545988B2 (en) * 2008-02-25 2013-10-01 Sabic Innovative Plastics Ip B.V. Polyetherimide and polyetherimide sulfone blends having automotive lighting applications
EP2108673A1 (en) * 2008-04-11 2009-10-14 DuPont Teijin Films U.S. Limited Partnership Plastic film having a high breakdown voltage
US9127128B2 (en) * 2011-10-28 2015-09-08 Sabic Global Technologies B.V. Polyetherimides, methods of manufacture, and articles formed therefrom
US8722187B2 (en) * 2011-10-31 2014-05-13 Sabic Innovative Plastics Ip B.V. Solventless process for the preparation of amine functional polyetherimide resins with improved melt flow

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
WO2012155083A1 (en) 2011-05-12 2012-11-15 Sabic Innovative Plastics Ip B.V. Amorphous polyetherimide films for capacitors, methods of manufacture, and articles manufactured therefrom

Also Published As

Publication number Publication date
CN105473309A (zh) 2016-04-06
CN105473309B (zh) 2018-02-02
JP2016528308A (ja) 2016-09-15
KR20190141799A (ko) 2019-12-24
KR102058217B1 (ko) 2019-12-20
WO2014194212A1 (en) 2014-12-04
JP6329253B2 (ja) 2018-05-23
KR20160015201A (ko) 2016-02-12
EP3003686A1 (en) 2016-04-13
EP3003686B1 (en) 2017-12-20

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