CN105473309B - 电容器膜、制造方法、和由其制造的制品 - Google Patents

电容器膜、制造方法、和由其制造的制品 Download PDF

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Publication number
CN105473309B
CN105473309B CN201480030925.9A CN201480030925A CN105473309B CN 105473309 B CN105473309 B CN 105473309B CN 201480030925 A CN201480030925 A CN 201480030925A CN 105473309 B CN105473309 B CN 105473309B
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China
Prior art keywords
film
polyetherimide
high yield
less
uniaxially stretched
Prior art date
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CN201480030925.9A
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English (en)
Chinese (zh)
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CN105473309A (zh
Inventor
罗伊·雷·奥德尔
马修·弗兰克·尼梅依尔
马克·A·桑纳
安妮·E·博尔瓦里
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SABIC Global Technologies BV
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SABIC Innovative Plastics IP BV
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C55/00—Shaping by stretching, e.g. drawing through a die; Apparatus therefor
    • B29C55/02—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets
    • B29C55/04—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets uniaxial, e.g. oblique
    • B29C55/06—Shaping by stretching, e.g. drawing through a die; Apparatus therefor of plates or sheets uniaxial, e.g. oblique parallel with the direction of feed
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/101—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents
    • C08G73/1017—Preparatory processes from tetracarboxylic acids or derivatives and diamines containing chain terminating or branching agents in the form of (mono)amine
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C08G73/1053—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067—Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
    • C08G73/1071—Wholly aromatic polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2079/00—Use of polymers having nitrogen, with or without oxygen or carbon only, in the main chain, not provided for in groups B29K2061/00 - B29K2077/00, as moulding material
    • B29K2079/08—PI, i.e. polyimides or derivatives thereof
    • B29K2079/085—Thermoplastic polyimides, e.g. polyesterimides, PEI, i.e. polyetherimides, or polyamideimides; Derivatives thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
    • C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Organic Insulating Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
CN201480030925.9A 2013-05-31 2014-05-30 电容器膜、制造方法、和由其制造的制品 Active CN105473309B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361829500P 2013-05-31 2013-05-31
US61/829,500 2013-05-31
PCT/US2014/040261 WO2014194212A1 (en) 2013-05-31 2014-05-30 Capacitor films, methods of manufacture, and articles manufactured therefrom

Publications (2)

Publication Number Publication Date
CN105473309A CN105473309A (zh) 2016-04-06
CN105473309B true CN105473309B (zh) 2018-02-02

Family

ID=51023165

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480030925.9A Active CN105473309B (zh) 2013-05-31 2014-05-30 电容器膜、制造方法、和由其制造的制品

Country Status (5)

Country Link
EP (1) EP3003686B1 (OSRAM)
JP (1) JP6329253B2 (OSRAM)
KR (2) KR102475422B1 (OSRAM)
CN (1) CN105473309B (OSRAM)
WO (1) WO2014194212A1 (OSRAM)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3245244A4 (en) * 2015-02-03 2018-06-06 SABIC Global Technologies B.V. Polyetherimide miscible polymer blends for capacitor films
CN107531901B (zh) * 2015-02-03 2020-04-17 沙特基础全球技术有限公司 用于电容器膜的聚醚酰亚胺混溶聚合物共混物
EP3397672A1 (en) 2015-12-31 2018-11-07 SABIC Global Technologies B.V. Polyetherimide compositions, methods of manufacture, and articles prepared therefrom
US20190240868A1 (en) * 2016-07-12 2019-08-08 Sabic Global Technologies B.V. Method of making an extruded thin film, thin film so produced and its use
EP3904048A4 (en) * 2018-12-27 2022-09-28 Oji Holdings Corporation Amorphous thermoplastic resin film, capacitor metalized film, film roll, and capacitor
WO2021009727A1 (en) * 2019-07-18 2021-01-21 Shpp Global Technologies B.V. Thermoplastic composition and metallized articles prepared therefrom
EP4047620A1 (de) * 2021-02-22 2022-08-24 Siemens Aktiengesellschaft Isolationssystem mit festem isolationsstoff und imprägnierharz

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3484664A (en) * 1968-11-21 1969-12-16 Hercules Inc Electrical capacitors
US3740623A (en) * 1972-01-14 1973-06-19 Trw Inc Self-healing non-metallized polystyrene capacitor
JPS59210939A (ja) * 1983-05-13 1984-11-29 Toyobo Co Ltd 架橋したポリエ−テルイミド成形物
JPH05320339A (ja) * 1992-05-15 1993-12-03 Mitsui Toatsu Chem Inc 熱安定性良好なポリイミドおよびその製造方法
JP2000071268A (ja) * 1998-08-31 2000-03-07 Du Pont Toray Co Ltd ポリイミドフィルムおよびその製造方法
US6919422B2 (en) * 2003-06-20 2005-07-19 General Electric Company Polyimide resin with reduced mold deposit
US9161440B2 (en) * 2006-06-26 2015-10-13 Sabic Global Technologies B.V. Articles comprising a polyimide solvent cast film having a low coefficient of thermal expansion and method of manufacture thereof
US20080044639A1 (en) * 2006-06-26 2008-02-21 Kwok Pong Chan Polyimide solvent cast films having a low coefficient of thermal expansion and method of manufacture thereof
US8034857B2 (en) * 2007-07-12 2011-10-11 Sabic Innovative Plastics Ip B.V. Polyetherimide/polyphenylene ether sulfone blends
JP2009173847A (ja) * 2007-12-27 2009-08-06 Toray Ind Inc 熱可塑性樹脂組成物および成形品
US8545988B2 (en) * 2008-02-25 2013-10-01 Sabic Innovative Plastics Ip B.V. Polyetherimide and polyetherimide sulfone blends having automotive lighting applications
EP2108673A1 (en) * 2008-04-11 2009-10-14 DuPont Teijin Films U.S. Limited Partnership Plastic film having a high breakdown voltage
ES2732911T3 (es) * 2011-05-12 2019-11-26 Sabic Global Technologies Bv Películas de polieterimida amorfas para condensadores, métodos de fabricación y artículos fabricados a partir de las mismas
US9127128B2 (en) * 2011-10-28 2015-09-08 Sabic Global Technologies B.V. Polyetherimides, methods of manufacture, and articles formed therefrom
US8722187B2 (en) * 2011-10-31 2014-05-13 Sabic Innovative Plastics Ip B.V. Solventless process for the preparation of amine functional polyetherimide resins with improved melt flow

Also Published As

Publication number Publication date
CN105473309A (zh) 2016-04-06
KR102475422B1 (ko) 2022-12-07
JP2016528308A (ja) 2016-09-15
KR20190141799A (ko) 2019-12-24
KR102058217B1 (ko) 2019-12-20
WO2014194212A1 (en) 2014-12-04
JP6329253B2 (ja) 2018-05-23
KR20160015201A (ko) 2016-02-12
EP3003686A1 (en) 2016-04-13
EP3003686B1 (en) 2017-12-20

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Effective date of registration: 20210317

Address after: Holland city Aupu zoom Bergen

Patentee after: High tech special engineering plastics Global Technology Co.,Ltd.

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Patentee before: Saudi Basic Global Technology Co.,Ltd.

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