KR102474471B1 - 기판 처리 장치 - Google Patents

기판 처리 장치 Download PDF

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Publication number
KR102474471B1
KR102474471B1 KR1020197030937A KR20197030937A KR102474471B1 KR 102474471 B1 KR102474471 B1 KR 102474471B1 KR 1020197030937 A KR1020197030937 A KR 1020197030937A KR 20197030937 A KR20197030937 A KR 20197030937A KR 102474471 B1 KR102474471 B1 KR 102474471B1
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KR
South Korea
Prior art keywords
substrate
polishing
distortion
processing apparatus
retainer ring
Prior art date
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Active
Application number
KR1020197030937A
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English (en)
Korean (ko)
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KR20190134665A (ko
Inventor
게이스케 나미키
마코토 후쿠시마
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20190134665A publication Critical patent/KR20190134665A/ko
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Publication of KR102474471B1 publication Critical patent/KR102474471B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
    • B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
    • B23Q15/007—Automatic control or regulation of feed movement, cutting velocity or position of tool or work while the tool acts upon the workpiece
    • B23Q15/16—Compensation for wear of the tool
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • H01L21/304—
    • H01L21/67092—
    • H01L21/67259—
    • H01L21/67294—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0468—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H10P72/0472—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0618—Apparatus for monitoring, sorting, marking, testing or measuring using identification means, e.g. labels on substrates or labels on containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/238—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Automatic Control Of Machine Tools (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020197030937A 2017-03-31 2018-01-16 기판 처리 장치 Active KR102474471B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017071573A JP6990980B2 (ja) 2017-03-31 2017-03-31 基板処理装置
JPJP-P-2017-071573 2017-03-31
PCT/JP2018/000912 WO2018179685A1 (ja) 2017-03-31 2018-01-16 基板処理装置

Publications (2)

Publication Number Publication Date
KR20190134665A KR20190134665A (ko) 2019-12-04
KR102474471B1 true KR102474471B1 (ko) 2022-12-06

Family

ID=63677702

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197030937A Active KR102474471B1 (ko) 2017-03-31 2018-01-16 기판 처리 장치

Country Status (7)

Country Link
US (1) US11969858B2 (cg-RX-API-DMAC10.html)
JP (1) JP6990980B2 (cg-RX-API-DMAC10.html)
KR (1) KR102474471B1 (cg-RX-API-DMAC10.html)
CN (1) CN110476226B (cg-RX-API-DMAC10.html)
SG (1) SG11201908780RA (cg-RX-API-DMAC10.html)
TW (1) TWI758436B (cg-RX-API-DMAC10.html)
WO (1) WO2018179685A1 (cg-RX-API-DMAC10.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102629679B1 (ko) * 2018-11-09 2024-01-29 주식회사 케이씨텍 연마 장치용 캐리어 헤드 및 이에 사용되는 멤브레인
EP3948702A4 (en) 2019-03-29 2023-07-26 Saint-Gobain Abrasives, Inc. POWER LOOP SOLUTIONS
WO2020206382A1 (en) 2019-04-03 2020-10-08 Saint-Gobain Abrasives, Inc. Abrasive article, abrasive system and method for using and forming same
JP7523269B2 (ja) * 2020-07-13 2024-07-26 株式会社荏原製作所 基板処理装置及び音響センサ用防水装置
JP2022080370A (ja) * 2020-11-18 2022-05-30 株式会社荏原製作所 基板保持装置
JP7674505B2 (ja) * 2021-03-05 2025-05-09 アプライド マテリアルズ インコーポレイテッド 保持リングを分類するための機械学習
JP7772518B2 (ja) * 2021-07-16 2025-11-18 株式会社ディスコ ウエーハの処理方法
JP7638815B2 (ja) * 2021-07-21 2025-03-04 株式会社荏原製作所 ブレークイン処理装置、およびブレークイン処理方法
TWI789926B (zh) * 2021-09-28 2023-01-11 中國砂輪企業股份有限公司 研磨系統、研磨狀態感測系統及其資料庫與方法
US20250178149A1 (en) * 2022-02-25 2025-06-05 Ebara Corporation Substrate polishing apparatus
US12564002B2 (en) * 2022-03-23 2026-02-24 Hitachi High-Tech Corporation Diagnostic device, semiconductor manufacturing equipment system, semiconductor equipment manufacturing system, and diagnostic method
JP7763140B2 (ja) * 2022-03-30 2025-10-31 株式会社荏原製作所 情報処理装置、推論装置、機械学習装置、情報処理方法、推論方法、及び、機械学習方法
JP7840206B2 (ja) * 2022-04-27 2026-04-03 株式会社荏原製作所 弾性膜の初期化装置、研磨装置、および弾性膜の初期化方法
CN118636053A (zh) * 2024-08-15 2024-09-13 杭州积海半导体有限公司 气膜、cmp研磨系统及实时检测气膜性能的方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140342640A1 (en) * 2013-05-15 2014-11-20 Kabushiki Kaisha Toshiba Polishing apparatus and polishing method

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4033632B2 (ja) 1999-02-02 2008-01-16 株式会社荏原製作所 基板把持装置及び研磨装置
JP4101403B2 (ja) 1999-06-22 2008-06-18 株式会社荏原製作所 ウェーハ研磨装置及びウェーハ製造方法
TW436382B (en) 1999-03-12 2001-05-28 Mitsubishi Materials Corp Wafer holding head, wafer polishing apparatus, and method for making wafers
US6494765B2 (en) 2000-09-25 2002-12-17 Center For Tribology, Inc. Method and apparatus for controlled polishing
JP2002219645A (ja) 2000-11-21 2002-08-06 Nikon Corp 研磨装置、この研磨装置を用いた半導体デバイス製造方法並びにこの製造方法によって製造された半導体デバイス
JP2005123485A (ja) 2003-10-17 2005-05-12 Ebara Corp 研磨装置
KR101078007B1 (ko) * 2004-06-21 2011-10-28 가부시키가이샤 에바라 세이사꾸쇼 폴리싱장치 및 폴리싱방법
US20060014475A1 (en) 2004-07-15 2006-01-19 Disco Corporation Grindstone tool
EP1975985A4 (en) 2006-01-25 2011-08-10 Jsr Corp CHEMICAL-MECHANICAL POLISHING ELEMENT AND METHOD OF MANUFACTURING THEREOF
US7840305B2 (en) * 2006-06-28 2010-11-23 3M Innovative Properties Company Abrasive articles, CMP monitoring system and method
DE102007011880A1 (de) 2007-03-13 2008-09-18 Peter Wolters Gmbh Bearbeitungsmaschine mit Mitteln zur Erfassung von Bearbeitungsparametern
JP5093652B2 (ja) 2007-06-12 2012-12-12 株式会社ニコン 研磨装置
JP5551479B2 (ja) 2010-03-19 2014-07-16 ニッタ・ハース株式会社 研磨装置、研磨パッドおよび研磨情報管理システム
JP5552401B2 (ja) 2010-09-08 2014-07-16 株式会社荏原製作所 研磨装置および方法
JP5677004B2 (ja) 2010-09-30 2015-02-25 株式会社荏原製作所 研磨装置および方法
JP5868081B2 (ja) 2011-09-05 2016-02-24 株式会社ディスコ 加工装置
JP5891127B2 (ja) 2012-07-03 2016-03-22 株式会社荏原製作所 研磨装置および研磨方法
US9105516B2 (en) 2012-07-03 2015-08-11 Ebara Corporation Polishing apparatus and polishing method
US20140020829A1 (en) 2012-07-18 2014-01-23 Applied Materials, Inc. Sensors in Carrier Head of a CMP System
KR20150085000A (ko) 2012-11-16 2015-07-22 어플라이드 머티어리얼스, 인코포레이티드 캐리어 헤드용 센서들에 의한 기록 측정들
US9454684B2 (en) 2014-05-28 2016-09-27 Taiwan Semiconductor Manufacturing Company Limited Edge crack detection system
US9878421B2 (en) 2014-06-16 2018-01-30 Applied Materials, Inc. Chemical mechanical polishing retaining ring with integrated sensor
KR101913701B1 (ko) * 2015-03-13 2018-11-02 주식회사 케이씨텍 화학 기계적 연마 장치의 캐리어 헤드
JP6557049B2 (ja) 2015-04-23 2019-08-07 株式会社ディスコ 加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140342640A1 (en) * 2013-05-15 2014-11-20 Kabushiki Kaisha Toshiba Polishing apparatus and polishing method
JP2014223684A (ja) 2013-05-15 2014-12-04 株式会社東芝 研磨装置および研磨方法

Also Published As

Publication number Publication date
US11969858B2 (en) 2024-04-30
JP2018174230A (ja) 2018-11-08
TWI758436B (zh) 2022-03-21
TW201836763A (zh) 2018-10-16
CN110476226A (zh) 2019-11-19
KR20190134665A (ko) 2019-12-04
JP6990980B2 (ja) 2022-01-12
SG11201908780RA (en) 2019-10-30
CN110476226B (zh) 2023-08-18
WO2018179685A1 (ja) 2018-10-04
US20200023487A1 (en) 2020-01-23

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