KR102473326B1 - 실리콘 상의 컬러 ｉｌｅｄ 디스플레이 - Google Patents

실리콘 상의 컬러 ｉｌｅｄ 디스플레이 Download PDF

Info

Publication number
KR102473326B1
KR102473326B1 KR1020177003260A KR20177003260A KR102473326B1 KR 102473326 B1 KR102473326 B1 KR 102473326B1 KR 1020177003260 A KR1020177003260 A KR 1020177003260A KR 20177003260 A KR20177003260 A KR 20177003260A KR 102473326 B1 KR102473326 B1 KR 102473326B1
Authority
KR
South Korea
Prior art keywords
iled
display
manufacturing
image generator
array chips
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020177003260A
Other languages
English (en)
Korean (ko)
Other versions
KR20170037975A (ko
Inventor
윌리엄 헨리
페드래그 휴스
조셉 오키프
Original Assignee
메타 플랫폼즈 테크놀로지스, 엘엘씨
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 메타 플랫폼즈 테크놀로지스, 엘엘씨 filed Critical 메타 플랫폼즈 테크놀로지스, 엘엘씨
Priority to KR1020227041469A priority Critical patent/KR20220164074A/ko
Priority to KR1020227041481A priority patent/KR20220164076A/ko
Priority to KR1020227041476A priority patent/KR20220164075A/ko
Publication of KR20170037975A publication Critical patent/KR20170037975A/ko
Application granted granted Critical
Publication of KR102473326B1 publication Critical patent/KR102473326B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H01L25/0753—
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
    • G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
    • G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
    • G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
    • G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
    • G09G3/2003—Display of colours
    • H01L27/156—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/822—Materials of the light-emitting regions
    • H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7434—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used in a transfer process involving at least two transfer steps, i.e. including an intermediate handle substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/302—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements characterised by the form or geometrical disposition of the individual elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
  • Electroluminescent Light Sources (AREA)
  • Control Of Indicators Other Than Cathode Ray Tubes (AREA)
  • Control Of El Displays (AREA)
KR1020177003260A 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이 Active KR102473326B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020227041469A KR20220164074A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041481A KR20220164076A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041476A KR20220164075A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB1413578.4 2014-07-31
GBGB1413578.4A GB201413578D0 (en) 2014-07-31 2014-07-31 A colour iled display on silicon
PCT/EP2015/067749 WO2016016460A1 (en) 2014-07-31 2015-07-31 A colour iled display on silicon

Related Child Applications (3)

Application Number Title Priority Date Filing Date
KR1020227041481A Division KR20220164076A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041469A Division KR20220164074A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041476A Division KR20220164075A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이

Publications (2)

Publication Number Publication Date
KR20170037975A KR20170037975A (ko) 2017-04-05
KR102473326B1 true KR102473326B1 (ko) 2022-12-05

Family

ID=51587531

Family Applications (4)

Application Number Title Priority Date Filing Date
KR1020177003260A Active KR102473326B1 (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041481A Abandoned KR20220164076A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041476A Abandoned KR20220164075A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041469A Abandoned KR20220164074A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이

Family Applications After (3)

Application Number Title Priority Date Filing Date
KR1020227041481A Abandoned KR20220164076A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041476A Abandoned KR20220164075A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이
KR1020227041469A Abandoned KR20220164074A (ko) 2014-07-31 2015-07-31 실리콘 상의 컬러 ｉｌｅｄ 디스플레이

Country Status (7)

Country Link
US (4) US10515580B2 (https=)
EP (2) EP3826055A1 (https=)
JP (4) JP6741649B2 (https=)
KR (4) KR102473326B1 (https=)
CN (3) CN113937093A (https=)
GB (1) GB201413578D0 (https=)
WO (1) WO2016016460A1 (https=)

Families Citing this family (86)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201413578D0 (en) 2014-07-31 2014-09-17 Infiniled Ltd A colour iled display on silicon
GB201413604D0 (en) * 2014-07-31 2014-09-17 Infiniled Ltd A colour inorganic LED display for display devices with a high number of pixel
GB201418772D0 (en) * 2014-10-22 2014-12-03 Infiniled Ltd Display
GB2586423B (en) * 2014-10-22 2021-09-01 Facebook Tech Llc Display
GB201418810D0 (en) 2014-10-22 2014-12-03 Infiniled Ltd Display
US10079264B2 (en) * 2015-12-21 2018-09-18 Hong Kong Beida Jade Bird Display Limited Semiconductor devices with integrated thin-film transistor circuitry
DE102016108776A1 (de) 2016-05-12 2017-11-16 Osram Opto Semiconductors Gmbh Optische Anordnung und Anzeigegerät
DE102016113168A1 (de) * 2016-07-18 2018-01-18 Osram Opto Semiconductors Gmbh Modul für eine videowand
US10606121B2 (en) 2016-09-12 2020-03-31 Seoul Semiconductor Co., Ltd. Display apparatus
JP7077320B2 (ja) 2016-12-09 2022-05-30 アプライド マテリアルズ インコーポレイテッド コリメートされたｌｅｄの光照射野ディスプレイ
US10438859B2 (en) 2016-12-19 2019-10-08 X-Celeprint Limited Transfer printed device repair
CN106898601A (zh) * 2017-02-15 2017-06-27 佛山市国星光电股份有限公司 三角形组合的led线路板、三角形led器件及显示屏
US10396137B2 (en) * 2017-03-10 2019-08-27 X-Celeprint Limited Testing transfer-print micro-devices on wafer
US10770440B2 (en) * 2017-03-15 2020-09-08 Globalfoundries Inc. Micro-LED display assembly
WO2018169968A1 (en) 2017-03-16 2018-09-20 Invensas Corporation Direct-bonded led arrays and applications
CN106816502B (zh) * 2017-04-12 2019-04-02 京东方科技集团股份有限公司 一种led芯片、led发光基板、显示装置及彩色显示控制方法
US10490599B2 (en) 2017-07-13 2019-11-26 Applied Materials, Inc. Collimated, directional micro-LED light field display
US10712579B1 (en) * 2017-09-20 2020-07-14 Facebook Technologies, Llc Vortex linearization of micro-LED polarization
TWI781241B (zh) * 2017-11-08 2022-10-21 美商康寧公司 用於組裝顯示區域的裝置及方法
US10836200B2 (en) 2017-11-13 2020-11-17 X Display Company Technology Limited Rigid micro-modules with ILED and light conductor
US11527519B2 (en) 2017-11-27 2022-12-13 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US12100696B2 (en) 2017-11-27 2024-09-24 Seoul Viosys Co., Ltd. Light emitting diode for display and display apparatus having the same
US11282981B2 (en) 2017-11-27 2022-03-22 Seoul Viosys Co., Ltd. Passivation covered light emitting unit stack
US10892297B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting diode (LED) stack for a display
US10892296B2 (en) 2017-11-27 2021-01-12 Seoul Viosys Co., Ltd. Light emitting device having commonly connected LED sub-units
US10748881B2 (en) 2017-12-05 2020-08-18 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US10886327B2 (en) 2017-12-14 2021-01-05 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11011503B2 (en) 2017-12-15 2021-05-18 Invensas Bonding Technologies, Inc. Direct-bonded optoelectronic interconnect for high-density integrated photonics
US11552057B2 (en) 2017-12-20 2023-01-10 Seoul Viosys Co., Ltd. LED unit for display and display apparatus having the same
US11522006B2 (en) 2017-12-21 2022-12-06 Seoul Viosys Co., Ltd. Light emitting stacked structure and display device having the same
US11552061B2 (en) 2017-12-22 2023-01-10 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US11114499B2 (en) 2018-01-02 2021-09-07 Seoul Viosys Co., Ltd. Display device having light emitting stacked structure
US10784240B2 (en) 2018-01-03 2020-09-22 Seoul Viosys Co., Ltd. Light emitting device with LED stack for display and display apparatus having the same
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
CN111837068A (zh) 2018-03-01 2020-10-27 海思智财控股有限公司 具有多重景深显像的近眼显示方法
US11256004B2 (en) 2018-03-20 2022-02-22 Invensas Bonding Technologies, Inc. Direct-bonded lamination for improved image clarity in optical devices
US11100844B2 (en) * 2018-04-25 2021-08-24 Raxium, Inc. Architecture for light emitting elements in a light field display
DE112019002238B4 (de) 2018-05-31 2024-08-08 Japan Display Inc. Anzeigevorrichtung
WO2019230229A1 (ja) 2018-05-31 2019-12-05 株式会社ジャパンディスプレイ 表示装置及びアレイ基板
JP6985983B2 (ja) 2018-05-31 2021-12-22 株式会社ジャパンディスプレイ 表示装置
WO2019230250A1 (ja) 2018-05-31 2019-12-05 株式会社ジャパンディスプレイ 表示装置及びアレイ基板
WO2019230050A1 (ja) 2018-05-31 2019-12-05 株式会社ジャパンディスプレイ 表示装置
JP7132779B2 (ja) 2018-07-18 2022-09-07 株式会社ジャパンディスプレイ 表示装置及びアレイ基板
CN112534384B (zh) 2018-07-27 2024-08-30 株式会社日本显示器 带检测装置的显示设备
RU201978U1 (ru) * 2018-08-03 2021-01-25 Акционерное общество "Завод полупроводниковых приборов" Корпус микросборки
DE102018129209B4 (de) * 2018-11-20 2022-04-14 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Multi-pixel-anzeigevorrichtung
JP7264669B2 (ja) 2019-03-01 2023-04-25 株式会社ジャパンディスプレイ 表示装置
JP7360246B2 (ja) 2019-03-14 2023-10-12 株式会社ジャパンディスプレイ 表示装置
JP7320970B2 (ja) 2019-03-28 2023-08-04 株式会社ジャパンディスプレイ 表示装置
JP7281940B2 (ja) 2019-03-28 2023-05-26 株式会社ジャパンディスプレイ 検出装置付き表示機器
JP7264694B2 (ja) 2019-03-29 2023-04-25 株式会社ジャパンディスプレイ 表示装置
JP2020166191A (ja) 2019-03-29 2020-10-08 株式会社ジャパンディスプレイ 表示装置
JP7313925B2 (ja) * 2019-06-25 2023-07-25 株式会社ジャパンディスプレイ 表示装置
JP2021026187A (ja) 2019-08-08 2021-02-22 株式会社ジャパンディスプレイ 表示装置
JP7360272B2 (ja) 2019-08-19 2023-10-12 株式会社ジャパンディスプレイ 表示装置
JP2021043373A (ja) 2019-09-12 2021-03-18 株式会社ジャパンディスプレイ 表示装置
JP2021051150A (ja) 2019-09-24 2021-04-01 株式会社ジャパンディスプレイ 表示装置の補修方法及び表示装置
JP7300949B2 (ja) 2019-09-24 2023-06-30 株式会社ジャパンディスプレイ 表示装置の補修方法
JP2021056380A (ja) 2019-09-30 2021-04-08 株式会社ジャパンディスプレイ 表示装置
JP2021056454A (ja) 2019-10-01 2021-04-08 株式会社ジャパンディスプレイ 表示装置
JP7326137B2 (ja) 2019-12-03 2023-08-15 株式会社ジャパンディスプレイ 表示装置
US11762200B2 (en) * 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
FR3104815B1 (fr) * 2019-12-17 2023-08-25 Thales Sa Dispositif d'affichage couleur comportant une mosaique de paves de micro-diodes electroluminescentes
US11355480B1 (en) * 2020-01-27 2022-06-07 Facebook Technologies, Llc Micropixellation for alignment-free assembly
US12249278B2 (en) 2020-01-28 2025-03-11 OLEDWorks LLC Stacked OLED microdisplay with low-voltage silicon backplane
US11373991B2 (en) * 2020-02-06 2022-06-28 Lumileds Llc Methods of manufacturing light-emitting devices with metal inlays and bottom contacts
JP2021153114A (ja) 2020-03-24 2021-09-30 株式会社ジャパンディスプレイ 配線基板及び表示装置
DE112021002310T5 (de) * 2020-04-13 2023-03-16 Apple Inc. Emitter hinter anzeige
KR20230005182A (ko) 2020-05-01 2023-01-09 소니 세미컨덕터 솔루션즈 가부시키가이샤 표시 장치 및 표면 실장 부품
JP2022025375A (ja) 2020-07-29 2022-02-10 株式会社ジャパンディスプレイ 表示装置
KR102249675B1 (ko) * 2020-08-25 2021-05-10 포스텍네트웍스(주) 영상 저장 fpga를 활용하며 발광 소자 단위로 보정가능한 led 전광판 제어시스템
JP2022041743A (ja) 2020-09-01 2022-03-11 株式会社ジャパンディスプレイ 発光装置及び発光装置の駆動方法
US12027648B2 (en) * 2020-09-29 2024-07-02 BOE MLED Technology Co., Ltd. Light-emitting diode chip, display substrate and manufacturing method thereof
CN114361148B (zh) * 2020-09-30 2026-01-27 Tcl科技集团股份有限公司 像素结构、灯板、显示装置及像素结构的驱动方法
DE102020130211A1 (de) * 2020-11-16 2022-05-19 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung zumindest eines optoelektronischen Halbleiterbauteils
DE102021101657B4 (de) 2021-01-26 2024-12-12 Infineon Technologies Ag Verfahren zur Herstellung eines hybriden Bauelements
CN113205760B (zh) * 2021-04-29 2023-12-01 无锡唐古半导体有限公司 硅基微显示器及其驱动电路
US20230017865A1 (en) * 2021-07-15 2023-01-19 GM Global Technology Operations LLC Full color microled display controlled by number of red green and blue leds
US12336357B2 (en) 2021-11-24 2025-06-17 Meta Platforms Technologies, Llc Alignment-free micro-display architecture
TWI778883B (zh) * 2021-12-03 2022-09-21 友達光電股份有限公司 元件陣列基板
CN115172539A (zh) * 2022-06-23 2022-10-11 深圳市兆驰光元科技有限公司 Cob显示面板的制备方法及修复方法
CN115171543B (zh) * 2022-06-27 2023-10-31 湖北长江新型显示产业创新中心有限公司 显示面板及拼接显示装置
CN120019493A (zh) * 2022-09-29 2025-05-16 三星电子株式会社 包括具有位于相邻像素中的部分的led裸片的发光装置和制作其的方法
CN115939164A (zh) * 2022-11-24 2023-04-07 深圳市思坦科技有限公司 微型led器件、微型led器件制备方法以及显示装置
WO2024211607A1 (en) * 2023-04-05 2024-10-10 Tectus Corporation Ultra-dense micro-led array with partially overlapping microlenses
KR102831649B1 (ko) * 2023-08-28 2025-07-07 한국로봇융합연구원 수중 보행 로봇용 자석발 장치

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009533810A (ja) * 2006-04-12 2009-09-17 ケンブリッジ ディスプレイ テクノロジー リミテッド 光電子ディスプレイ及びその製造方法
JP2010245557A (ja) * 2003-10-22 2010-10-28 Oki Data Corp 半導体装置の製造方法
US20140056003A1 (en) * 2012-08-20 2014-02-27 John Frattalone Modular video and lighting displays
US20140159043A1 (en) * 2012-12-10 2014-06-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
JP2014514608A (ja) * 2011-04-07 2014-06-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 表示装置

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7091986B2 (en) * 1997-09-13 2006-08-15 Gia Chuong Phan Dynamic pixel resolution, brightness and contrast for displays using spatial elements
JP3906653B2 (ja) 2000-07-18 2007-04-18 ソニー株式会社 画像表示装置及びその製造方法
JP2003084690A (ja) 2001-09-12 2003-03-19 Matsushita Electric Ind Co Ltd Ｌｅｄ表示装置
EP2326143B1 (en) * 2003-01-24 2013-04-24 Semiconductor Energy Laboratory Co., Ltd. Electronic book
US6962835B2 (en) 2003-02-07 2005-11-08 Ziptronix, Inc. Method for room temperature metal direct bonding
ATE474332T1 (de) 2003-05-02 2010-07-15 Univ College Cork Nat Univ Ie Lichtemittierende mesastrukturen mit hohem höhe- zu-breite-verhältnis und quasi-parabolischen seitenwänden und ihre herstellung
CN2741133Y (zh) 2004-09-07 2005-11-16 张艳君 可共享像素的led点阵显示模块
JP2007027157A (ja) * 2005-07-12 2007-02-01 Akita Denshi Systems:Kk 発光ダイオード装置及びその製造方法並びに照明装置
JP2007180163A (ja) 2005-12-27 2007-07-12 Samsung Electronics Co Ltd 発光デバイスモジュール
JP2008218733A (ja) 2007-03-05 2008-09-18 Mikku:Kk カラー表示用ｌｅｄパネル
KR20110039313A (ko) * 2008-07-07 2011-04-15 글로 에이비 나노구조 ｌｅｄ
JP2010024557A (ja) 2008-07-16 2010-02-04 Mitsubishi Rayon Co Ltd 仮撚加工糸及びその製造方法並びにその織編物
EP2218571A1 (en) * 2009-01-30 2010-08-18 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO Illumination system for use in a stereolithography apparatus
JP4951018B2 (ja) * 2009-03-30 2012-06-13 株式会社東芝 半導体装置の製造方法
TWI592996B (zh) 2009-05-12 2017-07-21 美國伊利諾大學理事會 用於可變形及半透明顯示器之超薄微刻度無機發光二極體之印刷總成
DE102009033915B4 (de) * 2009-07-20 2022-05-25 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung eines Leuchtmittels und Leuchtmittel
WO2011071559A1 (en) 2009-12-09 2011-06-16 Nano And Advanced Materials Institute Limited Method for manufacturing a monolithic led micro-display on an active matrix panel using flip-chip technology and display apparatus having the monolithic led micro-display
US20130278631A1 (en) * 2010-02-28 2013-10-24 Osterhout Group, Inc. 3d positioning of augmented reality information
US8835903B2 (en) 2010-07-29 2014-09-16 National Tsing Hua University Light-emitting diode display and method of producing the same
JP5966412B2 (ja) 2011-04-08 2016-08-10 ソニー株式会社 画素チップ、表示パネル、照明パネル、表示装置および照明装置
CN102903804B (zh) 2011-07-25 2015-12-16 财团法人工业技术研究院 发光元件的转移方法以及发光元件阵列
US9620478B2 (en) * 2011-11-18 2017-04-11 Apple Inc. Method of fabricating a micro device transfer head
US9368546B2 (en) 2012-02-15 2016-06-14 Microsoft Technology Licensing, Llc Imaging structure with embedded light sources
GB201215632D0 (en) 2012-09-03 2012-10-17 Infiniled Ltd Optical device
US9153171B2 (en) 2012-12-17 2015-10-06 LuxVue Technology Corporation Smart pixel lighting and display microcontroller
GB201413578D0 (en) * 2014-07-31 2014-09-17 Infiniled Ltd A colour iled display on silicon

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010245557A (ja) * 2003-10-22 2010-10-28 Oki Data Corp 半導体装置の製造方法
JP2009533810A (ja) * 2006-04-12 2009-09-17 ケンブリッジ ディスプレイ テクノロジー リミテッド 光電子ディスプレイ及びその製造方法
JP2014514608A (ja) * 2011-04-07 2014-06-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング 表示装置
US20140056003A1 (en) * 2012-08-20 2014-02-27 John Frattalone Modular video and lighting displays
US20140159043A1 (en) * 2012-12-10 2014-06-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines

Also Published As

Publication number Publication date
GB201413578D0 (en) 2014-09-17
US20210217356A1 (en) 2021-07-15
JP2017529557A (ja) 2017-10-05
JP6741649B2 (ja) 2020-08-19
US20200126477A1 (en) 2020-04-23
JP7004777B2 (ja) 2022-01-21
CN107078132A (zh) 2017-08-18
US10515580B2 (en) 2019-12-24
US11244605B2 (en) 2022-02-08
US10984705B2 (en) 2021-04-20
JP2023088953A (ja) 2023-06-27
KR20220164076A (ko) 2022-12-12
JP2022058485A (ja) 2022-04-12
US20220148495A1 (en) 2022-05-12
JP7473702B2 (ja) 2024-04-23
KR20220164074A (ko) 2022-12-12
WO2016016460A1 (en) 2016-02-04
CN113937093A (zh) 2022-01-14
CN113937092A (zh) 2022-01-14
EP3175482B1 (en) 2021-05-19
EP3826055A1 (en) 2021-05-26
JP7248828B2 (ja) 2023-03-29
US11468830B2 (en) 2022-10-11
KR20170037975A (ko) 2017-04-05
EP3175482A1 (en) 2017-06-07
US20170213502A1 (en) 2017-07-27
KR20220164075A (ko) 2022-12-12
JP2021005087A (ja) 2021-01-14
CN107078132B (zh) 2021-11-05

Similar Documents

Publication Publication Date Title
JP7248828B2 (ja) シリコン上のカラーｉｌｅｄディスプレイ
KR102769799B1 (ko) 발광 장치
CN107078148B (zh) 用于具有高像素数的显示装置的彩色无机led显示器
TW201820303A (zh) 具有整合微反射器之微顯示面板
CN113972196A (zh) 显示器、用于其的led芯片、像素、控制法、计算机程序
JP2023504666A (ja) 表示装置

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

D14-X000 Search report completed

St.27 status event code: A-1-2-D10-D14-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E90F Notification of reason for final refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

E13-X000 Pre-grant limitation requested

St.27 status event code: A-2-3-E10-E13-lim-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PN2301 Change of applicant

St.27 status event code: A-3-3-R10-R13-asn-PN2301

St.27 status event code: A-3-3-R10-R11-asn-PN2301

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

A107 Divisional application of patent
PA0104 Divisional application for international application

St.27 status event code: A-0-1-A10-A18-div-PA0104

St.27 status event code: A-0-1-A10-A16-div-PA0104

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000