KR102454462B1 - 척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치 - Google Patents

척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치 Download PDF

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Publication number
KR102454462B1
KR102454462B1 KR1020170148537A KR20170148537A KR102454462B1 KR 102454462 B1 KR102454462 B1 KR 102454462B1 KR 1020170148537 A KR1020170148537 A KR 1020170148537A KR 20170148537 A KR20170148537 A KR 20170148537A KR 102454462 B1 KR102454462 B1 KR 102454462B1
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KR
South Korea
Prior art keywords
plate
vacuum
chuck
heating
wafer
Prior art date
Application number
KR1020170148537A
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English (en)
Korean (ko)
Other versions
KR20190052802A (ko
Inventor
남성용
정인영
Original Assignee
주식회사 미코세라믹스
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 미코세라믹스 filed Critical 주식회사 미코세라믹스
Priority to KR1020170148537A priority Critical patent/KR102454462B1/ko
Priority to TW107118330A priority patent/TWI796335B/zh
Priority to SG11202004112PA priority patent/SG11202004112PA/en
Priority to CN201880072948.4A priority patent/CN111344855B/zh
Priority to PCT/KR2018/006277 priority patent/WO2019093609A1/ko
Publication of KR20190052802A publication Critical patent/KR20190052802A/ko
Application granted granted Critical
Publication of KR102454462B1 publication Critical patent/KR102454462B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Pencils And Projecting And Retracting Systems Therefor, And Multi-System Writing Instruments (AREA)
  • Adornments (AREA)
KR1020170148537A 2017-11-09 2017-11-09 척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치 KR102454462B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020170148537A KR102454462B1 (ko) 2017-11-09 2017-11-09 척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치
TW107118330A TWI796335B (zh) 2017-11-09 2018-05-29 卡盤板、具有該卡盤板的卡盤結構物及具有卡盤結構物的焊接裝置
SG11202004112PA SG11202004112PA (en) 2017-11-09 2018-06-01 Chuck plate, chuck structure having chuck plate, and bonding device having chuck structure
CN201880072948.4A CN111344855B (zh) 2017-11-09 2018-06-01 卡盘板、具有所述卡盘板的卡盘结构物及具有卡盘结构物的焊接装置
PCT/KR2018/006277 WO2019093609A1 (ko) 2017-11-09 2018-06-01 척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020170148537A KR102454462B1 (ko) 2017-11-09 2017-11-09 척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치

Publications (2)

Publication Number Publication Date
KR20190052802A KR20190052802A (ko) 2019-05-17
KR102454462B1 true KR102454462B1 (ko) 2022-10-14

Family

ID=66437854

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020170148537A KR102454462B1 (ko) 2017-11-09 2017-11-09 척 플레이트, 상기 척 플레이트를 갖는 척 구조물 및 척 구조물을 갖는 본딩 장치

Country Status (5)

Country Link
KR (1) KR102454462B1 (zh)
CN (1) CN111344855B (zh)
SG (1) SG11202004112PA (zh)
TW (1) TWI796335B (zh)
WO (1) WO2019093609A1 (zh)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102498914B1 (ko) * 2020-12-08 2023-02-13 주식회사 미코세라믹스 본딩 헤드 및 이를 갖는 본딩 장치
CN112563185B (zh) * 2021-02-20 2021-06-08 北京中硅泰克精密技术有限公司 静电卡盘及半导体加工设备
CN114393468B (zh) * 2021-12-29 2023-03-10 江苏威森美微电子有限公司 一种半导体晶圆磨边加工用磨边机
CN115332129B (zh) * 2022-10-17 2023-02-21 宁波润华全芯微电子设备有限公司 一种晶圆增粘装置
CN116666321B (zh) * 2023-07-25 2023-10-27 天津中科晶禾电子科技有限责任公司 一种温度保持装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101593833B1 (ko) * 2014-10-17 2016-02-12 세메스 주식회사 기판 히팅 유닛 및 이를 포함하는 다이 본딩 장치

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US6108189A (en) * 1996-04-26 2000-08-22 Applied Materials, Inc. Electrostatic chuck having improved gas conduits
US6529362B2 (en) * 1997-03-06 2003-03-04 Applied Materials Inc. Monocrystalline ceramic electrostatic chuck
JP2001267403A (ja) * 2000-03-21 2001-09-28 Nhk Spring Co Ltd 半導体ウェハの加熱／冷却装置
JP2005279788A (ja) * 2004-03-26 2005-10-13 Ibiden Co Ltd 研削・研磨用真空チャック
JP4497103B2 (ja) * 2006-02-21 2010-07-07 住友電気工業株式会社 ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ
KR101369437B1 (ko) * 2007-08-20 2014-03-04 세메스 주식회사 기판 가열 장치
KR101057118B1 (ko) * 2009-03-31 2011-08-16 피에스케이 주식회사 기판 처리 장치 및 방법
US9022392B2 (en) * 2012-08-31 2015-05-05 United Microelectronics Corporation Chuck and semiconductor process using the same
CH707480B1 (de) * 2013-01-21 2016-08-31 Besi Switzerland Ag Bondkopf mit einem heiz- und kühlbaren Saugorgan.
KR101543864B1 (ko) * 2013-11-13 2015-08-11 세메스 주식회사 본딩 헤드 및 이를 포함하는 다이 본딩 장치
KR101593557B1 (ko) * 2014-03-25 2016-02-16 한국생산기술연구원 하이브리드 정전척 및 그 제조방법
JP6373811B2 (ja) * 2015-09-08 2018-08-15 東芝メモリ株式会社 半導体装置の製造方法および製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101593833B1 (ko) * 2014-10-17 2016-02-12 세메스 주식회사 기판 히팅 유닛 및 이를 포함하는 다이 본딩 장치

Also Published As

Publication number Publication date
TW201919146A (zh) 2019-05-16
CN111344855A (zh) 2020-06-26
TWI796335B (zh) 2023-03-21
KR20190052802A (ko) 2019-05-17
SG11202004112PA (en) 2020-06-29
CN111344855B (zh) 2024-06-11
WO2019093609A1 (ko) 2019-05-16

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