KR102453678B1 - 발광소자 및 그의 제작방법 - Google Patents
발광소자 및 그의 제작방법 Download PDFInfo
- Publication number
- KR102453678B1 KR102453678B1 KR1020190019950A KR20190019950A KR102453678B1 KR 102453678 B1 KR102453678 B1 KR 102453678B1 KR 1020190019950 A KR1020190019950 A KR 1020190019950A KR 20190019950 A KR20190019950 A KR 20190019950A KR 102453678 B1 KR102453678 B1 KR 102453678B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- light emitting
- wavelength conversion
- light
- barrier layer
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
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- H01L33/50—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H01L33/06—
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- H01L33/10—
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- H01L33/46—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/814—Bodies having reflecting means, e.g. semiconductor Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/036—Manufacture or treatment of packages
- H10H20/0364—Manufacture or treatment of packages of interconnections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/872—Periodic patterns for optical field-shaping, e.g. photonic bandgap structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/882—Scattering means
Landscapes
- Led Device Packages (AREA)
- Optical Filters (AREA)
- Vehicle Body Suspensions (AREA)
- Control Of El Displays (AREA)
- Control Of Motors That Do Not Use Commutators (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
- Led Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862632732P | 2018-02-20 | 2018-02-20 | |
| US62/632,732 | 2018-02-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20190100076A KR20190100076A (ko) | 2019-08-28 |
| KR102453678B1 true KR102453678B1 (ko) | 2022-10-11 |
Family
ID=67481530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020190019950A Active KR102453678B1 (ko) | 2018-02-20 | 2019-02-20 | 발광소자 및 그의 제작방법 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US10833233B2 (https=) |
| JP (1) | JP7224201B2 (https=) |
| KR (1) | KR102453678B1 (https=) |
| CN (2) | CN110176529B (https=) |
| DE (1) | DE102019104268A1 (https=) |
| TW (3) | TWI797259B (https=) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102551354B1 (ko) * | 2018-04-20 | 2023-07-04 | 삼성전자 주식회사 | 반도체 발광 소자 및 그 제조 방법 |
| TWI800548B (zh) * | 2018-11-06 | 2023-05-01 | 晶元光電股份有限公司 | 發光裝置及其製作方法 |
| CN112635640A (zh) * | 2020-12-14 | 2021-04-09 | 深圳信息职业技术学院 | 量子点发光器件及其制备方法与应用 |
| TWI811625B (zh) * | 2021-01-29 | 2023-08-11 | 台灣愛司帝科技股份有限公司 | 晶片移轉方法、晶片移轉裝置以及影像顯示器 |
| JP2024512205A (ja) * | 2021-02-05 | 2024-03-19 | ユニベルシテイト ゲント | カプセル化によって囲まれたコアを含むカプセル化された材料のポケットを調製する方法 |
| JP7401809B2 (ja) * | 2021-09-29 | 2023-12-20 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
| EP4160704B1 (en) * | 2021-09-29 | 2024-12-18 | Nichia Corporation | Light emitting device and method of manufacturing light emitting device |
| CN114300586B (zh) * | 2021-12-29 | 2024-03-29 | 深圳市思坦科技有限公司 | 一种发光器件制备方法、发光器件及显示装置 |
| CN117153995A (zh) * | 2023-10-30 | 2023-12-01 | 罗化芯显示科技开发(江苏)有限公司 | 一种led封装膜层及led封装结构 |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173754A (ja) | 2005-11-28 | 2007-07-05 | Kyocera Corp | 波長変換器および発光装置 |
| JP2007294890A (ja) * | 2006-03-31 | 2007-11-08 | Toshiba Lighting & Technology Corp | 発光装置 |
| US20080211386A1 (en) | 2006-12-26 | 2008-09-04 | Seoul Semiconductor Co., Ltd. | Light emitting device |
| JP2010258469A (ja) | 2008-09-03 | 2010-11-11 | Samsung Electro-Mechanics Co Ltd | 量子点波長変換体、量子点波長変換体の製造方法及び量子点波長変換体を含む発光装置 |
| US20110303940A1 (en) | 2010-06-14 | 2011-12-15 | Hyo Jin Lee | Light emitting device package using quantum dot, illumination apparatus and display apparatus |
| JP2013032516A (ja) * | 2011-07-05 | 2013-02-14 | Dexerials Corp | 蛍光体シート形成用樹脂組成物 |
| US20160104825A1 (en) | 2014-10-08 | 2016-04-14 | Lg Display Co., Ltd. | Led package, backlight unit and liquid crystal display device |
| US20170005245A1 (en) | 2015-07-02 | 2017-01-05 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Light Emitting Diode Package Structure and Fabrication Method |
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| JP4172196B2 (ja) * | 2002-04-05 | 2008-10-29 | 豊田合成株式会社 | 発光ダイオード |
| JP3707688B2 (ja) * | 2002-05-31 | 2005-10-19 | スタンレー電気株式会社 | 発光装置およびその製造方法 |
| US7772609B2 (en) * | 2004-10-29 | 2010-08-10 | Ledengin, Inc. (Cayman) | LED package with structure and materials for high heat dissipation |
| JP3872490B2 (ja) * | 2004-12-24 | 2007-01-24 | 京セラ株式会社 | 発光素子収納パッケージ、発光装置および照明装置 |
| KR100924474B1 (ko) * | 2005-03-24 | 2009-11-03 | 쿄세라 코포레이션 | 발광장치 |
| JP2007288139A (ja) * | 2006-03-24 | 2007-11-01 | Sumitomo Chemical Co Ltd | モノシリック発光デバイス及びその駆動方法 |
| WO2009094799A1 (en) * | 2008-01-23 | 2009-08-06 | Helio Optoelectronics Corporation | A base structure for led that has no halo |
| TWI478370B (zh) * | 2008-08-29 | 2015-03-21 | 晶元光電股份有限公司 | 一具有波長轉換結構之半導體發光裝置及其封裝結構 |
| JP5431706B2 (ja) | 2008-10-01 | 2014-03-05 | ミネベア株式会社 | 発光装置 |
| JP5377985B2 (ja) * | 2009-01-13 | 2013-12-25 | 株式会社東芝 | 半導体発光素子 |
| KR100986336B1 (ko) * | 2009-10-22 | 2010-10-08 | 엘지이노텍 주식회사 | 발광소자, 발광소자 제조방법 및 발광소자 패키지 |
| EP3547380B1 (en) * | 2010-02-09 | 2023-12-20 | Nichia Corporation | Light emitting device |
| KR101251821B1 (ko) * | 2011-09-15 | 2013-04-09 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| US9115868B2 (en) * | 2011-10-13 | 2015-08-25 | Intematix Corporation | Wavelength conversion component with improved protective characteristics for remote wavelength conversion |
| KR101686572B1 (ko) * | 2011-10-21 | 2016-12-15 | 삼성전자 주식회사 | 발광 소자 |
| JP5889646B2 (ja) | 2012-01-26 | 2016-03-22 | シャープ株式会社 | 蛍光体板、蛍光体板を用いた発光装置及び蛍光体板の製造方法 |
| DE102012102119A1 (de) * | 2012-03-13 | 2013-09-19 | Osram Opto Semiconductors Gmbh | Flächenlichtquelle |
| CN103152932A (zh) * | 2013-04-21 | 2013-06-12 | 杭州乐图光电科技有限公司 | 一种可调光可调色温的led驱动电路 |
| KR102084039B1 (ko) | 2013-07-02 | 2020-03-04 | 삼성디스플레이 주식회사 | 광원 유닛, 그것의 제조 방법, 및 그것을 포함하는 백라이트 유닛 |
| CN105684170B (zh) * | 2013-08-09 | 2019-09-03 | 株式会社光波 | 发光装置 |
| KR20150035065A (ko) * | 2013-09-27 | 2015-04-06 | 삼성전자주식회사 | 불소계 형광체를 사용한 표시 장치 |
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| TWI583019B (zh) * | 2015-02-17 | 2017-05-11 | 新世紀光電股份有限公司 | Light emitting diode and manufacturing method thereof |
| CN105006508B (zh) * | 2015-07-02 | 2017-07-25 | 厦门市三安光电科技有限公司 | 发光二极管封装结构 |
| CN204923802U (zh) * | 2015-09-09 | 2015-12-30 | 宁波天海制冷设备有限公司 | 谷物干燥机用热泵 |
| JP6459880B2 (ja) * | 2015-09-30 | 2019-01-30 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| TWI677114B (zh) * | 2015-10-05 | 2019-11-11 | 行家光電股份有限公司 | 具導角反射結構的發光裝置 |
| JP6500255B2 (ja) * | 2015-10-15 | 2019-04-17 | 豊田合成株式会社 | 発光装置の製造方法 |
| CN106816520A (zh) | 2015-11-30 | 2017-06-09 | 隆达电子股份有限公司 | 波长转换材料及其应用 |
| KR102407777B1 (ko) * | 2016-02-04 | 2022-06-10 | 에피스타 코포레이션 | 발광소자 및 그의 제조방법 |
| DE102016103463A1 (de) * | 2016-02-26 | 2017-08-31 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| US10825970B2 (en) * | 2016-02-26 | 2020-11-03 | Epistar Corporation | Light-emitting device with wavelength conversion structure |
| JP6711021B2 (ja) * | 2016-03-02 | 2020-06-17 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
| EP3491679B1 (en) * | 2016-07-26 | 2023-02-22 | CreeLED, Inc. | Light emitting diodes, components and related methods |
| CN107706281B (zh) * | 2016-08-09 | 2019-07-19 | 行家光电股份有限公司 | 具湿气阻隔结构的晶片级封装发光装置 |
| KR102674066B1 (ko) * | 2016-11-11 | 2024-06-13 | 삼성전자주식회사 | 발광 소자 패키지 |
| KR102680862B1 (ko) * | 2016-12-16 | 2024-07-03 | 삼성전자주식회사 | 반도체 발광장치 |
| KR102754224B1 (ko) * | 2017-01-09 | 2025-01-10 | 삼성전자주식회사 | 발광 소자 패키지, 그 제조 방법, 발광 소자 패키지를 포함하는 백라이트 유닛, 및 표시 장치 |
| CN106876561A (zh) * | 2017-03-14 | 2017-06-20 | 河北利福光电技术有限公司 | 一种远程荧光粉封装结构及其实现方法 |
| JP6966691B2 (ja) * | 2017-05-31 | 2021-11-17 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
| KR102389815B1 (ko) * | 2017-06-05 | 2022-04-22 | 삼성전자주식회사 | 양자점 유리셀 및 이를 포함하는 발광소자 패키지 |
| KR102401826B1 (ko) * | 2017-09-15 | 2022-05-25 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광소자 패키지 및 이를 포함하는 조명장치 |
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2019
- 2019-02-20 DE DE102019104268.2A patent/DE102019104268A1/de not_active Withdrawn
- 2019-02-20 KR KR1020190019950A patent/KR102453678B1/ko active Active
- 2019-02-20 TW TW108105645A patent/TWI797259B/zh active
- 2019-02-20 TW TW111127725A patent/TWI794127B/zh not_active IP Right Cessation
- 2019-02-20 CN CN201910126438.7A patent/CN110176529B/zh not_active Expired - Fee Related
- 2019-02-20 TW TW108105622A patent/TWI774927B/zh not_active IP Right Cessation
- 2019-02-20 CN CN202210151896.8A patent/CN114613896A/zh active Pending
- 2019-02-20 US US16/280,465 patent/US10833233B2/en active Active
- 2019-02-20 JP JP2019028489A patent/JP7224201B2/ja active Active
-
2020
- 2020-10-01 US US17/060,772 patent/US11430925B2/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173754A (ja) | 2005-11-28 | 2007-07-05 | Kyocera Corp | 波長変換器および発光装置 |
| JP2007294890A (ja) * | 2006-03-31 | 2007-11-08 | Toshiba Lighting & Technology Corp | 発光装置 |
| US20080211386A1 (en) | 2006-12-26 | 2008-09-04 | Seoul Semiconductor Co., Ltd. | Light emitting device |
| JP2010258469A (ja) | 2008-09-03 | 2010-11-11 | Samsung Electro-Mechanics Co Ltd | 量子点波長変換体、量子点波長変換体の製造方法及び量子点波長変換体を含む発光装置 |
| US20110303940A1 (en) | 2010-06-14 | 2011-12-15 | Hyo Jin Lee | Light emitting device package using quantum dot, illumination apparatus and display apparatus |
| JP2013032516A (ja) * | 2011-07-05 | 2013-02-14 | Dexerials Corp | 蛍光体シート形成用樹脂組成物 |
| US20160104825A1 (en) | 2014-10-08 | 2016-04-14 | Lg Display Co., Ltd. | Led package, backlight unit and liquid crystal display device |
| US20170005245A1 (en) | 2015-07-02 | 2017-01-05 | Xiamen Sanan Optoelectronics Technology Co., Ltd. | Light Emitting Diode Package Structure and Fabrication Method |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202249305A (zh) | 2022-12-16 |
| CN114613896A (zh) | 2022-06-10 |
| JP2019145794A (ja) | 2019-08-29 |
| TWI797259B (zh) | 2023-04-01 |
| US20190259922A1 (en) | 2019-08-22 |
| US20210020815A1 (en) | 2021-01-21 |
| DE102019104268A1 (de) | 2019-08-22 |
| US10833233B2 (en) | 2020-11-10 |
| TWI774927B (zh) | 2022-08-21 |
| US11430925B2 (en) | 2022-08-30 |
| KR20190100076A (ko) | 2019-08-28 |
| TWI794127B (zh) | 2023-02-21 |
| TW201935716A (zh) | 2019-09-01 |
| JP7224201B2 (ja) | 2023-02-17 |
| TW201935714A (zh) | 2019-09-01 |
| CN110176529B (zh) | 2022-03-08 |
| CN110176529A (zh) | 2019-08-27 |
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