TWI800548B - 發光裝置及其製作方法 - Google Patents
發光裝置及其製作方法 Download PDFInfo
- Publication number
- TWI800548B TWI800548B TW107139285A TW107139285A TWI800548B TW I800548 B TWI800548 B TW I800548B TW 107139285 A TW107139285 A TW 107139285A TW 107139285 A TW107139285 A TW 107139285A TW I800548 B TWI800548 B TW I800548B
- Authority
- TW
- Taiwan
- Prior art keywords
- manufacturing
- light
- emitting device
- emitting
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107139285A TWI800548B (zh) | 2018-11-06 | 2018-11-06 | 發光裝置及其製作方法 |
CN201910383209.3A CN111146323A (zh) | 2018-11-06 | 2019-05-09 | 发光装置及其制作方法 |
US16/674,463 US11374154B2 (en) | 2018-11-06 | 2019-11-05 | Light-emitting device and manufacturing method thereof |
US17/850,549 US20220328734A1 (en) | 2018-11-06 | 2022-06-27 | Light-emitting device and manufacturing method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW107139285A TWI800548B (zh) | 2018-11-06 | 2018-11-06 | 發光裝置及其製作方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202018966A TW202018966A (zh) | 2020-05-16 |
TWI800548B true TWI800548B (zh) | 2023-05-01 |
Family
ID=70458719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107139285A TWI800548B (zh) | 2018-11-06 | 2018-11-06 | 發光裝置及其製作方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US11374154B2 (zh) |
CN (1) | CN111146323A (zh) |
TW (1) | TWI800548B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111584584B (zh) * | 2020-05-15 | 2023-12-05 | Tcl华星光电技术有限公司 | 显示面板及显示装置 |
JP2022068684A (ja) * | 2020-10-22 | 2022-05-10 | スタンレー電気株式会社 | 半導体発光装置及び半導体発光モジュール |
TWI744139B (zh) * | 2020-12-16 | 2021-10-21 | 隆達電子股份有限公司 | 二極體封裝結構及其製造方法 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140117396A1 (en) * | 2011-05-18 | 2014-05-01 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component |
US20150364639A1 (en) * | 2014-06-16 | 2015-12-17 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor light emitting device package |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101686572B1 (ko) * | 2011-10-21 | 2016-12-15 | 삼성전자 주식회사 | 발광 소자 |
JP5620562B1 (ja) * | 2013-10-23 | 2014-11-05 | 株式会社光波 | 単結晶蛍光体及び発光装置 |
US9660151B2 (en) * | 2014-05-21 | 2017-05-23 | Nichia Corporation | Method for manufacturing light emitting device |
JP6711021B2 (ja) * | 2016-03-02 | 2020-06-17 | 日亜化学工業株式会社 | 発光装置及びその製造方法 |
DE102016109308B4 (de) * | 2016-05-20 | 2024-01-18 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Strahlungsemittierendes bauelement |
KR20180082041A (ko) * | 2017-01-09 | 2018-07-18 | 삼성전자주식회사 | 발광 소자 패키지, 그 제조 방법, 발광 소자 패키지를 포함하는 백라이트 유닛, 및 표시 장치 |
US10522728B2 (en) * | 2017-01-26 | 2019-12-31 | Maven Optronics Co., Ltd. | Beveled chip reflector for chip-scale packaging light-emitting device and manufacturing method of the same |
JP6733646B2 (ja) * | 2017-11-30 | 2020-08-05 | 日亜化学工業株式会社 | 発光装置とその製造方法 |
CN110176529B (zh) * | 2018-02-20 | 2022-03-08 | 晶元光电股份有限公司 | 发光元件及其制作方法 |
JP7227458B2 (ja) * | 2018-11-21 | 2023-02-22 | 日亜化学工業株式会社 | 発光装置 |
-
2018
- 2018-11-06 TW TW107139285A patent/TWI800548B/zh active
-
2019
- 2019-05-09 CN CN201910383209.3A patent/CN111146323A/zh active Pending
- 2019-11-05 US US16/674,463 patent/US11374154B2/en active Active
-
2022
- 2022-06-27 US US17/850,549 patent/US20220328734A1/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20140117396A1 (en) * | 2011-05-18 | 2014-05-01 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip, optoelectronic semiconductor component, and a method for producing an optoelectronic semiconductor component |
US20150364639A1 (en) * | 2014-06-16 | 2015-12-17 | Samsung Electronics Co., Ltd. | Method of manufacturing semiconductor light emitting device package |
Also Published As
Publication number | Publication date |
---|---|
US20220328734A1 (en) | 2022-10-13 |
US20200144462A1 (en) | 2020-05-07 |
US11374154B2 (en) | 2022-06-28 |
TW202018966A (zh) | 2020-05-16 |
CN111146323A (zh) | 2020-05-12 |
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