KR102445111B1 - 반도체 장치 및 반도체 장치의 제조 방법 - Google Patents

반도체 장치 및 반도체 장치의 제조 방법 Download PDF

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KR102445111B1
KR102445111B1 KR1020207036261A KR20207036261A KR102445111B1 KR 102445111 B1 KR102445111 B1 KR 102445111B1 KR 1020207036261 A KR1020207036261 A KR 1020207036261A KR 20207036261 A KR20207036261 A KR 20207036261A KR 102445111 B1 KR102445111 B1 KR 102445111B1
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semiconductor device
conductive
conductive heat
heat
conducting member
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KR20210010554A (ko
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유스케 쿠보
세르게이 볼로토프
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데쿠세리아루즈 가부시키가이샤
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737—Organic materials with or without a thermoconductive filler
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3731—Ceramic materials or glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Layout of the interconnection structure
    • H01L23/5286—Arrangements of power or ground buses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15313—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a land array, e.g. LGA

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Geometry (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Bipolar Transistors (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Noodles (AREA)
KR1020207036261A 2018-06-21 2019-06-19 반도체 장치 및 반도체 장치의 제조 방법 Active KR102445111B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2018-118082 2018-06-21
JP2018118082A JP7265321B2 (ja) 2018-06-21 2018-06-21 半導体装置及び半導体装置の製造方法
PCT/JP2019/024366 WO2019244953A1 (ja) 2018-06-21 2019-06-19 半導体装置及び半導体装置の製造方法

Publications (2)

Publication Number Publication Date
KR20210010554A KR20210010554A (ko) 2021-01-27
KR102445111B1 true KR102445111B1 (ko) 2022-09-21

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KR1020207036261A Active KR102445111B1 (ko) 2018-06-21 2019-06-19 반도체 장치 및 반도체 장치의 제조 방법

Country Status (5)

Country Link
US (1) US11929303B2 (OSRAM)
JP (1) JP7265321B2 (OSRAM)
KR (1) KR102445111B1 (OSRAM)
CN (1) CN112243534B (OSRAM)
WO (1) WO2019244953A1 (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11277545B2 (en) * 2020-02-27 2022-03-15 Gopro, Inc. Heatsink of an image capture device
KR102318858B1 (ko) * 2020-02-27 2021-10-29 조인셋 주식회사 전자파 차폐 및 열전달을 위한 실드 장치의 실장 구조
WO2022158474A1 (ja) * 2021-01-19 2022-07-28 ベジ 佐々木 電子装置及び製品
US12316932B2 (en) 2023-08-11 2025-05-27 Gopro, Inc. Adjustable thermal solution

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166641A (ja) 2007-01-04 2008-07-17 Oita Univ 熱伝導性及び電気伝導性を有する電磁シールド用の膨張化炭素繊維複合材料とその製造方法
WO2013035819A1 (ja) * 2011-09-08 2013-03-14 株式会社村田製作所 電子部品モジュール及び該電子部品モジュールの製造方法
JP2017038086A (ja) * 2014-10-31 2017-02-16 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP2018073897A (ja) 2016-10-26 2018-05-10 リンテック株式会社 電波吸収体、半導体装置および複合シート

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11317592A (ja) * 1998-05-07 1999-11-16 Porimatec Kk 熱伝導性電磁波シールドシート
FR2799883B1 (fr) * 1999-10-15 2003-05-30 Thomson Csf Procede d'encapsulation de composants electroniques
JP2001210761A (ja) * 2000-01-24 2001-08-03 Shinko Electric Ind Co Ltd 半導体装置及びその製造方法
JP2002026178A (ja) 2000-07-04 2002-01-25 Hitachi Ltd 半導体装置及びその製造方法並びに電子装置
JP2012164852A (ja) 2011-02-08 2012-08-30 Murata Mfg Co Ltd 半導体パッケージのシールド構造
JP6268086B2 (ja) * 2012-06-15 2018-01-24 株式会社カネカ 放熱構造体
JP6846641B2 (ja) 2015-05-28 2021-03-24 積水ポリマテック株式会社 熱伝導性シート
KR102424402B1 (ko) * 2015-08-13 2022-07-25 삼성전자주식회사 반도체 패키지 및 그 제조방법
JP6704229B2 (ja) 2015-09-14 2020-06-03 リンテック オブ アメリカ インコーポレーテッドＬｉｎｔｅｃ ｏｆ Ａｍｅｒｉｃａ， Ｉｎｃ． 柔軟性シート、熱伝導部材、導電性部材、帯電防止部材、発熱体、電磁波遮蔽体、及び柔軟性シートの製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008166641A (ja) 2007-01-04 2008-07-17 Oita Univ 熱伝導性及び電気伝導性を有する電磁シールド用の膨張化炭素繊維複合材料とその製造方法
WO2013035819A1 (ja) * 2011-09-08 2013-03-14 株式会社村田製作所 電子部品モジュール及び該電子部品モジュールの製造方法
JP2017038086A (ja) * 2014-10-31 2017-02-16 デクセリアルズ株式会社 熱伝導シート、熱伝導シートの製造方法、放熱部材及び半導体装置
JP2018073897A (ja) 2016-10-26 2018-05-10 リンテック株式会社 電波吸収体、半導体装置および複合シート

Also Published As

Publication number Publication date
JP2019220615A (ja) 2019-12-26
CN112243534B (zh) 2025-11-18
JP7265321B2 (ja) 2023-04-26
CN112243534A (zh) 2021-01-19
KR20210010554A (ko) 2021-01-27
US20210272879A1 (en) 2021-09-02
WO2019244953A1 (ja) 2019-12-26
US11929303B2 (en) 2024-03-12

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