KR102433494B1 - 단일 출구-플로우 방향을 갖는 버퍼 스테이션 - Google Patents

단일 출구-플로우 방향을 갖는 버퍼 스테이션 Download PDF

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Publication number
KR102433494B1
KR102433494B1 KR1020150143025A KR20150143025A KR102433494B1 KR 102433494 B1 KR102433494 B1 KR 102433494B1 KR 1020150143025 A KR1020150143025 A KR 1020150143025A KR 20150143025 A KR20150143025 A KR 20150143025A KR 102433494 B1 KR102433494 B1 KR 102433494B1
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buffer
wafer
purge gas
support
support pins
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KR20160048655A (ko
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마틴 로버트 마라신
리차드 하워드 굴드
데릭 존 위트코위키
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램 리써치 코포레이션
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
    • H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020150143025A 2014-10-24 2015-10-13 단일 출구-플로우 방향을 갖는 버퍼 스테이션 Active KR102433494B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/523,122 US9881826B2 (en) 2014-10-24 2014-10-24 Buffer station with single exit-flow direction
US14/523,122 2014-10-24

Publications (2)

Publication Number Publication Date
KR20160048655A KR20160048655A (ko) 2016-05-04
KR102433494B1 true KR102433494B1 (ko) 2022-08-17

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ID=55792562

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KR1020150143025A Active KR102433494B1 (ko) 2014-10-24 2015-10-13 단일 출구-플로우 방향을 갖는 버퍼 스테이션

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Country Link
US (2) US9881826B2 (enExample)
JP (1) JP6590632B2 (enExample)
KR (1) KR102433494B1 (enExample)
TW (1) TWI682482B (enExample)

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JP6532466B2 (ja) * 2014-07-25 2019-06-19 信越ポリマー株式会社 基板収納容器
KR101670382B1 (ko) * 2015-03-10 2016-10-28 우범제 퍼지가스 분사 플레이트 및 그 제조 방법
KR101637498B1 (ko) * 2015-03-24 2016-07-07 피코앤테라(주) 웨이퍼 수납용기
US10531362B2 (en) * 2015-03-25 2020-01-07 Lg Electronics Inc. Method and apparatus for preforming initial access based on the ACDC category in a wireless access system
KR20180001999A (ko) * 2016-06-28 2018-01-05 테크-샘 아게 개선된 기판 스토리지 및 프로세싱
KR102323354B1 (ko) * 2016-07-06 2021-11-09 우범제 웨이퍼 수납용기
KR101865636B1 (ko) * 2016-07-06 2018-06-08 우범제 웨이퍼 수납용기
KR102729711B1 (ko) * 2016-12-23 2024-11-13 피코앤테라(주) 이에프이엠
KR101868001B1 (ko) * 2017-03-22 2018-06-15 우범제 퓸 제거 장치
US10388547B2 (en) 2017-06-23 2019-08-20 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for processing substrates
KR102360219B1 (ko) 2017-06-23 2022-02-08 어플라이드 머티어리얼스, 인코포레이티드 인덱서블 측면 저장 포드 장치, 가열식 측면 저장 포드 장치, 시스템들, 및 방법들
KR102066175B1 (ko) * 2017-12-28 2020-01-14 우범제 웨이퍼 수납용기
KR102512478B1 (ko) * 2018-03-13 2023-03-22 우범제 웨이퍼 수납용기
JP7136612B2 (ja) * 2018-07-13 2022-09-13 ローツェ株式会社 局所パージ機能を有する搬送装置
WO2020046867A1 (en) * 2018-08-28 2020-03-05 Entegris, Inc. Membrane diffuser for a substrate container
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US11508593B2 (en) * 2018-10-26 2022-11-22 Applied Materials, Inc. Side storage pods, electronic device processing systems, and methods for operating the same
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US11189511B2 (en) * 2018-10-26 2021-11-30 Applied Materials, Inc. Side storage pods, equipment front end modules, and methods for operating EFEMs
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NL2022185B1 (nl) * 2018-12-12 2020-07-02 Suss Microtec Lithography Gmbh Substratkassette
KR102283311B1 (ko) * 2019-01-07 2021-07-29 피코앤테라(주) 웨이퍼 수납용기
KR102217711B1 (ko) * 2019-07-09 2021-02-22 주식회사 에이케이테크 사이드 스토리지용 배기 유닛
KR102259282B1 (ko) * 2019-07-18 2021-06-01 세메스 주식회사 물류 저장 시스템 및 그 제어 방법
JP7156547B2 (ja) * 2019-09-02 2022-10-19 村田機械株式会社 ウェハ受渡装置、ウェハ貯蔵容器、及びウェハ貯蔵システム
EP4115445A4 (en) * 2020-03-06 2024-04-17 Entegris, Inc. DISTRIBUTOR FOR A SUBSTRATE CONTAINER
CN114313543A (zh) * 2020-09-30 2022-04-12 长鑫存储技术有限公司 传送盒及物料传送系统
KR102701757B1 (ko) * 2021-04-27 2024-09-02 우범제 웨이퍼 수납용기
KR102528927B1 (ko) * 2021-05-07 2023-05-03 피코앤테라(주) 웨이퍼 수납용기
TWI824554B (zh) * 2021-06-08 2023-12-01 美商恩特葛瑞斯股份有限公司 晶圓容器及潔淨系統
US12347711B2 (en) 2021-08-17 2025-07-01 Gudeng Precision Industrial Co., Ltd. Gas diffusion device, and wafer container including the same
US12394635B2 (en) * 2021-08-27 2025-08-19 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for processing a substrate
US12009242B2 (en) * 2021-08-30 2024-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transport container
CN114121742A (zh) * 2021-10-09 2022-03-01 长江存储科技有限责任公司 设备前端模块、半导体工艺处理机台及处理方法
CN114334755A (zh) * 2021-12-31 2022-04-12 拓荆科技股份有限公司 用于降低晶圆温度的装置
KR102780012B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102780011B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
WO2023175743A1 (ja) * 2022-03-15 2023-09-21 株式会社日立ハイテク 真空処理装置
KR20250026173A (ko) * 2022-06-24 2025-02-25 미라이얼 가부시키가이샤 기판수납용기 및 리어 리테이너
JP7712903B2 (ja) * 2022-08-02 2025-07-24 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラム及び基板処理方法
JP7745522B2 (ja) * 2022-08-30 2025-09-29 株式会社ダイフク 搬送車
KR102787225B1 (ko) * 2022-09-28 2025-03-28 주식회사 저스템 버퍼 챔버 노즐 장치 및 이를 구비한 반도체 공정장치
KR102800028B1 (ko) * 2023-06-22 2025-04-28 (주) 예스티 사이드 스토리지
KR20250079346A (ko) * 2023-11-27 2025-06-04 삼성전자주식회사 웨이퍼 컨테이너
CN117410223B (zh) * 2023-12-14 2024-03-12 浙江果纳半导体技术有限公司 一种晶圆缓存机构、晶圆传输装置和传输方法
WO2025205176A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 搬送装置及び給気方法

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Also Published As

Publication number Publication date
US20160118282A1 (en) 2016-04-28
JP2016086161A (ja) 2016-05-19
KR20160048655A (ko) 2016-05-04
JP6590632B2 (ja) 2019-10-16
TWI682482B (zh) 2020-01-11
TW201628118A (zh) 2016-08-01
US10297480B2 (en) 2019-05-21
US20180144965A1 (en) 2018-05-24
US9881826B2 (en) 2018-01-30

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