JP6590632B2 - 排出流の方向が単一のバッファステーション - Google Patents

排出流の方向が単一のバッファステーション Download PDF

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Publication number
JP6590632B2
JP6590632B2 JP2015205143A JP2015205143A JP6590632B2 JP 6590632 B2 JP6590632 B2 JP 6590632B2 JP 2015205143 A JP2015205143 A JP 2015205143A JP 2015205143 A JP2015205143 A JP 2015205143A JP 6590632 B2 JP6590632 B2 JP 6590632B2
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buffer
wafer
support
purge gas
fins
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JP2015205143A
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JP2016086161A (ja
JP2016086161A5 (enExample
Inventor
マーチン・ロバート・マラスキン
リチャード・ハワード・グールド
デレク・ジョン・ウィトコウィッキ
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Lam Research Corp
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Lam Research Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015205143A 2014-10-24 2015-10-19 排出流の方向が単一のバッファステーション Active JP6590632B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US14/523,122 US9881826B2 (en) 2014-10-24 2014-10-24 Buffer station with single exit-flow direction
US14/523,122 2014-10-24

Publications (3)

Publication Number Publication Date
JP2016086161A JP2016086161A (ja) 2016-05-19
JP2016086161A5 JP2016086161A5 (enExample) 2018-12-27
JP6590632B2 true JP6590632B2 (ja) 2019-10-16

Family

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Family Applications (1)

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JP2015205143A Active JP6590632B2 (ja) 2014-10-24 2015-10-19 排出流の方向が単一のバッファステーション

Country Status (4)

Country Link
US (2) US9881826B2 (enExample)
JP (1) JP6590632B2 (enExample)
KR (1) KR102433494B1 (enExample)
TW (1) TWI682482B (enExample)

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KR102066175B1 (ko) * 2017-12-28 2020-01-14 우범제 웨이퍼 수납용기
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US11508593B2 (en) * 2018-10-26 2022-11-22 Applied Materials, Inc. Side storage pods, electronic device processing systems, and methods for operating the same
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KR102217711B1 (ko) * 2019-07-09 2021-02-22 주식회사 에이케이테크 사이드 스토리지용 배기 유닛
KR102259282B1 (ko) * 2019-07-18 2021-06-01 세메스 주식회사 물류 저장 시스템 및 그 제어 방법
JP7156547B2 (ja) * 2019-09-02 2022-10-19 村田機械株式会社 ウェハ受渡装置、ウェハ貯蔵容器、及びウェハ貯蔵システム
EP4115445A4 (en) * 2020-03-06 2024-04-17 Entegris, Inc. DISTRIBUTOR FOR A SUBSTRATE CONTAINER
CN114313543A (zh) * 2020-09-30 2022-04-12 长鑫存储技术有限公司 传送盒及物料传送系统
KR102701757B1 (ko) * 2021-04-27 2024-09-02 우범제 웨이퍼 수납용기
KR102528927B1 (ko) * 2021-05-07 2023-05-03 피코앤테라(주) 웨이퍼 수납용기
TWI824554B (zh) * 2021-06-08 2023-12-01 美商恩特葛瑞斯股份有限公司 晶圓容器及潔淨系統
US12347711B2 (en) 2021-08-17 2025-07-01 Gudeng Precision Industrial Co., Ltd. Gas diffusion device, and wafer container including the same
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US12009242B2 (en) * 2021-08-30 2024-06-11 Taiwan Semiconductor Manufacturing Company, Ltd. Wafer transport container
CN114121742A (zh) * 2021-10-09 2022-03-01 长江存储科技有限责任公司 设备前端模块、半导体工艺处理机台及处理方法
CN114334755A (zh) * 2021-12-31 2022-04-12 拓荆科技股份有限公司 用于降低晶圆温度的装置
KR102780012B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
KR102780011B1 (ko) * 2022-02-09 2025-03-12 주식회사 저스템 Efem의 버퍼 챔버 장치 및 이를 구비한 반도체 공정장치
WO2023175743A1 (ja) * 2022-03-15 2023-09-21 株式会社日立ハイテク 真空処理装置
KR20250026173A (ko) * 2022-06-24 2025-02-25 미라이얼 가부시키가이샤 기판수납용기 및 리어 리테이너
JP7712903B2 (ja) * 2022-08-02 2025-07-24 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、プログラム及び基板処理方法
JP7745522B2 (ja) * 2022-08-30 2025-09-29 株式会社ダイフク 搬送車
KR102787225B1 (ko) * 2022-09-28 2025-03-28 주식회사 저스템 버퍼 챔버 노즐 장치 및 이를 구비한 반도체 공정장치
KR102800028B1 (ko) * 2023-06-22 2025-04-28 (주) 예스티 사이드 스토리지
KR20250079346A (ko) * 2023-11-27 2025-06-04 삼성전자주식회사 웨이퍼 컨테이너
CN117410223B (zh) * 2023-12-14 2024-03-12 浙江果纳半导体技术有限公司 一种晶圆缓存机构、晶圆传输装置和传输方法
WO2025205176A1 (ja) * 2024-03-29 2025-10-02 東京エレクトロン株式会社 搬送装置及び給気方法

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Also Published As

Publication number Publication date
US20160118282A1 (en) 2016-04-28
JP2016086161A (ja) 2016-05-19
KR20160048655A (ko) 2016-05-04
TWI682482B (zh) 2020-01-11
TW201628118A (zh) 2016-08-01
US10297480B2 (en) 2019-05-21
KR102433494B1 (ko) 2022-08-17
US20180144965A1 (en) 2018-05-24
US9881826B2 (en) 2018-01-30

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