KR102412598B1 - 전자파 차폐 필름 - Google Patents

전자파 차폐 필름 Download PDF

Info

Publication number
KR102412598B1
KR102412598B1 KR1020190003915A KR20190003915A KR102412598B1 KR 102412598 B1 KR102412598 B1 KR 102412598B1 KR 1020190003915 A KR1020190003915 A KR 1020190003915A KR 20190003915 A KR20190003915 A KR 20190003915A KR 102412598 B1 KR102412598 B1 KR 102412598B1
Authority
KR
South Korea
Prior art keywords
film
protective layer
layer
insulating protective
resin
Prior art date
Application number
KR1020190003915A
Other languages
English (en)
Korean (ko)
Other versions
KR20190086391A (ko
Inventor
시게카즈 우메무라
마사히로 와타나베
Original Assignee
타츠타 전선 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20190086391A publication Critical patent/KR20190086391A/ko
Application granted granted Critical
Publication of KR102412598B1 publication Critical patent/KR102412598B1/ko

Links

Images

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/06Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/36Layered products comprising a layer of synthetic resin comprising polyesters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B33/00Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02Physical, chemical or physicochemical properties
    • B32B7/023Optical properties
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/12Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/281Applying non-metallic protective coatings by means of a preformed insulating foil
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/206Insulating
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/212Electromagnetic interference shielding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/40Properties of the layers or laminate having particular optical properties
    • B32B2307/406Bright, glossy, shiny surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00Electrical equipment
    • B32B2457/08PCBs, i.e. printed circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Structure Of Printed Boards (AREA)
KR1020190003915A 2018-01-12 2019-01-11 전자파 차폐 필름 KR102412598B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2018-003474 2018-01-12
JP2018003474A JP6863908B2 (ja) 2018-01-12 2018-01-12 電磁波シールドフィルム

Publications (2)

Publication Number Publication Date
KR20190086391A KR20190086391A (ko) 2019-07-22
KR102412598B1 true KR102412598B1 (ko) 2022-06-22

Family

ID=67235535

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190003915A KR102412598B1 (ko) 2018-01-12 2019-01-11 전자파 차폐 필름

Country Status (4)

Country Link
JP (1) JP6863908B2 (zh)
KR (1) KR102412598B1 (zh)
CN (1) CN110027268B (zh)
TW (1) TWI829647B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730395B (zh) * 2019-09-04 2021-06-11 同泰電子科技股份有限公司 電磁干擾屏蔽結構、具有電磁干擾屏蔽結構的軟性電路板及其製造方法
WO2021141067A1 (ja) * 2020-01-07 2021-07-15 タツタ電線株式会社 電磁波シールドフィルム
WO2021141098A1 (ja) 2020-01-09 2021-07-15 タツタ電線株式会社 形状転写フィルム
CN111491441B (zh) 2020-04-23 2021-10-26 京东方科技集团股份有限公司 电路板结构和显示设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016063117A (ja) * 2014-09-19 2016-04-25 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれら製造方法
WO2017138638A1 (ja) * 2016-02-12 2017-08-17 タツタ電線株式会社 電磁波シールドフィルム

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4135096A1 (de) * 1991-10-24 1993-04-29 Hoechst Ag Siegelbare, matte biaxial orientierte polyolefin-mehrschichtfolie, verfahren zu ihrer herstellung und ihre verwendung
JP4330320B2 (ja) * 2002-09-27 2009-09-16 大日本印刷株式会社 マット層形成用組成物およびそれを用いた離型シート
WO2014077406A1 (ja) * 2012-11-19 2014-05-22 タツタ電線株式会社 積層フィルム及びシールドプリント配線板
JP6229409B2 (ja) * 2013-09-30 2017-11-15 東レ株式会社 離型用二軸配向ポリエステルフィルム
JP5796690B1 (ja) * 2015-02-02 2015-10-21 東洋インキScホールディングス株式会社 電磁波シールドシートおよびプリント配線板
CN105120643B (zh) * 2015-06-30 2019-04-19 保定乐凯新材料股份有限公司 一种用于快速加工的热塑性电磁波屏蔽膜

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016063117A (ja) * 2014-09-19 2016-04-25 信越ポリマー株式会社 電磁波シールドフィルム、電磁波シールドフィルム付きフレキシブルプリント配線板、およびそれら製造方法
WO2017138638A1 (ja) * 2016-02-12 2017-08-17 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
CN110027268A (zh) 2019-07-19
TW201930513A (zh) 2019-08-01
JP2019125618A (ja) 2019-07-25
CN110027268B (zh) 2022-02-01
KR20190086391A (ko) 2019-07-22
TWI829647B (zh) 2024-01-21
JP6863908B2 (ja) 2021-04-21

Similar Documents

Publication Publication Date Title
KR102412598B1 (ko) 전자파 차폐 필름
KR102567422B1 (ko) 전자파 실드 필름
KR102385691B1 (ko) 전자파 차폐 필름
JP6722370B2 (ja) プリント配線基板用貼付フィルム
KR102432750B1 (ko) 전자파 차폐 필름
KR102339942B1 (ko) 전자파 차폐필름
US11098227B2 (en) Conductive adhesive
KR102386508B1 (ko) 전자파 차폐 필름
KR102475690B1 (ko) 프린트 배선 기판용 접착 필름
WO2020085316A1 (ja) 導電性接着シート
KR102385690B1 (ko) 전자파 차폐 필름
CN112586096B (zh) 印制线路基材用贴附膜
KR102352852B1 (ko) 전자파 차폐 필름
TW202313328A (zh) 電磁波屏蔽膜

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant