KR102408618B1 - 발광 소자 패키지 및 이를 포함하는 조명 장치 - Google Patents

발광 소자 패키지 및 이를 포함하는 조명 장치 Download PDF

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KR102408618B1
KR102408618B1 KR1020150023223A KR20150023223A KR102408618B1 KR 102408618 B1 KR102408618 B1 KR 102408618B1 KR 1020150023223 A KR1020150023223 A KR 1020150023223A KR 20150023223 A KR20150023223 A KR 20150023223A KR 102408618 B1 KR102408618 B1 KR 102408618B1
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light emitting
emitting device
light
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device package
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KR20160100601A (ko
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문지욱
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쑤저우 레킨 세미컨덕터 컴퍼니 리미티드
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Priority to KR1020150023223A priority Critical patent/KR102408618B1/ko
Priority to JP2016018529A priority patent/JP7113407B2/ja
Priority to EP16154900.1A priority patent/EP3057131B1/en
Priority to US15/043,122 priority patent/US20160240750A1/en
Priority to CN201610087811.9A priority patent/CN105895779A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H01L33/50—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
    • H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/81—Bodies
    • H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
KR1020150023223A 2015-02-16 2015-02-16 발광 소자 패키지 및 이를 포함하는 조명 장치 Active KR102408618B1 (ko)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020150023223A KR102408618B1 (ko) 2015-02-16 2015-02-16 발광 소자 패키지 및 이를 포함하는 조명 장치
JP2016018529A JP7113407B2 (ja) 2015-02-16 2016-02-03 発光素子パッケージ及びそれを含む照明システム
EP16154900.1A EP3057131B1 (en) 2015-02-16 2016-02-09 Light-emitting device package and lighting apparatus including the same
US15/043,122 US20160240750A1 (en) 2015-02-16 2016-02-12 Light-emitting device package and lighting apparatus including the same
CN201610087811.9A CN105895779A (zh) 2015-02-16 2016-02-16 发光器件封装和包含发光器件封装的照明装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150023223A KR102408618B1 (ko) 2015-02-16 2015-02-16 발광 소자 패키지 및 이를 포함하는 조명 장치

Publications (2)

Publication Number Publication Date
KR20160100601A KR20160100601A (ko) 2016-08-24
KR102408618B1 true KR102408618B1 (ko) 2022-06-14

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Country Link
US (1) US20160240750A1 (enExample)
EP (1) EP3057131B1 (enExample)
JP (1) JP7113407B2 (enExample)
KR (1) KR102408618B1 (enExample)
CN (1) CN105895779A (enExample)

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KR20180032063A (ko) * 2016-09-21 2018-03-29 서울반도체 주식회사 발광 다이오드 패키지 및 발광 다이오드 모듈
JP6583203B2 (ja) * 2016-09-30 2019-10-02 日亜化学工業株式会社 発光装置及び発光装置の製造方法
AU2017376110B2 (en) * 2016-12-14 2020-06-11 Pivotal Software, Inc. Distributed validation of credentials
KR102432218B1 (ko) * 2017-05-19 2022-08-12 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 형광체, 발광 소자 패키지 및 이를 포함하는 조명 장치
KR102452484B1 (ko) * 2017-08-11 2022-10-11 삼성전자주식회사 발광소자 패키지 및 발광소자 패키지 모듈
JP7064129B2 (ja) 2017-12-22 2022-05-10 日亜化学工業株式会社 発光装置
TWI703357B (zh) * 2019-05-21 2020-09-01 榮創能源科技股份有限公司 光源裝置及顯示器
CN111986565A (zh) * 2019-05-21 2020-11-24 展晶科技(深圳)有限公司 光源装置及显示器
CN112289910B (zh) * 2020-10-19 2021-06-25 刘成禹 Led无级调色温光源及其制造工艺

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JP2013511846A (ja) 2009-11-19 2013-04-04 インテマティックス・コーポレーション 高ｃｒｉ白色発光デバイス及び駆動回路
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JP2007112973A (ja) * 2005-02-23 2007-05-10 Mitsubishi Chemicals Corp 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス
KR100771772B1 (ko) * 2006-08-25 2007-10-30 삼성전기주식회사 백색 ｌｅｄ 모듈
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JP2013511846A (ja) 2009-11-19 2013-04-04 インテマティックス・コーポレーション 高ｃｒｉ白色発光デバイス及び駆動回路
WO2014068440A1 (en) * 2012-11-01 2014-05-08 Koninklijke Philips Electronics N.V. Led-based device with wide color gamut
JP2015028148A (ja) 2013-07-03 2015-02-12 日亜化学工業株式会社 フッ化物蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法

Also Published As

Publication number Publication date
EP3057131A1 (en) 2016-08-17
CN105895779A (zh) 2016-08-24
EP3057131B1 (en) 2020-06-17
US20160240750A1 (en) 2016-08-18
JP7113407B2 (ja) 2022-08-05
JP2016152413A (ja) 2016-08-22
KR20160100601A (ko) 2016-08-24

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