KR102408618B1 - 발광 소자 패키지 및 이를 포함하는 조명 장치 - Google Patents
발광 소자 패키지 및 이를 포함하는 조명 장치 Download PDFInfo
- Publication number
- KR102408618B1 KR102408618B1 KR1020150023223A KR20150023223A KR102408618B1 KR 102408618 B1 KR102408618 B1 KR 102408618B1 KR 1020150023223 A KR1020150023223 A KR 1020150023223A KR 20150023223 A KR20150023223 A KR 20150023223A KR 102408618 B1 KR102408618 B1 KR 102408618B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- emitting device
- light
- delete delete
- device package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
-
- H01L33/50—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00
- H01L25/0753—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10D, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H10H20/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
- H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
- Luminescent Compositions (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150023223A KR102408618B1 (ko) | 2015-02-16 | 2015-02-16 | 발광 소자 패키지 및 이를 포함하는 조명 장치 |
| JP2016018529A JP7113407B2 (ja) | 2015-02-16 | 2016-02-03 | 発光素子パッケージ及びそれを含む照明システム |
| EP16154900.1A EP3057131B1 (en) | 2015-02-16 | 2016-02-09 | Light-emitting device package and lighting apparatus including the same |
| US15/043,122 US20160240750A1 (en) | 2015-02-16 | 2016-02-12 | Light-emitting device package and lighting apparatus including the same |
| CN201610087811.9A CN105895779A (zh) | 2015-02-16 | 2016-02-16 | 发光器件封装和包含发光器件封装的照明装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020150023223A KR102408618B1 (ko) | 2015-02-16 | 2015-02-16 | 발광 소자 패키지 및 이를 포함하는 조명 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160100601A KR20160100601A (ko) | 2016-08-24 |
| KR102408618B1 true KR102408618B1 (ko) | 2022-06-14 |
Family
ID=55456576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020150023223A Active KR102408618B1 (ko) | 2015-02-16 | 2015-02-16 | 발광 소자 패키지 및 이를 포함하는 조명 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20160240750A1 (cg-RX-API-DMAC7.html) |
| EP (1) | EP3057131B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7113407B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102408618B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN105895779A (cg-RX-API-DMAC7.html) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20180032063A (ko) * | 2016-09-21 | 2018-03-29 | 서울반도체 주식회사 | 발광 다이오드 패키지 및 발광 다이오드 모듈 |
| JP6583203B2 (ja) | 2016-09-30 | 2019-10-02 | 日亜化学工業株式会社 | 発光装置及び発光装置の製造方法 |
| JP6765537B2 (ja) * | 2016-12-14 | 2020-10-07 | ピヴォタル・ソフトウェア・インコーポレーテッド | 資格情報の分散型検証 |
| KR102432218B1 (ko) * | 2017-05-19 | 2022-08-12 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 형광체, 발광 소자 패키지 및 이를 포함하는 조명 장치 |
| KR102452484B1 (ko) * | 2017-08-11 | 2022-10-11 | 삼성전자주식회사 | 발광소자 패키지 및 발광소자 패키지 모듈 |
| JP7064129B2 (ja) * | 2017-12-22 | 2022-05-10 | 日亜化学工業株式会社 | 発光装置 |
| TWI703357B (zh) * | 2019-05-21 | 2020-09-01 | 榮創能源科技股份有限公司 | 光源裝置及顯示器 |
| CN111986565A (zh) * | 2019-05-21 | 2020-11-24 | 展晶科技(深圳)有限公司 | 光源装置及显示器 |
| CN112289910B (zh) * | 2020-10-19 | 2021-06-25 | 刘成禹 | Led无级调色温光源及其制造工艺 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007112973A (ja) * | 2005-02-23 | 2007-05-10 | Mitsubishi Chemicals Corp | 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス |
| KR100771772B1 (ko) * | 2006-08-25 | 2007-10-30 | 삼성전기주식회사 | 백색 led 모듈 |
| JP2010209311A (ja) * | 2008-09-05 | 2010-09-24 | Mitsubishi Chemicals Corp | 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置 |
| JP2013511846A (ja) | 2009-11-19 | 2013-04-04 | インテマティックス・コーポレーション | 高cri白色発光デバイス及び駆動回路 |
| WO2014068440A1 (en) * | 2012-11-01 | 2014-05-08 | Koninklijke Philips Electronics N.V. | Led-based device with wide color gamut |
| JP2015028148A (ja) | 2013-07-03 | 2015-02-12 | 日亜化学工業株式会社 | フッ化物蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW558775B (en) * | 2002-06-27 | 2003-10-21 | Solidlite Corp | Package of compound type LED |
| KR20050113200A (ko) * | 2003-02-26 | 2005-12-01 | 크리, 인코포레이티드 | 복합 백색 광원 및 그 제조 방법 |
| JP5081370B2 (ja) * | 2004-08-31 | 2012-11-28 | 日亜化学工業株式会社 | 発光装置 |
| JP4679183B2 (ja) | 2005-03-07 | 2011-04-27 | シチズン電子株式会社 | 発光装置及び照明装置 |
| KR101200400B1 (ko) | 2005-12-01 | 2012-11-16 | 삼성전자주식회사 | 백색 발광 다이오드 |
| JP2007173397A (ja) | 2005-12-20 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 発光モジュールとこれを用いた表示装置及び照明装置 |
| US7800315B2 (en) * | 2007-09-21 | 2010-09-21 | Exclara, Inc. | System and method for regulation of solid state lighting |
| KR101476421B1 (ko) | 2008-03-31 | 2014-12-26 | 서울반도체 주식회사 | 백라이트 유닛 |
| JP2010034183A (ja) * | 2008-07-28 | 2010-02-12 | Citizen Electronics Co Ltd | 発光装置 |
| TW201115788A (en) * | 2009-10-30 | 2011-05-01 | Kingbright Electronics Co Ltd | Improved white light LED lighting device |
| JP2011228673A (ja) * | 2010-03-30 | 2011-11-10 | Mitsubishi Chemicals Corp | 発光装置 |
| KR101039994B1 (ko) * | 2010-05-24 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자 및 이를 구비한 라이트 유닛 |
| JP2010258479A (ja) | 2010-08-16 | 2010-11-11 | Citizen Electronics Co Ltd | 発光装置 |
| JP5799212B2 (ja) * | 2010-09-21 | 2015-10-21 | パナソニックIpマネジメント株式会社 | 発光モジュール、バックライト装置および表示装置 |
| US8252613B1 (en) | 2011-03-23 | 2012-08-28 | General Electric Company | Color stable manganese-doped phosphors |
| JP5418548B2 (ja) * | 2011-07-06 | 2014-02-19 | 日亜化学工業株式会社 | フッ化物蛍光体及びそのフッ化物蛍光体を用いた発光装置 |
| KR102087270B1 (ko) * | 2012-12-28 | 2020-03-10 | 신에쓰 가가꾸 고교 가부시끼가이샤 | 파장 변환 부재 및 발광 장치 |
| TWI509844B (zh) * | 2014-09-19 | 2015-11-21 | 東貝光電科技股份有限公司 | Applied to the backlight of the LED light-emitting structure |
-
2015
- 2015-02-16 KR KR1020150023223A patent/KR102408618B1/ko active Active
-
2016
- 2016-02-03 JP JP2016018529A patent/JP7113407B2/ja active Active
- 2016-02-09 EP EP16154900.1A patent/EP3057131B1/en active Active
- 2016-02-12 US US15/043,122 patent/US20160240750A1/en not_active Abandoned
- 2016-02-16 CN CN201610087811.9A patent/CN105895779A/zh active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007112973A (ja) * | 2005-02-23 | 2007-05-10 | Mitsubishi Chemicals Corp | 半導体発光デバイス用部材及びその製造方法、並びにそれを用いた半導体発光デバイス |
| KR100771772B1 (ko) * | 2006-08-25 | 2007-10-30 | 삼성전기주식회사 | 백색 led 모듈 |
| JP2013225708A (ja) | 2006-08-25 | 2013-10-31 | Samsung Electronics Co Ltd | 白色ledモジュールおよびこれを用いたバックライトユニット |
| JP2010209311A (ja) * | 2008-09-05 | 2010-09-24 | Mitsubishi Chemicals Corp | 蛍光体及びその製造方法と、その蛍光体を用いた蛍光体含有組成物及び発光装置、並びに、その発光装置を用いた画像表示装置及び照明装置 |
| JP2013511846A (ja) | 2009-11-19 | 2013-04-04 | インテマティックス・コーポレーション | 高cri白色発光デバイス及び駆動回路 |
| WO2014068440A1 (en) * | 2012-11-01 | 2014-05-08 | Koninklijke Philips Electronics N.V. | Led-based device with wide color gamut |
| JP2015028148A (ja) | 2013-07-03 | 2015-02-12 | 日亜化学工業株式会社 | フッ化物蛍光体及びそれを用いた発光装置並びに蛍光体の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20160100601A (ko) | 2016-08-24 |
| EP3057131B1 (en) | 2020-06-17 |
| JP2016152413A (ja) | 2016-08-22 |
| EP3057131A1 (en) | 2016-08-17 |
| JP7113407B2 (ja) | 2022-08-05 |
| CN105895779A (zh) | 2016-08-24 |
| US20160240750A1 (en) | 2016-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102408618B1 (ko) | 발광 소자 패키지 및 이를 포함하는 조명 장치 | |
| JP6542509B2 (ja) | 蛍光体及びそれを含む発光素子パッケージ | |
| KR102578085B1 (ko) | 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치 | |
| US20170335186A1 (en) | Fluorescent composition, a light emitting element package comprising same, and an illuminating device | |
| US10263154B2 (en) | Light-emitting device and light-emitting device package comprising same | |
| US10385266B2 (en) | Phosphor composition, light emitting element package comprising same, and lighting system | |
| KR102401828B1 (ko) | 발광소자 패키지 | |
| KR102671113B1 (ko) | 형광체 조성물, 이를 포함하는 발광 소자 패키지 및 조명 장치 | |
| KR102409189B1 (ko) | 형광체 구조물, 이를 포함하는 발광 소자 패키지 및 조명 장치 | |
| KR20170058775A (ko) | 발광소자 패키지 | |
| KR102261954B1 (ko) | 형광체 필름, 이를 포함하는 발광 소자 패키지 및 조명 장치 | |
| KR102131309B1 (ko) | 형광체 및 이를 포함하는 발광소자 패키지 | |
| KR102432218B1 (ko) | 형광체, 발광 소자 패키지 및 이를 포함하는 조명 장치 | |
| KR102372022B1 (ko) | 발광 소자 | |
| KR20170085307A (ko) | 발광소자 패키지 | |
| US10236427B2 (en) | Light emitting device package | |
| KR102087942B1 (ko) | 조명 장치 | |
| KR20180137237A (ko) | 식물 생장용 형광체, 이를 포함하는 발광 소자 패키지 및 조명 장치 | |
| KR20170058777A (ko) | 발광소자 패키지 | |
| KR20170124285A (ko) | 발광소자 패키지 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0109 | Patent application |
Patent event code: PA01091R01D Comment text: Patent Application Patent event date: 20150216 |
|
| PG1501 | Laying open of application | ||
| AMND | Amendment | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20200116 Comment text: Request for Examination of Application Patent event code: PA02011R01I Patent event date: 20150216 Comment text: Patent Application |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20210303 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| PN2301 | Change of applicant |
Patent event date: 20210702 Comment text: Notification of Change of Applicant Patent event code: PN23011R01D |
|
| E601 | Decision to refuse application | ||
| PE0601 | Decision on rejection of patent |
Patent event date: 20210907 Comment text: Decision to Refuse Application Patent event code: PE06012S01D Patent event date: 20210303 Comment text: Notification of reason for refusal Patent event code: PE06011S01I |
|
| X091 | Application refused [patent] | ||
| AMND | Amendment | ||
| PX0901 | Re-examination |
Patent event code: PX09011S01I Patent event date: 20210907 Comment text: Decision to Refuse Application Patent event code: PX09012R01I Patent event date: 20210402 Comment text: Amendment to Specification, etc. Patent event code: PX09012R01I Patent event date: 20200116 Comment text: Amendment to Specification, etc. |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
Comment text: Notification of reason for refusal Patent event date: 20211029 Patent event code: PE09021S01D |
|
| AMND | Amendment | ||
| PX0701 | Decision of registration after re-examination |
Patent event date: 20220418 Comment text: Decision to Grant Registration Patent event code: PX07013S01D Patent event date: 20211229 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20211006 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20210907 Comment text: Decision to Refuse Application Patent event code: PX07011S01I Patent event date: 20210402 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I Patent event date: 20200116 Comment text: Amendment to Specification, etc. Patent event code: PX07012R01I |
|
| X701 | Decision to grant (after re-examination) | ||
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20220609 Patent event code: PR07011E01D |
|
| PR1002 | Payment of registration fee |
Payment date: 20220610 End annual number: 3 Start annual number: 1 |
|
| PG1601 | Publication of registration |