KR102404622B1 - 형광체 조성물, 형광체 시트 및 그들을 사용한 형성물, led 칩, led 패키지, 발광 장치, 백라이트 유닛, 디스플레이 및 led 패키지의 제조 방법 - Google Patents

형광체 조성물, 형광체 시트 및 그들을 사용한 형성물, led 칩, led 패키지, 발광 장치, 백라이트 유닛, 디스플레이 및 led 패키지의 제조 방법 Download PDF

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KR102404622B1
KR102404622B1 KR1020187005201A KR20187005201A KR102404622B1 KR 102404622 B1 KR102404622 B1 KR 102404622B1 KR 1020187005201 A KR1020187005201 A KR 1020187005201A KR 20187005201 A KR20187005201 A KR 20187005201A KR 102404622 B1 KR102404622 B1 KR 102404622B1
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group
phosphor
general formula
organic compound
light emitting
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KR1020187005201A
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Korean (ko)
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KR20180061146A (ko
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유타카 이시다
마사아키 우메하라
다이사쿠 다나카
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도레이 카부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/06—Luminescent, e.g. electroluminescent, chemiluminescent materials containing organic luminescent materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/02—Use of particular materials as binders, particle coatings or suspension media therefor
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7704—Halogenides
    • C09K11/7705—Halogenides with alkali or alkaline earth metals
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7706—Aluminates
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00—Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77—Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/77068—Silicon Aluminium Nitrides or Silicon Aluminium Oxynitrides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/08—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Led Device Packages (AREA)
  • Luminescent Compositions (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020187005201A 2015-09-29 2016-09-16 형광체 조성물, 형광체 시트 및 그들을 사용한 형성물, led 칩, led 패키지, 발광 장치, 백라이트 유닛, 디스플레이 및 led 패키지의 제조 방법 KR102404622B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPJP-P-2015-190908 2015-09-29
JP2015190908 2015-09-29
JPJP-P-2015-219206 2015-11-09
JP2015219206 2015-11-09
JPJP-P-2016-058157 2016-03-23
JP2016058157 2016-03-23
PCT/JP2016/077529 WO2017057074A1 (ja) 2015-09-29 2016-09-16 蛍光体組成物、蛍光体シート並びにそれらを用いた形成物、ｌｅｄチップ、ｌｅｄパッケージ、発光装置、バックライトユニット、ディスプレイおよびｌｅｄパッケージの製造方法

Publications (2)

Publication Number Publication Date
KR20180061146A KR20180061146A (ko) 2018-06-07
KR102404622B1 true KR102404622B1 (ko) 2022-06-02

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KR1020187005201A KR102404622B1 (ko) 2015-09-29 2016-09-16 형광체 조성물, 형광체 시트 및 그들을 사용한 형성물, led 칩, led 패키지, 발광 장치, 백라이트 유닛, 디스플레이 및 led 패키지의 제조 방법

Country Status (5)

Country Link
JP (1) JP6760077B2 (zh)
KR (1) KR102404622B1 (zh)
CN (1) CN107995920B (zh)
TW (1) TWI713592B (zh)
WO (1) WO2017057074A1 (zh)

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CN109563405B (zh) 2016-07-29 2022-06-17 株式会社Lg化学 含氮环状化合物、包含其的色彩转换膜以及包含其的背光单元和显示装置
TW201910403A (zh) * 2017-07-28 2019-03-16 日商道康寧東麗股份有限公司 光學構件用樹脂薄片、具備其之光學構件、積層體或發光元件以及光學構件用樹脂薄片之製造方法
TWI779077B (zh) 2017-09-08 2022-10-01 日商杜邦東麗特殊材料股份有限公司 密封光半導體元件的製造方法
TWI787326B (zh) 2017-09-08 2022-12-21 日商杜邦東麗特殊材料股份有限公司 密封光半導體元件的製造方法
WO2019155076A1 (en) * 2018-02-12 2019-08-15 Signify Holding B.V. Led light source with fluoride phosphor
TWI669207B (zh) * 2018-03-12 2019-08-21 品化科技股份有限公司 半導體元件的異質材料結合方法
TWI648878B (zh) * 2018-05-15 2019-01-21 東貝光電科技股份有限公司 Led發光源、led發光源之製造方法及其直下式顯示器
CN111826157A (zh) 2019-04-19 2020-10-27 日亚化学工业株式会社 氟化物荧光体、发光装置和氟化物荧光体的制造方法
WO2022131364A1 (ja) * 2020-12-17 2022-06-23 富士フイルム株式会社 波長変換部材、発光装置および液晶表示装置
KR102486743B1 (ko) * 2021-01-21 2023-01-10 한국광기술원 고품질 형광체 플레이트 및 그의 제조방법
CN117157378A (zh) * 2021-04-07 2023-12-01 浙江光昊光电科技有限公司 一种混合物及其在光电领域的应用
WO2023210342A1 (ja) * 2022-04-25 2023-11-02 東レ株式会社 組成物

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JP2011241160A (ja) * 2010-05-17 2011-12-01 Yamamoto Chem Inc 色変換材料、該材料を含む組成物、該組成物を使用した色変換光学部品および該色変換光学部品を使用した発光素子
JP2014136771A (ja) * 2013-01-17 2014-07-28 Yamamoto Chem Inc 波長変換層、及びこれを用いた波長変換フィルタ
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JP4948714B2 (ja) 2001-05-24 2012-06-06 三井化学株式会社 色変換材料、該材料を含む組成物、該組成物を使用した色変換光学部品および該色変換光学部品を使用した発光素子
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KR102035511B1 (ko) * 2013-10-24 2019-10-23 도레이 카부시키가이샤 형광체 조성물, 형광체 시트, 형광체 시트 적층체와 그들을 사용한 led 칩, led 패키지 및 그 제조 방법

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JP2011241160A (ja) * 2010-05-17 2011-12-01 Yamamoto Chem Inc 色変換材料、該材料を含む組成物、該組成物を使用した色変換光学部品および該色変換光学部品を使用した発光素子
JP2014531739A (ja) * 2011-07-13 2014-11-27 コーニンクレッカ フィリップス エヌ ヴェ 波長変換素子
JP2014136771A (ja) * 2013-01-17 2014-07-28 Yamamoto Chem Inc 波長変換層、及びこれを用いた波長変換フィルタ

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JP6760077B2 (ja) 2020-09-23
CN107995920A (zh) 2018-05-04
JPWO2017057074A1 (ja) 2018-07-12
TWI713592B (zh) 2020-12-21
CN107995920B (zh) 2021-03-12
KR20180061146A (ko) 2018-06-07
TW201728739A (zh) 2017-08-16
WO2017057074A1 (ja) 2017-04-06

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