KR102400879B1 - 감광성 수지 조성물, 드라이 필름, 및 프린트 배선판 - Google Patents

감광성 수지 조성물, 드라이 필름, 및 프린트 배선판 Download PDF

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Publication number
KR102400879B1
KR102400879B1 KR1020207004018A KR20207004018A KR102400879B1 KR 102400879 B1 KR102400879 B1 KR 102400879B1 KR 1020207004018 A KR1020207004018 A KR 1020207004018A KR 20207004018 A KR20207004018 A KR 20207004018A KR 102400879 B1 KR102400879 B1 KR 102400879B1
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KR
South Korea
Prior art keywords
group
resin composition
photosensitive resin
hardened
cured material
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Application number
KR1020207004018A
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English (en)
Korean (ko)
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KR20200028438A (ko
Inventor
미치야 히구치
후미토 스즈키
유스케 후지와라
신야 다나카
소이치 하시모토
다카시 아라이
Original Assignee
고오 가가쿠고교 가부시키가이샤
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Application filed by 고오 가가쿠고교 가부시키가이샤 filed Critical 고오 가가쿠고교 가부시키가이샤
Publication of KR20200028438A publication Critical patent/KR20200028438A/ko
Application granted granted Critical
Publication of KR102400879B1 publication Critical patent/KR102400879B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials For Photolithography (AREA)
KR1020207004018A 2018-06-01 2019-05-27 감광성 수지 조성물, 드라이 필름, 및 프린트 배선판 KR102400879B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2018106470 2018-06-01
JPJP-P-2018-106470 2018-06-01
PCT/JP2019/020791 WO2019230616A1 (ja) 2018-06-01 2019-05-27 感光性樹脂組成物、ドライフィルム、及びプリント配線板

Publications (2)

Publication Number Publication Date
KR20200028438A KR20200028438A (ko) 2020-03-16
KR102400879B1 true KR102400879B1 (ko) 2022-05-20

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Application Number Title Priority Date Filing Date
KR1020207004018A KR102400879B1 (ko) 2018-06-01 2019-05-27 감광성 수지 조성물, 드라이 필름, 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JP7240009B2 (ja)
KR (1) KR102400879B1 (ja)
CN (1) CN111095102A (ja)
TW (1) TWI700552B (ja)
WO (1) WO2019230616A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7405803B2 (ja) * 2021-08-27 2023-12-26 株式会社タムラ製作所 感光性樹脂組成物、感光性樹脂組成物の光硬化物及び感光性樹脂組成物を塗布したプリント配線板
WO2023139682A1 (ja) * 2022-01-19 2023-07-27 株式会社レゾナック 感光性樹脂組成物、感光性エレメント、プリント配線板、及びプリント配線板の製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014209260A (ja) * 2014-06-25 2014-11-06 日立化成株式会社 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法及び永久レジスト
JP2017129736A (ja) * 2016-01-20 2017-07-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
JP2017219862A (ja) * 2017-08-29 2017-12-14 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及びプリント配線板の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5650611B2 (ja) * 2011-08-23 2015-01-07 デクセリアルズ株式会社 異方性導電フィルム、異方性導電フィルムの製造方法、接続方法、及び接合体
JP5514356B2 (ja) * 2012-09-28 2014-06-04 太陽インキ製造株式会社 光硬化性樹脂組成物、プリント配線板、及び光硬化性樹脂組成物の製造方法
SG11201606071WA (en) * 2014-01-24 2016-09-29 Toray Industries Negative photosensitive resin composition, cured film obtained by curing same, method for producing cured film, optical device provided with cured film, and backside-illuminated cmos image sensor
WO2017056901A1 (ja) * 2015-09-29 2017-04-06 富士フイルム株式会社 組成物、硬化膜、パターン、パターンの製造方法、光学センサー、及び撮像素子
WO2017125966A1 (ja) * 2016-01-19 2017-07-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、及びプリント配線板
JP6204518B2 (ja) * 2016-03-08 2017-09-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、及びプリント配線板
JP6626190B2 (ja) * 2016-03-30 2019-12-25 旭化成株式会社 セルロース微細繊維層を含む樹脂複合フィルム
EP3489025A4 (en) * 2016-08-31 2019-10-16 FUJIFILM Corporation CURABLE COMPOSITION, ORIGINAL PLATE FOR LITHOGRAPHIC PRINTING PLATES, AND METHOD FOR MANUFACTURING LITHOGRAPHIC PRINTING PLATE

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014209260A (ja) * 2014-06-25 2014-11-06 日立化成株式会社 感光性樹脂組成物、感光性フィルム、レジストパターンの形成方法及び永久レジスト
JP2017129736A (ja) * 2016-01-20 2017-07-27 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及び感光性樹脂組成物の製造方法
JP2017219862A (ja) * 2017-08-29 2017-12-14 互応化学工業株式会社 感光性樹脂組成物、ドライフィルム、プリント配線板、及びプリント配線板の製造方法

Also Published As

Publication number Publication date
JP7240009B2 (ja) 2023-03-15
TWI700552B (zh) 2020-08-01
TW202004343A (zh) 2020-01-16
JPWO2019230616A1 (ja) 2020-12-17
KR20200028438A (ko) 2020-03-16
CN111095102A (zh) 2020-05-01
WO2019230616A1 (ja) 2019-12-05

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