KR102393398B1 - Handler for testing semiconductor - Google Patents

Abstract

The present invention relates to a handler for testing a semiconductor device that supports testing of a semiconductor device.
A semiconductor device test handler according to the present invention includes at least one test socket electrically connected to a tester side, detachably installed, and a socket plate capable of being in a test position in which a semiconductor device is to be tested or deviated from the test position; a device supplier for supplying at least one semiconductor device to the at least one test socket installed on the socket plate; a mover for moving the socket plate out of the test position or returning it to the test position; and a controller for controlling the element feeder and the mover. includes
According to the present invention, the operation of replacing the test socket can be performed quickly and easily when the standard of the semiconductor device to be tested is changed, so that the operation rate can be improved.

Description

Handler for testing semiconductor devices

The present invention relates to a handler for testing a semiconductor device used when testing a semiconductor device.

A semiconductor device test handler (hereinafter referred to as a 'handler') is an equipment that electrically connects semiconductor devices manufactured through a predetermined manufacturing process to a tester and classifies semiconductor devices according to test results.

A handler for testing a semiconductor device is disclosed through Korean Patent Laid-Open No. 10-2002-0053406 and the like.

According to the published patent literature, the device supply device that supplies the semiconductor device to the test socket (referred to as an 'index head' in the literature) descends and presses the semiconductor device to the test socket side, thereby electrically transferring the gripped semiconductor device to the test socket. connect to

However, in the case of the test socket as presented in Korean Patent Laid-Open Publication No. 10-2008-0097600, it has a structure in which a semiconductor device is pressed by itself and electrically connected to each other. When such a test socket is applied, when the device supplier supplies the semiconductor device to the test socket, the pressurizing structure of the test socket operates to be electrically connected to the semiconductor device. In this way, when the pressurizing structure of the test socket presses the semiconductor device, the semiconductor device cannot be recovered from the test socket, and the semiconductor device cannot be supplied to the test socket for the same reason. Therefore, there is a need for an opener capable of supplying a semiconductor device to the test socket by a device supplier or recovering the semiconductor device from the test socket by releasing the pressurized state of the pressing structure to open the test socket.

Meanwhile, as shown in FIG. 1 , the test socket TS is installed on the socket plate 150 . Therefore, when the standard of the semiconductor device to be tested is changed, the socket plate 150 must be replaced. In order to replace the socket plate 150, the inconvenience of releasing the fixation of the socket plate 150 by using a separate tool in an allowed narrow and complicated space follows.

Accordingly, recently, a structure has been proposed in which only the test socket TS can be replaced even if the standard of a semiconductor device to be tested is changed by detachably installing the test socket TS on the socket plate 150 . However, even in this case, it is very difficult and cumbersome to replace the test socket TS in a cramped space allowed due to other components around the socket plate 150 . For example, because it was a form of disassembling a part of the outer wall of the equipment or replacing the test socket (TS) by putting an opening or a door in a part of the outer wall of the equipment and inserting an eight-way door between them, the replacement work is cumbersome and difficult to do. there was In particular, when an opener for opening the test socket TS is provided, it is more inconvenient to replace the test socket TS.

A first object of the present invention is to provide a technique capable of performing a task of replacing a test socket at a position that is easy for an operator to work.

A second object of the present invention is to provide a structure in which a replacement operation of a test socket can be easily performed.

In a handler for testing a semiconductor device according to the present invention for achieving the above object, at least one test socket electrically connected to a tester side is detachably installed, and the semiconductor device is in a test position to be tested or from the test position. Removable socket plate; a device supplier for supplying at least one semiconductor device to the at least one test socket installed on the socket plate; a mover for moving the socket plate out of the test position or returning it to the test position; and a controller for controlling the element feeder and the mover. includes

The mover may include: a coupling frame to which the socket plate is coupled; a moving source which causes the socket plate to deviate from the test position or returns to the test position by moving the coupling frame; and a guide member for guiding the movement of the coupling frame. includes

a clamper for fixing or releasing the socket plate at the test position; Further comprising a, wherein the controller releases the fixing state of the socket plate by the at least one clamper before moving the socket plate in a direction away from the test position.

The at least one test socket is detachably coupled to the socket plate.

an opener configured to supply at least one semiconductor device to the test socket by the device supplier or retrieve at least one semiconductor device from the test socket by opening the at least one test socket; may further include.

The opener may include: an operation block for operating the test socket; and a driving source for driving the operation block so that the operation block operates the test socket to open the test socket. It includes, wherein the operation block is provided between the socket plate and the element feeder.

The operation block has a through hole through which at least one semiconductor element supplied by the element supplier can pass.

The opener, a support rail for supporting the operation block; and a fixing member for fixing the operation block to the support rail. Including, when the fixing by the fixing member is released, the operation block can be moved along the support rail, so that it can deviate between the socket plate and the element feeder.

According to the present invention, since the replacement operation of the test socket is easily performed at a location where the operator can conveniently work, there is an effect of reducing the replacement time of the test socket, thereby reducing the wastage of manpower and improving the operation rate.

1 is an example of a conventional socket plate.
2 is a conceptual plan view of a handler for testing a semiconductor device according to an embodiment of the present invention.
3 is a conceptual side view of the main part of the handler of FIG. 2 .
FIG. 4 is a schematic structural diagram of the element feeder 240 applied to the handler of FIG. 2 .
Fig. 5 is a schematic perspective view of a socket plate applied to the handler of Fig. 2;
6 is a schematic excerpted perspective view of a mobile device applied to the handler of FIG. 2 .
Fig. 7 is a schematic excerpted perspective view of a clamper applied to the handler of Fig. 2;
Fig. 8 is a schematic excerpted perspective view of an opener applied to the handler of Fig. 2;
It is a reference diagram for explaining the operation of the opener of FIG.
FIG. 10 is a schematic operation state diagram showing the operation of the mobile device of FIG. 6 .

Hereinafter, preferred embodiments according to the present invention as described above will be described with reference to the accompanying drawings. For reference, for brevity of description, known or overlapping descriptions or reference numerals in drawings are omitted or compressed as much as possible.

2 is a conceptual plan configuration diagram of a handler (200, hereinafter abbreviated as 'handler') for testing a semiconductor device according to an embodiment of the present invention, and FIG. 3 is a main portion of the handler 200 of FIG. It is a conceptual diagram of the aspect of

2 and 3 , the handler 200 according to the present invention includes a shuttle 210 , a loading portion 220 and an unloading portion 230 , an element feeder 240 , and a socket plate 250 . , a mover 260 (refer to FIG. 3), a clamper 270 (refer to FIG. 3), an opener 280 and a controller 290.

The shuttle 210 has a pocket table 211 that reciprocates on a straight line connecting the loading position LP, the gripping position DP, and the unloading position UP in the left and right directions. And the pocket table 211 has eight loading pockets 211a and eight unloading pockets 211b in which semiconductor devices can be loaded. Here, the loading pocket 211a reciprocates between the loading position LP and the gripping position DP by the reciprocating movement of the pocket table 211, and the unloading pocket 211b is in the reciprocating movement of the pocket table 211. It reciprocates between the gripping position DP and the unloading position UP by the The loading part 220 loads a semiconductor device to be tested into the loading pockets 211a of the shuttle 210 .

The unloading part 230 unloads the semiconductor device that has been tested from the unloading pockets 211b of the shuttle 210 .

For reference, since the loading/unloading technology of the semiconductor device has already been disclosed and known in various forms, a detailed description thereof will be omitted.

The device supply 240 supplies eight semiconductor devices to the socket plate 250 . To this end, as shown in the schematic structural diagram of FIG. 4 , the element feeder 240 includes a gripping head 241 , a horizontal mover 242 , and a vertical mover 243 .

The gripping head 241 can grip or release eight semiconductor elements, and has eight pickers P capable of gripping or releasing one semiconductor element by vacuum pressure, respectively.

The horizontal mover 242 moves the grip head 241 in the front-rear horizontal direction.

The vertical mover 243 moves the gripping head 241 in the vertical direction.

Eight test sockets TS are detachably installed on the socket plate 250 as shown in FIG. 5 . In addition, each of the test sockets (TS) installed on the socket plate 250 is electrically connected to the side of the tester (TESTER) positioned to be spaced apart at a considerable distance below by a cable (C). These test sockets TS are electrically connected to the semiconductor device supplied by the device supplier 240 when the socket plate 250 is in the test position TP as shown in FIG. 3 .

The mover 260 moves the socket plate 250 in the test position TP downward away from the element feeder 240 or returns it to the test position TP. That is, the mover 260 moves the socket plate 250 up and down so that the socket plate 250 can be positioned to be deviated from the test position TP or returns to the test position TP. To this end, the mover 260 includes a coupling frame 261 , a moving source 262 and a guide member 263 as shown in the excerpt of FIG. 6 .

The socket plate 250 is coupled to the upper surface of the coupling frame 261 . And the coupling frame 261 is moved up and down by the moving source (262). Accordingly, the socket plate 250 coupled to the coupling frame 261 also moves up and down together with the coupling frame 261 .

The moving source 262 moves the coupling frame 261 up and down. This moving source 262 may be provided as a rodless cylinder. Of course, depending on the implementation, it may be replaced with a motor or a general cylinder. However, rodless cylinders are cheaper than motors, have advantages in that they can simply implement a lifting structure, and are superior to general cylinders in terms of precision and space utilization. In particular, in terms of structure, the motor is more complicated with LM guides, belts, and ball screws, and the cylinder needs 2M installation length to realize 1M movement distance, and there is a public weakness in that the board must be located at the bottom. . Therefore, it is most preferable that a rodless cylinder is provided as the moving source 262 .

The guide member 263 guides the lifting and lowering movement of the coupling frame 261, and is composed of two guide rods 263a and 263b.

The clamper 270 is provided to securely fix the socket plate 250 . To this end, the clamper 270 is a mounting plate 271, four forward and backward members (272a to 272d), four cylinders (273a to 273d) and four preventive members (274a to 274a to 274d).

Four cylinders 273a to 273d and four prevention members 272a to 272d are fixed to the mounting plate 271 . In addition, an exposure hole EH for exposing the socket plate 250 upward is formed in the mounting plate 271 .

When moving toward the socket plate 250 by the cylinders 273a to 273d, the advancing and retreating members 272a to 272d firmly press the socket plate 250 to fix the socket plate 250, and when moving in the opposite direction, the socket The fixation to the plate 250 is released. Of course, depending on implementation, it may be considered that the advancing and retreating member is configured to only support the socket plate in order to prevent arbitrary downward detachment of the socket plate, rather than fixing the socket plate.

The cylinders 273a to 273d are provided as advance and retreat circles for advancing and retreating the advancing and retreating members 272a to 272d.

The preventing members 272a to 272d prevent the advancing and retreating members 272a to 272d from sagging downward while guiding the movement of the advancing and retreating members 272a to 272d. That is, the prevention members 272a to 272d are fixed to the mounting plate to form a moving hole through which the advancing and retreating members 272a to 272d can be moved. Accordingly, the advancing and retreating members 272a to 272d move forward and backward while being supported by the prevention members 272a to 272d in a state of being inserted into the moving hole.

The opener 280 operates the test socket TS so that the device supplier 240 can supply the semiconductor device to the test socket TS or retrieve the semiconductor device from the test socket TS to thereby operate the test socket TS. ) to open. To this end, the opener 280 includes two operation blocks 281a and 281b, a cam rod 282, a pair of moving plates 283a and 283b, a pair of support rails 284a, as shown in the excerpt of FIG. 284b), four fixing members 285a to 285d and a rotating circle 286.

The two operation blocks 281a and 281b are provided side by side between the element supplier 240 and the socket plate 250, and the semiconductor element supplied to the socket plate 250 from the upper side through the element supplier 240 is It has four through holes TH through which it can pass.

The cam rod 282 has cam parts 282a and 282b formed on both sides, so that the cam parts 282a and 282b can move the moving plates 283a and 283b up and down according to the rotation.

A cam hole CH is formed in the pair of moving plates 283a and 283b. The cam portions 282a and 282b of the cam rod 282 are inserted into the cam holes CH of the moving plates 283a and 283b. Accordingly, the pair of moving plates 283a and 283b move up and down according to the rotation of the cam rod 282 .

A pair of support rails (284a, 284b) supports the left and right ends of the operation blocks (281a, 281b), and guides the movement in the front-rear direction of the operation blocks (281a, 281b). In addition, the support rails 284a and 284b are coupled to the moving plates 283a and 283b, and thus move up and down together with the moving plates 283a and 283b.

The four fixing members 285a to 285d fix the operation blocks 281a and 281b to the support rails 284a and 284b. These four fixing members (285a to 285d) are provided in a one-touch button type, so that the operation of fixing or releasing the operation blocks (281a, 281b) to the support rails (284a, 284b) by pressing the button once can be easily done by

The rotation source 286 is fixedly installed on the mounting plate 271 and rotates the cam rod 282 . The rotation source 286 is a driving source for driving the operation blocks 281a and 281b up and down.

Therefore, when the convex portions of the cam portions 282a and 282b are located on the upper side with respect to the rotation shaft RS according to the rotation state of the cam rod 282 as shown in FIG. ) and the operation blocks 281a and 281b are raised so that the operation blocks 281a and 281b are spaced apart from the test socket TS.

However, when the convex portions of the cam portions 282a and 282b are located below the rotation shaft RS according to the rotation state of the cam rod 282 as shown in FIG. 9(b), the moving plate 283b, the support rail ( 284b) and the operation blocks 281a and 281b are lowered so that the operation blocks 281a and 281b press the upper end of the test socket TS downward. Accordingly, the test socket TS is manipulated to open the test socket TS. For reference, the upper end of the test socket TS is provided with a lifting member, so that the pressing device of the test socket TS is operated according to the lowering of the pressing member to open the test socket TS.

The controller 290 controls the shuttle 210 , the loading part 220 , the unloading part 240 , the element feeder 240 , the mover 260 , the clamper 270 and the opener 280 .

Next, the operation of the handler 200 having the above-described configuration will be described.

When the loading part 220 loads eight semiconductor devices into the loading pocket 211a of the pocket table 211 , the pocket table 211 moves to the right so that the loading pocket 211a is the grip head of the device feeder 240 . (241) to be located in the lower part. Then, the device feeder 240 operates so that the gripping head 241 grips the eight semiconductor devices in the loading pocket 211a and then moves to the upper side of the socket plate 250 . At this time, the opener 280 operates the test socket TS in an open state. Accordingly, as the gripping head 241 descends, the semiconductor device passes through the through holes TH of the manipulation blocks 281a and 281b and is supplied to the test socket TS. When the gripping head 241 rises, the operation of the test socket TS by the opener 280 is released, and the test socket TS returns to a state in which the semiconductor device is pressed. Accordingly, the semiconductor device is electrically connected to the tester TESTER through the test socket TS. And when the test is completed, the semiconductor device recovered by the device supplier 240 according to the above reverse operation is loaded into the unloading pocket 211b at the gripping position DP by the movement of the pocket table 211 . Of course, the semiconductor devices loaded in the unloading pocket 211b are unloaded by the unloading part 230 .

Meanwhile, when the standard of the semiconductor device to be tested is converted, the operator inputs a lowering command of the socket plate 250 to the controller 290 of the handler 200 . Accordingly, the controller 290 controls the clamper 270 to release the fixation of the socket plate 250 , and then operates the moving source 260 to move the coupling frame 261 and the socket plate 250 down. Accordingly, the socket plate 250 moves downward by a considerable interval toward the tester TESTER out of the test position TP as shown in FIG. 10 . In the state shown in FIG. 10 , the operator easily replaces the test socket TS, and then inputs a command to raise the socket plate 250 to the controller 290 . Then, the controller 290 moves the coupling frame 261 and the socket plate 250 upward, and when the elevation of the socket plate 250 is completed, the controller 290 controls the clamper 270 to fix the socket plate 250 .

Of course, depending on use, the operator may replace the test socket TS with a little ease without lowering the socket plate 250 . For example, after the operator releases the fixing of the operation blocks 281a and 281b by the fixing members 285a to 285d, the operation blocks 281a and 281b are spread in the front and rear directions along the support rails 284a and 284b. By moving the operation blocks (281a, 281b) to move away from between the element feeder 240 and the socket plate (250), or remove. And the replacement of the test socket (TS) is performed.

The above embodiment refers to the handler 200 having a structure in which the device supplier 240 supplies only the semiconductor device to the test socket TS, and the test socket TS itself is electrically connected to the semiconductor device. However, the present invention can be sufficiently applied to a handler having a structure in which the device supplier directly presses the semiconductor device toward the test socket.

In addition, the present invention can be preferably applied to a case in which the test sockets TS are replaced with the installed socket plate 250 rather than the individual test sockets TS.

As described above, the specific description of the present invention has been made by the embodiments with reference to the accompanying drawings, but since the above-described embodiments have only been described with preferred examples of the present invention, the present invention is limited to the above embodiments only. It should not be construed as being limited, and the scope of the present invention should be understood as the following claims and their equivalent concepts.

200: Handler for semiconductor device test
240: element supply
250: socket plate
260: mover
261: combined frame
262 : Lee Dong-won
263: guide member
270 : clamper
280: opener
281a, 2814b: operation block
TH: through hole
284a, 284b: support rail
285a to 285d: fixing member
286: rotation circle
290: controller

Claims (5)

a socket plate in which at least one test socket electrically connected to the tester is detachably installed, the socket plate being in a test position in which a semiconductor device is to be tested or being able to deviate from the test position;
a device supplier for supplying at least one semiconductor device to the at least one test socket installed on the socket plate;
an opener for supplying at least one semiconductor device to the test socket by the device supplier or recovering at least one semiconductor device from the test socket by opening the at least one test socket; and
a controller controlling the element feeder and the opener; including,
The opener,
an operation block for operating the test socket; and
a driving source for driving the operation block so that the operation block operates the test socket to open the test socket; includes,
The operation block has a through hole through which at least one semiconductor element supplied by the element supplier can pass, and is provided between the socket plate and the element supplier.
Handler for semiconductor device testing. According to claim 1,
The at least one test socket is a semiconductor device test handler, characterized in that detachably coupled to the socket plate. delete delete According to claim 1,
The opener,
a support rail for supporting the operation block; and a fixing member for fixing the operation block to the support rail. including,
The handling block for semiconductor device testing, characterized in that when the fixing by the fixing member is released, it can move along the support rail so as to be able to deviate between the socket plate and the device feeder.

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