KR102393173B1 - 임프린트 장치, 임프린트 방법 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법 및 물품 제조 방법 Download PDF

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KR102393173B1
KR102393173B1 KR1020190060414A KR20190060414A KR102393173B1 KR 102393173 B1 KR102393173 B1 KR 102393173B1 KR 1020190060414 A KR1020190060414 A KR 1020190060414A KR 20190060414 A KR20190060414 A KR 20190060414A KR 102393173 B1 KR102393173 B1 KR 102393173B1
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mold
deformation
deformation amount
amount
pattern
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KR20190136946A (ko
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아츠시 구사카
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캐논 가부시끼가이샤
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54426—Marks applied to semiconductor devices or parts for alignment

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020190060414A 2018-05-31 2019-05-23 임프린트 장치, 임프린트 방법 및 물품 제조 방법 Active KR102393173B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018104912A JP7134717B2 (ja) 2018-05-31 2018-05-31 インプリント装置、インプリント方法および物品製造方法
JPJP-P-2018-104912 2018-05-31

Publications (2)

Publication Number Publication Date
KR20190136946A KR20190136946A (ko) 2019-12-10
KR102393173B1 true KR102393173B1 (ko) 2022-05-02

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KR1020190060414A Active KR102393173B1 (ko) 2018-05-31 2019-05-23 임프린트 장치, 임프린트 방법 및 물품 제조 방법

Country Status (4)

Country Link
US (1) US11472097B2 (enExample)
JP (1) JP7134717B2 (enExample)
KR (1) KR102393173B1 (enExample)
CN (1) CN110554564B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7555756B2 (ja) 2020-08-07 2024-09-25 キヤノン株式会社 インプリントシステム、インプリント方法、および物品製造方法
JP7507641B2 (ja) * 2020-09-08 2024-06-28 キヤノン株式会社 成形装置及び物品の製造方法
US11776833B2 (en) * 2020-12-22 2023-10-03 Canon Kabushiki Kaisha Method for improving accuracy of imprint force application in imprint lithography
US11815811B2 (en) * 2021-03-23 2023-11-14 Canon Kabushiki Kaisha Magnification ramp scheme to mitigate template slippage

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6900881B2 (en) * 2002-07-11 2005-05-31 Molecular Imprints, Inc. Step and repeat imprint lithography systems
MY133312A (en) * 2002-11-13 2007-11-30 Molecular Imprints Inc A chucking system and method for modulation shapes of substrates
JPWO2007094213A1 (ja) 2006-02-14 2009-07-02 パイオニア株式会社 インプリント装置及びインプリント方法
KR100887381B1 (ko) * 2007-07-04 2009-03-06 주식회사 에이디피엔지니어링 패턴형성장치 및 패턴형성방법
JP5809409B2 (ja) * 2009-12-17 2015-11-10 キヤノン株式会社 インプリント装置及びパターン転写方法
JP2013098291A (ja) 2011-10-31 2013-05-20 Canon Inc インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP2013125817A (ja) 2011-12-14 2013-06-24 Canon Inc インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP5943717B2 (ja) * 2012-06-05 2016-07-05 キヤノン株式会社 位置検出システム、インプリント装置、デバイス製造方法、および位置検出方法
JP6412317B2 (ja) * 2013-04-24 2018-10-24 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP6120678B2 (ja) * 2013-05-27 2017-04-26 キヤノン株式会社 インプリント方法、インプリント装置及びデバイス製造方法
JP6271875B2 (ja) * 2013-06-18 2018-01-31 キヤノン株式会社 インプリント装置、インプリント方法および物品の製造方法
JP6294686B2 (ja) * 2014-02-04 2018-03-14 キヤノン株式会社 インプリント装置、インプリント方法及び物品の製造方法
JP6399839B2 (ja) * 2014-07-15 2018-10-03 キヤノン株式会社 インプリント装置、および物品の製造方法
JP6423641B2 (ja) 2014-08-05 2018-11-14 キヤノン株式会社 インプリント装置、物品の製造方法及びインプリント方法
JP6506521B2 (ja) * 2014-09-17 2019-04-24 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
JP6502655B2 (ja) * 2014-11-28 2019-04-17 キヤノン株式会社 モールドおよびその製造方法、インプリント方法、ならびに、物品製造方法
JP6497954B2 (ja) * 2015-02-04 2019-04-10 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
US10120276B2 (en) * 2015-03-31 2018-11-06 Canon Kabushiki Kaisha Imprint apparatus, imprint method, and method of manufacturing article
JP2017037926A (ja) 2015-08-07 2017-02-16 キヤノン株式会社 インプリント装置及び方法、並びに物品の製造方法
JP6700936B2 (ja) * 2016-04-25 2020-05-27 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Also Published As

Publication number Publication date
JP7134717B2 (ja) 2022-09-12
JP2019212674A (ja) 2019-12-12
US20190366620A1 (en) 2019-12-05
CN110554564B (zh) 2024-06-18
US11472097B2 (en) 2022-10-18
CN110554564A (zh) 2019-12-10
KR20190136946A (ko) 2019-12-10

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