CN110554564B - 压印装置、压印方法和物品制造方法 - Google Patents
压印装置、压印方法和物品制造方法 Download PDFInfo
- Publication number
- CN110554564B CN110554564B CN201910450869.9A CN201910450869A CN110554564B CN 110554564 B CN110554564 B CN 110554564B CN 201910450869 A CN201910450869 A CN 201910450869A CN 110554564 B CN110554564 B CN 110554564B
- Authority
- CN
- China
- Prior art keywords
- mold
- deformation amount
- deformation
- driving force
- imprint
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims abstract description 161
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 140
- 230000007246 mechanism Effects 0.000 claims abstract description 83
- 239000000463 material Substances 0.000 claims abstract description 82
- 239000000758 substrate Substances 0.000 claims description 87
- 238000013459 approach Methods 0.000 claims description 12
- 238000005259 measurement Methods 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 6
- 238000004049 embossing Methods 0.000 claims description 5
- 238000001723 curing Methods 0.000 description 34
- 230000000052 comparative effect Effects 0.000 description 18
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 230000008859 change Effects 0.000 description 9
- 238000002360 preparation method Methods 0.000 description 8
- 238000012937 correction Methods 0.000 description 7
- 150000001875 compounds Chemical class 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000000016 photochemical curing Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000015654 memory Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000000852 hydrogen donor Substances 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
- B29C59/022—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing characterised by the disposition or the configuration, e.g. dimensions, of the embossments or the shaping tools therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7042—Alignment for lithographic apparatus using patterning methods other than those involving the exposure to radiation, e.g. by stamping or imprinting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018104912A JP7134717B2 (ja) | 2018-05-31 | 2018-05-31 | インプリント装置、インプリント方法および物品製造方法 |
| JP2018-104912 | 2018-05-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110554564A CN110554564A (zh) | 2019-12-10 |
| CN110554564B true CN110554564B (zh) | 2024-06-18 |
Family
ID=68693081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910450869.9A Active CN110554564B (zh) | 2018-05-31 | 2019-05-28 | 压印装置、压印方法和物品制造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US11472097B2 (enExample) |
| JP (1) | JP7134717B2 (enExample) |
| KR (1) | KR102393173B1 (enExample) |
| CN (1) | CN110554564B (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7555756B2 (ja) | 2020-08-07 | 2024-09-25 | キヤノン株式会社 | インプリントシステム、インプリント方法、および物品製造方法 |
| JP7507641B2 (ja) * | 2020-09-08 | 2024-06-28 | キヤノン株式会社 | 成形装置及び物品の製造方法 |
| US11776833B2 (en) * | 2020-12-22 | 2023-10-03 | Canon Kabushiki Kaisha | Method for improving accuracy of imprint force application in imprint lithography |
| US11815811B2 (en) * | 2021-03-23 | 2023-11-14 | Canon Kabushiki Kaisha | Magnification ramp scheme to mitigate template slippage |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016103603A (ja) * | 2014-11-28 | 2016-06-02 | キヤノン株式会社 | モールドおよびその製造方法、インプリント方法、ならびに、物品製造方法 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6900881B2 (en) * | 2002-07-11 | 2005-05-31 | Molecular Imprints, Inc. | Step and repeat imprint lithography systems |
| MY133312A (en) * | 2002-11-13 | 2007-11-30 | Molecular Imprints Inc | A chucking system and method for modulation shapes of substrates |
| JPWO2007094213A1 (ja) | 2006-02-14 | 2009-07-02 | パイオニア株式会社 | インプリント装置及びインプリント方法 |
| KR100887381B1 (ko) * | 2007-07-04 | 2009-03-06 | 주식회사 에이디피엔지니어링 | 패턴형성장치 및 패턴형성방법 |
| JP5809409B2 (ja) * | 2009-12-17 | 2015-11-10 | キヤノン株式会社 | インプリント装置及びパターン転写方法 |
| JP2013098291A (ja) | 2011-10-31 | 2013-05-20 | Canon Inc | インプリント装置およびインプリント方法、それを用いた物品の製造方法 |
| JP2013125817A (ja) | 2011-12-14 | 2013-06-24 | Canon Inc | インプリント装置およびインプリント方法、それを用いた物品の製造方法 |
| JP5943717B2 (ja) * | 2012-06-05 | 2016-07-05 | キヤノン株式会社 | 位置検出システム、インプリント装置、デバイス製造方法、および位置検出方法 |
| JP6412317B2 (ja) * | 2013-04-24 | 2018-10-24 | キヤノン株式会社 | インプリント方法、インプリント装置および物品の製造方法 |
| JP6120678B2 (ja) * | 2013-05-27 | 2017-04-26 | キヤノン株式会社 | インプリント方法、インプリント装置及びデバイス製造方法 |
| JP6271875B2 (ja) * | 2013-06-18 | 2018-01-31 | キヤノン株式会社 | インプリント装置、インプリント方法および物品の製造方法 |
| JP6294686B2 (ja) * | 2014-02-04 | 2018-03-14 | キヤノン株式会社 | インプリント装置、インプリント方法及び物品の製造方法 |
| JP6399839B2 (ja) * | 2014-07-15 | 2018-10-03 | キヤノン株式会社 | インプリント装置、および物品の製造方法 |
| JP6423641B2 (ja) | 2014-08-05 | 2018-11-14 | キヤノン株式会社 | インプリント装置、物品の製造方法及びインプリント方法 |
| JP6506521B2 (ja) * | 2014-09-17 | 2019-04-24 | キヤノン株式会社 | インプリント方法、インプリント装置、および物品の製造方法 |
| JP6497954B2 (ja) * | 2015-02-04 | 2019-04-10 | キヤノン株式会社 | インプリント方法、インプリント装置、および物品の製造方法 |
| US10120276B2 (en) * | 2015-03-31 | 2018-11-06 | Canon Kabushiki Kaisha | Imprint apparatus, imprint method, and method of manufacturing article |
| JP2017037926A (ja) | 2015-08-07 | 2017-02-16 | キヤノン株式会社 | インプリント装置及び方法、並びに物品の製造方法 |
| JP6700936B2 (ja) * | 2016-04-25 | 2020-05-27 | キヤノン株式会社 | インプリント装置、インプリント方法、および物品の製造方法 |
-
2018
- 2018-05-31 JP JP2018104912A patent/JP7134717B2/ja active Active
-
2019
- 2019-05-23 KR KR1020190060414A patent/KR102393173B1/ko active Active
- 2019-05-24 US US16/422,763 patent/US11472097B2/en active Active
- 2019-05-28 CN CN201910450869.9A patent/CN110554564B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016103603A (ja) * | 2014-11-28 | 2016-06-02 | キヤノン株式会社 | モールドおよびその製造方法、インプリント方法、ならびに、物品製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7134717B2 (ja) | 2022-09-12 |
| JP2019212674A (ja) | 2019-12-12 |
| US20190366620A1 (en) | 2019-12-05 |
| US11472097B2 (en) | 2022-10-18 |
| CN110554564A (zh) | 2019-12-10 |
| KR20190136946A (ko) | 2019-12-10 |
| KR102393173B1 (ko) | 2022-05-02 |
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| GR01 | Patent grant |