KR102387058B1 - 부품 반송 장치, 부품 반송 방법 및 부품 실장 장치 - Google Patents

부품 반송 장치, 부품 반송 방법 및 부품 실장 장치 Download PDF

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Publication number
KR102387058B1
KR102387058B1 KR1020207016615A KR20207016615A KR102387058B1 KR 102387058 B1 KR102387058 B1 KR 102387058B1 KR 1020207016615 A KR1020207016615 A KR 1020207016615A KR 20207016615 A KR20207016615 A KR 20207016615A KR 102387058 B1 KR102387058 B1 KR 102387058B1
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KR
South Korea
Prior art keywords
component
parts
nozzle
external shape
inspection
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KR1020207016615A
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English (en)
Korean (ko)
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KR20200086331A (ko
Inventor
다이스케 카스가
Original Assignee
야마하하쓰도키 가부시키가이샤
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Publication of KR20200086331A publication Critical patent/KR20200086331A/ko
Application granted granted Critical
Publication of KR102387058B1 publication Critical patent/KR102387058B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
KR1020207016615A 2018-02-27 2018-02-27 부품 반송 장치, 부품 반송 방법 및 부품 실장 장치 KR102387058B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2018/007169 WO2019167110A1 (ja) 2018-02-27 2018-02-27 部品搬送装置、部品搬送方法および部品実装装置

Publications (2)

Publication Number Publication Date
KR20200086331A KR20200086331A (ko) 2020-07-16
KR102387058B1 true KR102387058B1 (ko) 2022-04-15

Family

ID=67805246

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207016615A KR102387058B1 (ko) 2018-02-27 2018-02-27 부품 반송 장치, 부품 반송 방법 및 부품 실장 장치

Country Status (4)

Country Link
JP (1) JP6884494B2 (ja)
KR (1) KR102387058B1 (ja)
CN (1) CN111742625B (ja)
WO (1) WO2019167110A1 (ja)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86104342A (zh) * 1985-12-04 1987-06-10 Tdk株式会社 检测和修改电子部件在基板上装配故障的方法及其装置
WO2017187527A1 (ja) * 2016-04-26 2017-11-02 富士機械製造株式会社 対基板作業機
JP2017224779A (ja) * 2016-06-17 2017-12-21 富士機械製造株式会社 実装関連処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62233746A (ja) * 1986-04-04 1987-10-14 Yasuda Denken Kk チツプ搭載基板チエツカ
JP2525261B2 (ja) * 1989-12-19 1996-08-14 松下電器産業株式会社 実装基板外観検査装置
JP2004281958A (ja) * 2003-03-19 2004-10-07 Juki Corp 部品実装方法及び装置
JP4262171B2 (ja) * 2004-09-02 2009-05-13 芝浦メカトロニクス株式会社 半導体チップの実装装置及び実装方法
JP4203116B2 (ja) * 2008-04-17 2008-12-24 Ｊｕｋｉ株式会社 部品実装装置
JP2012199321A (ja) 2011-03-18 2012-10-18 Hitachi High-Tech Instruments Co Ltd チップソータおよびチップ移載方法
CN105453715B (zh) * 2013-08-09 2018-11-27 株式会社富士 安装装置及元件检测方法
WO2017068638A1 (ja) * 2015-10-20 2017-04-27 富士機械製造株式会社 画像処理装置および部品実装機
JP6302527B2 (ja) 2016-10-11 2018-03-28 ヤマハ発動機株式会社 部品実装装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN86104342A (zh) * 1985-12-04 1987-06-10 Tdk株式会社 检测和修改电子部件在基板上装配故障的方法及其装置
WO2017187527A1 (ja) * 2016-04-26 2017-11-02 富士機械製造株式会社 対基板作業機
JP2017224779A (ja) * 2016-06-17 2017-12-21 富士機械製造株式会社 実装関連処理装置

Also Published As

Publication number Publication date
WO2019167110A1 (ja) 2019-09-06
JPWO2019167110A1 (ja) 2020-12-03
CN111742625B (zh) 2021-06-18
KR20200086331A (ko) 2020-07-16
JP6884494B2 (ja) 2021-06-09
CN111742625A (zh) 2020-10-02

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