KR102386508B1 - 전자파 차폐 필름 - Google Patents

전자파 차폐 필름 Download PDF

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Publication number
KR102386508B1
KR102386508B1 KR1020180152067A KR20180152067A KR102386508B1 KR 102386508 B1 KR102386508 B1 KR 102386508B1 KR 1020180152067 A KR1020180152067 A KR 1020180152067A KR 20180152067 A KR20180152067 A KR 20180152067A KR 102386508 B1 KR102386508 B1 KR 102386508B1
Authority
KR
South Korea
Prior art keywords
electromagnetic wave
conductive adhesive
protective layer
resin
wave shielding
Prior art date
Application number
KR1020180152067A
Other languages
English (en)
Korean (ko)
Other versions
KR20190065158A (ko
Inventor
요시히코 아오야기
시게카즈 우메무라
겐지 가미노
Original Assignee
타츠타 전선 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 타츠타 전선 주식회사 filed Critical 타츠타 전선 주식회사
Publication of KR20190065158A publication Critical patent/KR20190065158A/ko
Application granted granted Critical
Publication of KR102386508B1 publication Critical patent/KR102386508B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
KR1020180152067A 2017-12-01 2018-11-30 전자파 차폐 필름 KR102386508B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017231446A JP6407395B1 (ja) 2017-12-01 2017-12-01 電磁波シールドフィルム
JPJP-P-2017-231446 2017-12-01

Publications (2)

Publication Number Publication Date
KR20190065158A KR20190065158A (ko) 2019-06-11
KR102386508B1 true KR102386508B1 (ko) 2022-04-13

Family

ID=63855167

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180152067A KR102386508B1 (ko) 2017-12-01 2018-11-30 전자파 차폐 필름

Country Status (4)

Country Link
JP (1) JP6407395B1 (zh)
KR (1) KR102386508B1 (zh)
CN (1) CN109874286B (zh)
TW (1) TWI731271B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021052063A (ja) * 2019-09-24 2021-04-01 信越ポリマー株式会社 電磁波シールド付きカバーレイフィルム及びその製造方法、並びに電磁波シールド付きフレキシブルプリント配線板及びその製造方法
JP2021061365A (ja) * 2019-10-09 2021-04-15 信越ポリマー株式会社 電磁波シールドフィルム、回路基板、及び回路基板の製造方法
TWI829973B (zh) * 2020-02-25 2024-01-21 日商拓自達電線股份有限公司 電磁波屏蔽膜
JP7382259B2 (ja) * 2020-03-04 2023-11-16 信越ポリマー株式会社 電磁波シールドフィルム、及び電磁波シールドフィルム付きプリント配線板

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311664A (ja) * 2003-04-04 2004-11-04 Nitto Denko Corp プラズマディスプレイ用直貼りフィルタ
JP2017092414A (ja) * 2015-11-17 2017-05-25 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007328092A (ja) * 2006-06-07 2007-12-20 Bridgestone Corp 光学フィルタ、これを備えたディスプレイ及びプラズマディスプレイパネル
KR101795127B1 (ko) 2012-07-11 2017-11-07 다츠다 덴센 가부시키가이샤 경화성 도전성 접착제 조성물, 전자파 쉴드필름, 도전성 접착필름, 접착방법 및 회로기판
WO2015129546A1 (ja) * 2014-02-25 2015-09-03 住友ベークライト株式会社 電磁波シールドフィルム、フレキシブルプリント基板、電子部品搭載基板、及び電子部品の被覆方法
JP6578142B2 (ja) * 2014-06-26 2019-09-18 住友電気工業株式会社 接着剤組成物、プリント配線板用カバーレイ、プリント配線板用ボンディングフィルム及びプリント配線板
TW201700288A (zh) * 2015-03-02 2017-01-01 Dexerials Corp 屏蔽帶之製造方法及屏蔽帶
JP6499925B2 (ja) * 2015-06-02 2019-04-10 タツタ電線株式会社 フレキシブルプリント配線板、フレキシブルプリント配線板用補強部材、及びフレキシブルプリント基板
JP6801953B2 (ja) * 2015-11-17 2020-12-16 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP2017092417A (ja) * 2015-11-17 2017-05-25 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP6795296B2 (ja) * 2015-11-17 2020-12-02 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP6709669B2 (ja) * 2016-04-20 2020-06-17 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP6694763B2 (ja) * 2016-06-08 2020-05-20 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004311664A (ja) * 2003-04-04 2004-11-04 Nitto Denko Corp プラズマディスプレイ用直貼りフィルタ
JP2017092414A (ja) * 2015-11-17 2017-05-25 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板

Also Published As

Publication number Publication date
TWI731271B (zh) 2021-06-21
JP6407395B1 (ja) 2018-10-17
TW201931986A (zh) 2019-08-01
CN109874286A (zh) 2019-06-11
JP2019102628A (ja) 2019-06-24
KR20190065158A (ko) 2019-06-11
CN109874286B (zh) 2022-11-08

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