KR102378350B1 - 기판 액 처리 장치 및 기판 액 처리 방법 - Google Patents

기판 액 처리 장치 및 기판 액 처리 방법 Download PDF

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Publication number
KR102378350B1
KR102378350B1 KR1020150081944A KR20150081944A KR102378350B1 KR 102378350 B1 KR102378350 B1 KR 102378350B1 KR 1020150081944 A KR1020150081944 A KR 1020150081944A KR 20150081944 A KR20150081944 A KR 20150081944A KR 102378350 B1 KR102378350 B1 KR 102378350B1
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substrates
wafer
substrate
holding
substrate holder
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KR1020150081944A
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English (en)
Korean (ko)
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KR20150146397A (ko
Inventor
다카히코 오츠
후미히로 가미무라
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도쿄엘렉트론가부시키가이샤
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Publication of KR20150146397A publication Critical patent/KR20150146397A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)
KR1020150081944A 2014-06-23 2015-06-10 기판 액 처리 장치 및 기판 액 처리 방법 Active KR102378350B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2014-128617 2014-06-23
JP2014128617A JP6189257B2 (ja) 2014-06-23 2014-06-23 基板液処理装置及び基板液処理方法

Publications (2)

Publication Number Publication Date
KR20150146397A KR20150146397A (ko) 2015-12-31
KR102378350B1 true KR102378350B1 (ko) 2022-03-23

Family

ID=55129084

Family Applications (1)

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KR1020150081944A Active KR102378350B1 (ko) 2014-06-23 2015-06-10 기판 액 처리 장치 및 기판 액 처리 방법

Country Status (2)

Country Link
JP (1) JP6189257B2 (enExample)
KR (1) KR102378350B1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6645900B2 (ja) 2016-04-22 2020-02-14 キオクシア株式会社 基板処理装置および基板処理方法
CN107086188B (zh) * 2016-09-09 2020-07-03 深圳市新纶科技股份有限公司 一种晶元清洗装置
CN109994402B (zh) * 2017-12-29 2021-04-06 山东华光光电子股份有限公司 一种半导体研磨板上芯片清洗容器及其使用方法
JP6985957B2 (ja) 2018-02-21 2021-12-22 キオクシア株式会社 半導体処理装置
JP7336956B2 (ja) * 2019-10-10 2023-09-01 東京エレクトロン株式会社 基板処理システム、及び基板処理方法
CN111085498A (zh) * 2019-12-23 2020-05-01 南安泊阅工业设计有限公司 一种晶圆洗边系统
CN112371611B (zh) * 2020-10-13 2022-02-01 江苏亚电科技有限公司 一种无篮晶圆清洗装置
JP7539818B2 (ja) 2020-11-11 2024-08-26 東京エレクトロン株式会社 基板処理装置および基板処理方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4828503B1 (enExample) 1970-12-28 1973-09-01
JP2539042B2 (ja) * 1989-06-13 1996-10-02 富士通株式会社 ウエハキャリア
JPH03232229A (ja) * 1990-02-07 1991-10-16 Mitsubishi Electric Corp 半導体基板の洗浄装置およびその洗浄方法
JPH04151833A (ja) * 1990-10-16 1992-05-25 Nippon Steel Corp シリコンウエハ洗浄方法
JP2598360B2 (ja) * 1992-11-26 1997-04-09 株式会社スガイ 基板の洗浄装置
JPH0817782A (ja) * 1994-06-28 1996-01-19 Dainippon Screen Mfg Co Ltd 基板処理装置
JPH0845887A (ja) * 1994-07-29 1996-02-16 Nippon Steel Corp ウェハ洗浄方法
JPH09181042A (ja) * 1995-12-21 1997-07-11 Nec Corp ウェット処理装置
JP3510463B2 (ja) * 1997-11-10 2004-03-29 東京エレクトロン株式会社 基板の整列装置及び整列方法
KR101210263B1 (ko) * 2006-12-07 2012-12-10 주식회사 케이씨텍 기판 가이드 및 이를 구비하는 기판 세정 장치
JP5599754B2 (ja) 2010-05-31 2014-10-01 東京エレクトロン株式会社 基板処理装置、基板処理方法、およびこの基板処理方法を実行するためのコンピュータプログラムが記録された記録媒体

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Publication number Publication date
JP6189257B2 (ja) 2017-08-30
JP2016009729A (ja) 2016-01-18
KR20150146397A (ko) 2015-12-31

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