KR102353074B1 - 도전성 피막 및 레이저 에칭 가공용 도전성 페이스트 - Google Patents

도전성 피막 및 레이저 에칭 가공용 도전성 페이스트 Download PDF

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Publication number
KR102353074B1
KR102353074B1 KR1020187025703A KR20187025703A KR102353074B1 KR 102353074 B1 KR102353074 B1 KR 102353074B1 KR 1020187025703 A KR1020187025703 A KR 1020187025703A KR 20187025703 A KR20187025703 A KR 20187025703A KR 102353074 B1 KR102353074 B1 KR 102353074B1
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KR
South Korea
Prior art keywords
less
conductive
solvent
particle diameter
resin
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KR1020187025703A
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English (en)
Korean (ko)
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KR20180121522A (ko
Inventor
겐이치 에구치
야스히로 사카모토
Original Assignee
도요보 가부시키가이샤
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Publication of KR20180121522A publication Critical patent/KR20180121522A/ko
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Publication of KR102353074B1 publication Critical patent/KR102353074B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/08—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by electric discharge, e.g. by spark erosion

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Conductive Materials (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structure Of Printed Boards (AREA)
KR1020187025703A 2016-03-17 2017-03-02 도전성 피막 및 레이저 에칭 가공용 도전성 페이스트 KR102353074B1 (ko)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JPJP-P-2016-053633 2016-03-17
JPJP-P-2016-053632 2016-03-17
JPJP-P-2016-053630 2016-03-17
JP2016053630 2016-03-17
JP2016053632 2016-03-17
JPJP-P-2016-053631 2016-03-17
JP2016053633 2016-03-17
JP2016053631 2016-03-17
PCT/JP2017/008284 WO2017159381A1 (ja) 2016-03-17 2017-03-02 導電性皮膜およびレーザーエッチング加工用導電性ペースト

Publications (2)

Publication Number Publication Date
KR20180121522A KR20180121522A (ko) 2018-11-07
KR102353074B1 true KR102353074B1 (ko) 2022-01-19

Family

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KR1020187025703A KR102353074B1 (ko) 2016-03-17 2017-03-02 도전성 피막 및 레이저 에칭 가공용 도전성 페이스트

Country Status (5)

Country Link
JP (1) JP7056552B2 (ja)
KR (1) KR102353074B1 (ja)
CN (1) CN108781505B (ja)
TW (1) TWI710041B (ja)
WO (1) WO2017159381A1 (ja)

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* Cited by examiner, † Cited by third party
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US10984921B2 (en) 2017-06-30 2021-04-20 Sekisui Chemical Co., Ltd. Conductive paste
JP7281263B2 (ja) 2018-09-27 2023-05-25 味の素株式会社 樹脂組成物、感光性フィルム、支持体付き感光性フィルム、プリント配線板及び半導体装置
CN109887638B (zh) * 2019-01-14 2021-02-23 上海大学 纳米银颗粒与镀银碳化硅颗粒混合的多尺度纳米银浆及其制备方法
US11056630B2 (en) 2019-02-13 2021-07-06 Samsung Electronics Co., Ltd. Display module having glass substrate on which side wirings are formed and manufacturing method of the same
TWI741635B (zh) * 2019-06-28 2021-10-01 日商斯庫林集團股份有限公司 基板處理方法及基板處理裝置
CN111243779A (zh) * 2020-03-09 2020-06-05 广东四维新材料有限公司 用于激光切割导电银浆和低温固化超细球状银粉及彼此的制备方法
CN113450943B (zh) * 2021-09-02 2022-01-04 西安宏星电子浆料科技股份有限公司 一种抗热震型厚膜电路用导体浆料
CN115910426A (zh) * 2023-01-06 2023-04-04 北京中科纳通电子技术有限公司 一种高触变性的导电银浆及其制备方法

Citations (2)

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JP2005353783A (ja) * 2004-06-10 2005-12-22 Mitsubishi Plastics Ind Ltd 多層配線基板用導電性ペースト組成物
WO2015111615A1 (ja) * 2014-01-22 2015-07-30 東洋紡株式会社 レーザーエッチング加工用導電性ペースト、導電性薄膜、導電性積層体

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JP2008013809A (ja) * 2006-07-05 2008-01-24 Az Electronic Materials Kk レーザーアブレーションによる機能膜の製造法およびそれに用いるレーザーアブレーション加工用組成物
JP5236557B2 (ja) 2009-03-31 2013-07-17 太陽ホールディングス株式会社 レーザーを用いたパターン形成方法
JP2011181338A (ja) 2010-03-01 2011-09-15 Taiyo Holdings Co Ltd レーザーを用いた導電パターン形成方法及びその方法に用いる組成物
JP6016328B2 (ja) 2011-02-07 2016-10-26 株式会社三共 遊技用システム
BR112013029725A2 (pt) * 2011-05-23 2017-01-17 Kaneka Corp coletor de corrente, bateria, e, bateria bipolar
WO2013081106A1 (ja) * 2011-11-30 2013-06-06 東洋紡株式会社 透明導電性フィルム
US9886110B2 (en) * 2012-03-30 2018-02-06 Teijin Limited Transparent electroconductive laminate
JP6079425B2 (ja) * 2012-05-16 2017-02-15 日立化成株式会社 導電粒子、異方性導電接着剤フィルム及び接続構造体
JP2014002992A (ja) 2012-06-14 2014-01-09 Pelnox Ltd レーザーエッチング用導電性ペースト組成物
JP6227321B2 (ja) * 2013-08-05 2017-11-08 リンテック株式会社 プロテクトフィルム付き透明導電性フィルム
JP2015050107A (ja) * 2013-09-03 2015-03-16 富士フイルム株式会社 導電膜の製造方法
JP2015115314A (ja) * 2013-12-12 2015-06-22 ペルノックス株式会社 レーザーエッチング用導電性銀ペースト、回路基板用基材および回路基板
JP5932098B2 (ja) * 2014-04-17 2016-06-08 日東電工株式会社 透明導電性フィルム

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005353783A (ja) * 2004-06-10 2005-12-22 Mitsubishi Plastics Ind Ltd 多層配線基板用導電性ペースト組成物
WO2015111615A1 (ja) * 2014-01-22 2015-07-30 東洋紡株式会社 レーザーエッチング加工用導電性ペースト、導電性薄膜、導電性積層体

Also Published As

Publication number Publication date
JPWO2017159381A1 (ja) 2019-01-24
KR20180121522A (ko) 2018-11-07
TWI710041B (zh) 2020-11-11
CN108781505A (zh) 2018-11-09
CN108781505B (zh) 2021-08-06
TW201735219A (zh) 2017-10-01
WO2017159381A1 (ja) 2017-09-21
JP7056552B2 (ja) 2022-04-19

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