KR102342394B1 - 땜납 합금, 땜납 페이스트, 프리폼 땜납, 땜납 볼, 선 땜납, 수지 플럭스 코어드 땜납, 땜납 이음매, 전자 회로 기판 및 다층 전자 회로 기판 - Google Patents

땜납 합금, 땜납 페이스트, 프리폼 땜납, 땜납 볼, 선 땜납, 수지 플럭스 코어드 땜납, 땜납 이음매, 전자 회로 기판 및 다층 전자 회로 기판 Download PDF

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Publication number
KR102342394B1
KR102342394B1 KR1020217019763A KR20217019763A KR102342394B1 KR 102342394 B1 KR102342394 B1 KR 102342394B1 KR 1020217019763 A KR1020217019763 A KR 1020217019763A KR 20217019763 A KR20217019763 A KR 20217019763A KR 102342394 B1 KR102342394 B1 KR 102342394B1
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KR
South Korea
Prior art keywords
solder
solder alloy
alloy
electronic component
temperature
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KR1020217019763A
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English (en)
Korean (ko)
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KR20210083367A (ko
Inventor
다카시 사이토
슌사쿠 요시카와
šœ사쿠 요시카와
나오코 이즈미타
Original Assignee
센주긴조쿠고교 가부시키가이샤
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Publication of KR20210083367A publication Critical patent/KR20210083367A/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0227—Rods, wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams, slurries
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10378—Interposers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10734—Ball grid array [BGA]; Bump grid array
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/041—Solder preforms in the shape of solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
KR1020217019763A 2019-05-27 2020-05-11 땜납 합금, 땜납 페이스트, 프리폼 땜납, 땜납 볼, 선 땜납, 수지 플럭스 코어드 땜납, 땜납 이음매, 전자 회로 기판 및 다층 전자 회로 기판 KR102342394B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2019-098427 2019-05-27
JP2019098427A JP6708942B1 (ja) 2019-05-27 2019-05-27 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板
PCT/JP2020/018837 WO2020241225A1 (ja) 2019-05-27 2020-05-11 はんだ合金、はんだペースト、プリフォームはんだ、はんだボール、線はんだ、脂入りはんだ、はんだ継手、電子回路基板および多層電子回路基板

Publications (2)

Publication Number Publication Date
KR20210083367A KR20210083367A (ko) 2021-07-06
KR102342394B1 true KR102342394B1 (ko) 2021-12-22

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KR1020217019763A KR102342394B1 (ko) 2019-05-27 2020-05-11 땜납 합금, 땜납 페이스트, 프리폼 땜납, 땜납 볼, 선 땜납, 수지 플럭스 코어드 땜납, 땜납 이음매, 전자 회로 기판 및 다층 전자 회로 기판

Country Status (11)

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US (2) US20220040802A1 (US07122603-20061017-C00045.png)
EP (1) EP3888840A4 (US07122603-20061017-C00045.png)
JP (1) JP6708942B1 (US07122603-20061017-C00045.png)
KR (1) KR102342394B1 (US07122603-20061017-C00045.png)
CN (1) CN113677477B (US07122603-20061017-C00045.png)
BR (1) BR112021012348B1 (US07122603-20061017-C00045.png)
MX (1) MX2021007954A (US07122603-20061017-C00045.png)
MY (1) MY195069A (US07122603-20061017-C00045.png)
SG (1) SG11202107118QA (US07122603-20061017-C00045.png)
TW (1) TWI744907B (US07122603-20061017-C00045.png)
WO (1) WO2020241225A1 (US07122603-20061017-C00045.png)

Families Citing this family (2)

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Publication number Priority date Publication date Assignee Title
CN112621020B (zh) * 2020-12-25 2022-06-21 中机智能装备创新研究院(宁波)有限公司 一种镍基药芯钎料、制备方法及应用
CN113996967B (zh) * 2021-08-19 2023-04-28 苏州优诺电子材料科技有限公司 一种中温熔点合金及其应用

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JP2004188453A (ja) 2002-12-11 2004-07-08 Harima Chem Inc Ｓｎ系はんだ合金
JP2007105750A (ja) 2005-10-12 2007-04-26 Senju Metal Ind Co Ltd Ｓｎ−Ｉｎ系はんだ合金
WO2008111615A1 (ja) 2007-03-12 2008-09-18 Senju Metal Industry Co., Ltd. 異方性導電材料
WO2009011392A1 (ja) 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. 車載電子回路用Ｉｎ入り鉛フリーはんだ
WO2012115268A1 (ja) 2011-02-25 2012-08-30 千住金属工業株式会社 パワーデバイス用のはんだ合金と高電流密度のはんだ継手
WO2014097390A1 (ja) 2012-12-18 2014-06-26 千住金属工業株式会社 鉛フリーはんだ合金

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JP2002096191A (ja) * 2000-09-18 2002-04-02 Matsushita Electric Ind Co Ltd はんだ材料およびこれを利用する電気・電子機器
EP2147740B1 (en) * 2001-03-01 2015-05-20 Senju Metal Industry Co., Ltd Lead-free solder paste
JP5696173B2 (ja) 2005-08-12 2015-04-08 アンタヤ・テクノロジーズ・コープ はんだ組成物
JP4899115B2 (ja) * 2008-03-05 2012-03-21 千住金属工業株式会社 鉛フリーはんだ接続構造体およびはんだボール
CN103341699A (zh) * 2013-07-04 2013-10-09 浙江亚通焊材有限公司 一种取代锡铅钎料的Sn-In-Ag无铅钎料
EP2979807B1 (en) * 2014-06-24 2018-04-11 Harima Chemicals, Inc. Solder alloy, solder composition, solder paste and electronic circuit board
US10322471B2 (en) * 2014-07-21 2019-06-18 Alpha Assembly Solutions Inc. Low temperature high reliability alloy for solder hierarchy
EP3838473A1 (en) * 2015-05-05 2021-06-23 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
CN105665956A (zh) * 2016-03-23 2016-06-15 徐宏达 一种用于钎焊铝及其合金的软钎料合金
CN107877031A (zh) * 2017-11-27 2018-04-06 东莞市千岛金属锡品有限公司 一种无铅低温焊料及其制备方法
CN108971793B (zh) * 2018-08-24 2021-04-23 云南科威液态金属谷研发有限公司 一种低温无铅焊料
US10833050B1 (en) * 2019-05-22 2020-11-10 Lenovo (Singapore) Pte. Ltd. Interposer, electronic substrate, and method for producing electronic substrate

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004188453A (ja) 2002-12-11 2004-07-08 Harima Chem Inc Ｓｎ系はんだ合金
JP2007105750A (ja) 2005-10-12 2007-04-26 Senju Metal Ind Co Ltd Ｓｎ−Ｉｎ系はんだ合金
WO2008111615A1 (ja) 2007-03-12 2008-09-18 Senju Metal Industry Co., Ltd. 異方性導電材料
WO2009011392A1 (ja) 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. 車載電子回路用Ｉｎ入り鉛フリーはんだ
WO2012115268A1 (ja) 2011-02-25 2012-08-30 千住金属工業株式会社 パワーデバイス用のはんだ合金と高電流密度のはんだ継手
WO2014097390A1 (ja) 2012-12-18 2014-06-26 千住金属工業株式会社 鉛フリーはんだ合金

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CN113677477A (zh) 2021-11-19
KR20210083367A (ko) 2021-07-06
JP6708942B1 (ja) 2020-06-10
TWI744907B (zh) 2021-11-01
EP3888840A4 (en) 2022-09-21
SG11202107118QA (en) 2021-07-29
BR112021012348B1 (pt) 2022-05-03
MY195069A (en) 2023-01-06
CN113677477B (zh) 2022-10-14
TW202104607A (zh) 2021-02-01
BR112021012348A2 (US07122603-20061017-C00045.png) 2021-11-16
EP3888840A1 (en) 2021-10-06
US20220040802A1 (en) 2022-02-10
US20230226648A1 (en) 2023-07-20
JP2020192552A (ja) 2020-12-03
MX2021007954A (es) 2022-06-28
WO2020241225A1 (ja) 2020-12-03

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