KR102335275B1 - 반송 장치 - Google Patents

반송 장치 Download PDF

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Publication number
KR102335275B1
KR102335275B1 KR1020190176016A KR20190176016A KR102335275B1 KR 102335275 B1 KR102335275 B1 KR 102335275B1 KR 1020190176016 A KR1020190176016 A KR 1020190176016A KR 20190176016 A KR20190176016 A KR 20190176016A KR 102335275 B1 KR102335275 B1 KR 102335275B1
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KR
South Korea
Prior art keywords
rotation shaft
shaft
pulley
arm
rotation
Prior art date
Application number
KR1020190176016A
Other languages
English (en)
Korean (ko)
Other versions
KR20210063178A (ko
Inventor
웬-핑 트사이
웨이-첸 리
Original Assignee
사이언테크 코포레이션
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 사이언테크 코포레이션 filed Critical 사이언테크 코포레이션
Publication of KR20210063178A publication Critical patent/KR20210063178A/ko
Application granted granted Critical
Publication of KR102335275B1 publication Critical patent/KR102335275B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
KR1020190176016A 2019-11-21 2019-12-27 반송 장치 KR102335275B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW108142321A TWI703079B (zh) 2019-11-21 2019-11-21 輸送裝置
TW108142321 2019-11-21

Publications (2)

Publication Number Publication Date
KR20210063178A KR20210063178A (ko) 2021-06-01
KR102335275B1 true KR102335275B1 (ko) 2021-12-06

Family

ID=73644022

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020190176016A KR102335275B1 (ko) 2019-11-21 2019-12-27 반송 장치

Country Status (3)

Country Link
JP (1) JP6924815B2 (ja)
KR (1) KR102335275B1 (ja)
TW (1) TWI703079B (ja)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357089U (ja) * 1986-10-03 1988-04-16
JPH0492446A (ja) * 1990-08-07 1992-03-25 Plasma Syst:Kk 基板搬送ロボット
JP2000176876A (ja) * 1998-12-10 2000-06-27 Komatsu Ltd ワーク搬送装置およびワーク搬送装置の姿勢保持方法
JP2002093881A (ja) * 2000-09-19 2002-03-29 Rorze Corp 基板搬送用ロボット
JP2002166376A (ja) * 2000-11-30 2002-06-11 Hirata Corp 基板搬送用ロボット
KR100350239B1 (ko) 2000-12-28 2002-08-27 한국과학기술원 집적 시스템을 위한 기판 구조 및 그 제조방법
JP4245387B2 (ja) * 2003-03-19 2009-03-25 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
KR20130096072A (ko) * 2012-02-21 2013-08-29 삼성전자주식회사 기판 반송 장치
JP6053757B2 (ja) * 2012-03-29 2016-12-27 株式会社アルバック 多関節ロボット、搬送装置
JP5545337B2 (ja) * 2012-09-28 2014-07-09 株式会社安川電機 ロボットアームおよびロボット
JP5990359B2 (ja) * 2012-10-04 2016-09-14 平田機工株式会社 搬入出ロボット
CN204935651U (zh) * 2015-09-07 2016-01-06 深圳市科精诚印刷机械制造有限公司 多关节机械手

Also Published As

Publication number Publication date
JP6924815B2 (ja) 2021-08-25
KR20210063178A (ko) 2021-06-01
JP2021079526A (ja) 2021-05-27
TWI703079B (zh) 2020-09-01
TW202120409A (zh) 2021-06-01

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