TWI703079B - 輸送裝置 - Google Patents

輸送裝置 Download PDF

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Publication number
TWI703079B
TWI703079B TW108142321A TW108142321A TWI703079B TW I703079 B TWI703079 B TW I703079B TW 108142321 A TW108142321 A TW 108142321A TW 108142321 A TW108142321 A TW 108142321A TW I703079 B TWI703079 B TW I703079B
Authority
TW
Taiwan
Prior art keywords
rotating shaft
shaft
arm
arm body
rotate
Prior art date
Application number
TW108142321A
Other languages
English (en)
Chinese (zh)
Other versions
TW202120409A (zh
Inventor
蔡文平
李威震
Original Assignee
辛耘企業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 辛耘企業股份有限公司 filed Critical 辛耘企業股份有限公司
Priority to TW108142321A priority Critical patent/TWI703079B/zh
Priority to JP2019236363A priority patent/JP6924815B2/ja
Priority to KR1020190176016A priority patent/KR102335275B1/ko
Application granted granted Critical
Publication of TWI703079B publication Critical patent/TWI703079B/zh
Publication of TW202120409A publication Critical patent/TW202120409A/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)
  • Warehouses Or Storage Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW108142321A 2019-11-21 2019-11-21 輸送裝置 TWI703079B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW108142321A TWI703079B (zh) 2019-11-21 2019-11-21 輸送裝置
JP2019236363A JP6924815B2 (ja) 2019-11-21 2019-12-26 搬送装置
KR1020190176016A KR102335275B1 (ko) 2019-11-21 2019-12-27 반송 장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW108142321A TWI703079B (zh) 2019-11-21 2019-11-21 輸送裝置

Publications (2)

Publication Number Publication Date
TWI703079B true TWI703079B (zh) 2020-09-01
TW202120409A TW202120409A (zh) 2021-06-01

Family

ID=73644022

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108142321A TWI703079B (zh) 2019-11-21 2019-11-21 輸送裝置

Country Status (3)

Country Link
JP (1) JP6924815B2 (ja)
KR (1) KR102335275B1 (ja)
TW (1) TWI703079B (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204935651U (zh) * 2015-09-07 2016-01-06 深圳市科精诚印刷机械制造有限公司 多关节机械手

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6357089U (ja) * 1986-10-03 1988-04-16
JPH0492446A (ja) * 1990-08-07 1992-03-25 Plasma Syst:Kk 基板搬送ロボット
JP2000176876A (ja) * 1998-12-10 2000-06-27 Komatsu Ltd ワーク搬送装置およびワーク搬送装置の姿勢保持方法
JP2002093881A (ja) * 2000-09-19 2002-03-29 Rorze Corp 基板搬送用ロボット
JP2002166376A (ja) * 2000-11-30 2002-06-11 Hirata Corp 基板搬送用ロボット
KR100350239B1 (ko) 2000-12-28 2002-08-27 한국과학기술원 집적 시스템을 위한 기판 구조 및 그 제조방법
JP4245387B2 (ja) * 2003-03-19 2009-03-25 東京エレクトロン株式会社 基板搬送装置及び基板処理装置
KR20130096072A (ko) * 2012-02-21 2013-08-29 삼성전자주식회사 기판 반송 장치
WO2013146763A1 (ja) * 2012-03-29 2013-10-03 株式会社ｉＺＡ 多関節ロボット、搬送装置
JP5545337B2 (ja) * 2012-09-28 2014-07-09 株式会社安川電機 ロボットアームおよびロボット
JP5990359B2 (ja) * 2012-10-04 2016-09-14 平田機工株式会社 搬入出ロボット

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN204935651U (zh) * 2015-09-07 2016-01-06 深圳市科精诚印刷机械制造有限公司 多关节机械手

Also Published As

Publication number Publication date
TW202120409A (zh) 2021-06-01
KR20210063178A (ko) 2021-06-01
JP2021079526A (ja) 2021-05-27
JP6924815B2 (ja) 2021-08-25
KR102335275B1 (ko) 2021-12-06

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