KR102324898B1 - 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치 - Google Patents
수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치 Download PDFInfo
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- KR102324898B1 KR102324898B1 KR1020187033291A KR20187033291A KR102324898B1 KR 102324898 B1 KR102324898 B1 KR 102324898B1 KR 1020187033291 A KR1020187033291 A KR 1020187033291A KR 20187033291 A KR20187033291 A KR 20187033291A KR 102324898 B1 KR102324898 B1 KR 102324898B1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
- C08F290/14—Polymers provided for in subclass C08G
- C08F290/144—Polymers containing more than one epoxy group per molecule
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3218—Carbocyclic compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4042—Imines; Imides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/032—Organic insulating material consisting of one material
- H05K1/0326—Organic insulating material consisting of one material containing O
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Materials For Photolithography (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2016-128722 | 2016-06-29 | ||
JP2016128722 | 2016-06-29 | ||
JPJP-P-2017-013316 | 2017-01-27 | ||
JP2017013316 | 2017-01-27 | ||
PCT/JP2017/018045 WO2018003314A1 (ja) | 2016-06-29 | 2017-05-12 | 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20190022480A KR20190022480A (ko) | 2019-03-06 |
KR102324898B1 true KR102324898B1 (ko) | 2021-11-10 |
Family
ID=60785117
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020187033291A KR102324898B1 (ko) | 2016-06-29 | 2017-05-12 | 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP6913305B2 (zh) |
KR (1) | KR102324898B1 (zh) |
CN (1) | CN109415491B (zh) |
TW (1) | TWI744332B (zh) |
WO (1) | WO2018003314A1 (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7322877B2 (ja) * | 2018-06-01 | 2023-08-08 | 三菱瓦斯化学株式会社 | 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板 |
JPWO2021117764A1 (zh) * | 2019-12-11 | 2021-06-17 | ||
KR102454135B1 (ko) * | 2021-05-27 | 2022-10-14 | 한국화학연구원 | 지방산 개질된 산 무수물기반 에폭시 화합물을 포함하는 이액형 에폭시 접착제 조성물 및 이로부터 제조된 경화물 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009132780A (ja) * | 2007-11-29 | 2009-06-18 | Sumitomo Bakelite Co Ltd | 回路板用樹脂組成物、支持基材付き絶縁層、積層板及び回路板 |
JP2011256271A (ja) * | 2010-06-09 | 2011-12-22 | Jnc Corp | 硬化性組成物およびその用途、ならびに新規化合物 |
WO2013115069A1 (ja) | 2012-01-31 | 2013-08-08 | 三菱瓦斯化学株式会社 | プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板 |
WO2016088744A1 (ja) * | 2014-12-01 | 2016-06-09 | 三菱瓦斯化学株式会社 | 樹脂シート及びプリント配線板 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4514011B2 (ja) * | 2001-09-13 | 2010-07-28 | 日本化薬株式会社 | 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物 |
JP2005062450A (ja) | 2003-08-12 | 2005-03-10 | Kyocera Chemical Corp | 感光性熱硬化型樹脂組成物 |
JP2007211143A (ja) * | 2006-02-09 | 2007-08-23 | Sumitomo Bakelite Co Ltd | 樹脂組成物、カバーレイフィルム、および金属張積層板。 |
US20110189432A1 (en) | 2008-07-29 | 2011-08-04 | Sekisui Chemical Co., Ltd. | Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate |
SG184504A1 (en) * | 2010-04-08 | 2012-11-29 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, and laminated sheet |
KR101900125B1 (ko) * | 2011-07-14 | 2018-09-18 | 미츠비시 가스 가가쿠 가부시키가이샤 | 프린트 배선판용 수지 조성물 |
JP2013079326A (ja) * | 2011-10-04 | 2013-05-02 | Adeka Corp | 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ |
SG11201509490PA (en) * | 2013-06-03 | 2015-12-30 | Mitsubishi Gas Chemical Co | Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same |
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2017
- 2017-05-12 KR KR1020187033291A patent/KR102324898B1/ko active IP Right Grant
- 2017-05-12 JP JP2018524943A patent/JP6913305B2/ja active Active
- 2017-05-12 WO PCT/JP2017/018045 patent/WO2018003314A1/ja active Application Filing
- 2017-05-12 CN CN201780040875.6A patent/CN109415491B/zh active Active
- 2017-05-24 TW TW106117074A patent/TWI744332B/zh active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009132780A (ja) * | 2007-11-29 | 2009-06-18 | Sumitomo Bakelite Co Ltd | 回路板用樹脂組成物、支持基材付き絶縁層、積層板及び回路板 |
JP2011256271A (ja) * | 2010-06-09 | 2011-12-22 | Jnc Corp | 硬化性組成物およびその用途、ならびに新規化合物 |
WO2013115069A1 (ja) | 2012-01-31 | 2013-08-08 | 三菱瓦斯化学株式会社 | プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板 |
WO2016088744A1 (ja) * | 2014-12-01 | 2016-06-09 | 三菱瓦斯化学株式会社 | 樹脂シート及びプリント配線板 |
Also Published As
Publication number | Publication date |
---|---|
WO2018003314A1 (ja) | 2018-01-04 |
JP6913305B2 (ja) | 2021-08-04 |
KR20190022480A (ko) | 2019-03-06 |
TWI744332B (zh) | 2021-11-01 |
CN109415491A (zh) | 2019-03-01 |
TW201800473A (zh) | 2018-01-01 |
CN109415491B (zh) | 2022-05-03 |
JPWO2018003314A1 (ja) | 2019-04-18 |
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