KR102324898B1 - 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치 - Google Patents

수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치 Download PDF

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KR102324898B1
KR102324898B1 KR1020187033291A KR20187033291A KR102324898B1 KR 102324898 B1 KR102324898 B1 KR 102324898B1 KR 1020187033291 A KR1020187033291 A KR 1020187033291A KR 20187033291 A KR20187033291 A KR 20187033291A KR 102324898 B1 KR102324898 B1 KR 102324898B1
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South Korea
Prior art keywords
resin
group
compound
resin composition
mass
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KR1020187033291A
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English (en)
Korean (ko)
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KR20190022480A (ko
Inventor
신야 기타무라
다쿠야 스즈키
세이지 시카
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미츠비시 가스 가가쿠 가부시키가이샤
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Publication of KR20190022480A publication Critical patent/KR20190022480A/ko
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Publication of KR102324898B1 publication Critical patent/KR102324898B1/ko

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/08—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated side groups
    • C08F290/14—Polymers provided for in subclass C08G
    • C08F290/144—Polymers containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3218—Carbocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4014—Nitrogen containing compounds
    • C08G59/4042—Imines; Imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Epoxy Resins (AREA)
  • Materials For Photolithography (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
KR1020187033291A 2016-06-29 2017-05-12 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치 KR102324898B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JPJP-P-2016-128722 2016-06-29
JP2016128722 2016-06-29
JPJP-P-2017-013316 2017-01-27
JP2017013316 2017-01-27
PCT/JP2017/018045 WO2018003314A1 (ja) 2016-06-29 2017-05-12 樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置

Publications (2)

Publication Number Publication Date
KR20190022480A KR20190022480A (ko) 2019-03-06
KR102324898B1 true KR102324898B1 (ko) 2021-11-10

Family

ID=60785117

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187033291A KR102324898B1 (ko) 2016-06-29 2017-05-12 수지 조성물, 수지 시트, 다층 프린트 배선판 및 반도체 장치

Country Status (5)

Country Link
JP (1) JP6913305B2 (zh)
KR (1) KR102324898B1 (zh)
CN (1) CN109415491B (zh)
TW (1) TWI744332B (zh)
WO (1) WO2018003314A1 (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7322877B2 (ja) * 2018-06-01 2023-08-08 三菱瓦斯化学株式会社 樹脂組成物、プリプレグ、金属箔張積層板、樹脂シート、及びプリント配線板
JPWO2021117764A1 (zh) * 2019-12-11 2021-06-17
KR102454135B1 (ko) * 2021-05-27 2022-10-14 한국화학연구원 지방산 개질된 산 무수물기반 에폭시 화합물을 포함하는 이액형 에폭시 접착제 조성물 및 이로부터 제조된 경화물

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009132780A (ja) * 2007-11-29 2009-06-18 Sumitomo Bakelite Co Ltd 回路板用樹脂組成物、支持基材付き絶縁層、積層板及び回路板
JP2011256271A (ja) * 2010-06-09 2011-12-22 Jnc Corp 硬化性組成物およびその用途、ならびに新規化合物
WO2013115069A1 (ja) 2012-01-31 2013-08-08 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
WO2016088744A1 (ja) * 2014-12-01 2016-06-09 三菱瓦斯化学株式会社 樹脂シート及びプリント配線板

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4514011B2 (ja) * 2001-09-13 2010-07-28 日本化薬株式会社 樹脂組成物、ソルダーレジスト樹脂組成物及びこれらの硬化物
JP2005062450A (ja) 2003-08-12 2005-03-10 Kyocera Chemical Corp 感光性熱硬化型樹脂組成物
JP2007211143A (ja) * 2006-02-09 2007-08-23 Sumitomo Bakelite Co Ltd 樹脂組成物、カバーレイフィルム、および金属張積層板。
US20110189432A1 (en) 2008-07-29 2011-08-04 Sekisui Chemical Co., Ltd. Epoxy resin composition, prepreg, cured body, sheet-like molded body, laminate and multilayer laminate
SG184504A1 (en) * 2010-04-08 2012-11-29 Mitsubishi Gas Chemical Co Resin composition, prepreg, and laminated sheet
KR101900125B1 (ko) * 2011-07-14 2018-09-18 미츠비시 가스 가가쿠 가부시키가이샤 프린트 배선판용 수지 조성물
JP2013079326A (ja) * 2011-10-04 2013-05-02 Adeka Corp 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ
SG11201509490PA (en) * 2013-06-03 2015-12-30 Mitsubishi Gas Chemical Co Resin composition for printed wiring board material and prepreg, resin sheet, metal foil-clad laminate, and printed wiring board using the same

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009132780A (ja) * 2007-11-29 2009-06-18 Sumitomo Bakelite Co Ltd 回路板用樹脂組成物、支持基材付き絶縁層、積層板及び回路板
JP2011256271A (ja) * 2010-06-09 2011-12-22 Jnc Corp 硬化性組成物およびその用途、ならびに新規化合物
WO2013115069A1 (ja) 2012-01-31 2013-08-08 三菱瓦斯化学株式会社 プリント配線板材料用樹脂組成物、並びにそれを用いたプリプレグ、樹脂シート、金属箔張積層板及びプリント配線板
WO2016088744A1 (ja) * 2014-12-01 2016-06-09 三菱瓦斯化学株式会社 樹脂シート及びプリント配線板

Also Published As

Publication number Publication date
WO2018003314A1 (ja) 2018-01-04
JP6913305B2 (ja) 2021-08-04
KR20190022480A (ko) 2019-03-06
TWI744332B (zh) 2021-11-01
CN109415491A (zh) 2019-03-01
TW201800473A (zh) 2018-01-01
CN109415491B (zh) 2022-05-03
JPWO2018003314A1 (ja) 2019-04-18

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