KR102320910B1 - 카메라 모듈, 감광성 어셈블리, 감광성 어셈블리 맞춤판 및 이의 성형 다이와 제조방법 - Google Patents

카메라 모듈, 감광성 어셈블리, 감광성 어셈블리 맞춤판 및 이의 성형 다이와 제조방법 Download PDF

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KR102320910B1
KR102320910B1 KR1020207009642A KR20207009642A KR102320910B1 KR 102320910 B1 KR102320910 B1 KR 102320910B1 KR 1020207009642 A KR1020207009642 A KR 1020207009642A KR 20207009642 A KR20207009642 A KR 20207009642A KR 102320910 B1 KR102320910 B1 KR 102320910B1
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photosensitive
molding
photosensitive element
partial
circuit board
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Korean (ko)
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KR20200042003A (ko
Inventor
다케히코 다나카
보지에 자오
저웬 메이
난 구오
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닝보 써니 오포테크 코., 엘티디.
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Priority claimed from CN201710895910.4A external-priority patent/CN109585464B/zh
Priority claimed from CN201721262500.8U external-priority patent/CN207765446U/zh
Application filed by 닝보 써니 오포테크 코., 엘티디. filed Critical 닝보 써니 오포테크 코., 엘티디.
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    • H04N5/2253—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/803—Pixels having integrated switching, control, storage or amplification elements
    • H10F39/8033—Photosensitive area
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H04N5/2257—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8057—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Camera Bodies And Camera Details Or Accessories (AREA)
  • Studio Devices (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Blocking Light For Cameras (AREA)
KR1020207009642A 2017-09-28 2018-09-19 카메라 모듈, 감광성 어셈블리, 감광성 어셈블리 맞춤판 및 이의 성형 다이와 제조방법 Active KR102320910B1 (ko)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
CN201721262500.8 2017-09-28
CN201710895910.4A CN109585464B (zh) 2017-09-28 2017-09-28 摄像模组及其感光组件和制造方法
CN201721262500.8U CN207765446U (zh) 2017-09-28 2017-09-28 摄像模组及其感光组件和电子设备
CN201710895910.4 2017-09-28
PCT/CN2018/106351 WO2019062609A1 (zh) 2017-09-28 2018-09-19 摄像模组、感光组件、感光组件拼板及其成型模具和制造方法

Publications (2)

Publication Number Publication Date
KR20200042003A KR20200042003A (ko) 2020-04-22
KR102320910B1 true KR102320910B1 (ko) 2021-11-02

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Country Link
US (3) US11315967B2 (cg-RX-API-DMAC7.html)
EP (2) EP4220724B1 (cg-RX-API-DMAC7.html)
JP (1) JP7042335B2 (cg-RX-API-DMAC7.html)
KR (1) KR102320910B1 (cg-RX-API-DMAC7.html)
TW (1) TWI734028B (cg-RX-API-DMAC7.html)
WO (1) WO2019062609A1 (cg-RX-API-DMAC7.html)

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US20210321025A1 (en) * 2018-08-21 2021-10-14 Ningbo Sunny Opotech Co., Ltd. Camera module and molded photosensitive assembly and manufacturing methods thereof, and electronic device
CN110412540B (zh) * 2019-07-30 2022-05-13 Oppo广东移动通信有限公司 光发射模组、飞行时间相机和电子装置
TWI766450B (zh) * 2020-05-13 2022-06-01 大陸商廣州立景創新科技有限公司 影像擷取模組及其組裝方法
US11808950B2 (en) * 2020-09-24 2023-11-07 Apple Inc. Camera with a multi-material base structure
CN114257714B (zh) * 2020-09-25 2024-08-06 宁波舜宇光电信息有限公司 感光组件、摄像模组和感光组件的制备方法
WO2022130776A1 (ja) * 2020-12-16 2022-06-23 ソニーセミコンダクタソリューションズ株式会社 光検出装置、光検出システム、電子機器および移動体
CN112954163B (zh) * 2021-02-05 2022-08-23 南昌欧菲光电技术有限公司 光传感模组、摄像模组及电子设备
US12126884B1 (en) * 2021-06-02 2024-10-22 Apple Inc. Substrate to place components for camera size reduction
CN113747021B (zh) * 2021-09-08 2023-06-20 维沃移动通信有限公司 潜望式摄像模组和电子设备

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CN207765446U (zh) * 2017-09-28 2018-08-24 宁波舜宇光电信息有限公司 摄像模组及其感光组件和电子设备

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TWI734028B (zh) 2021-07-21
EP4220724A2 (en) 2023-08-02
JP7042335B2 (ja) 2022-03-25
US20230253423A1 (en) 2023-08-10
KR20200042003A (ko) 2020-04-22
EP3691241A4 (en) 2020-10-14
US11881491B2 (en) 2024-01-23
EP3691241A1 (en) 2020-08-05
EP4220724B1 (en) 2025-04-23
US20200286933A1 (en) 2020-09-10
US11315967B2 (en) 2022-04-26
US20220223633A1 (en) 2022-07-14
US11664397B2 (en) 2023-05-30
WO2019062609A1 (zh) 2019-04-04
EP4220724A3 (en) 2023-09-13
JP2020535041A (ja) 2020-12-03
EP3691241B1 (en) 2023-05-10
TW201915586A (zh) 2019-04-16

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