KR102317299B1 - 가교된 실리콘 수지, 필름, 전자 디바이스 및 관련 방법 - Google Patents

가교된 실리콘 수지, 필름, 전자 디바이스 및 관련 방법 Download PDF

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KR102317299B1
KR102317299B1 KR1020197010263A KR20197010263A KR102317299B1 KR 102317299 B1 KR102317299 B1 KR 102317299B1 KR 1020197010263 A KR1020197010263 A KR 1020197010263A KR 20197010263 A KR20197010263 A KR 20197010263A KR 102317299 B1 KR102317299 B1 KR 102317299B1
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silicone resin
group
film
crosslinked silicone
independently
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Korean (ko)
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KR20190051027A (ko
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펭-페이 푸
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다우 실리콘즈 코포레이션
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C08G77/52—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages containing aromatic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/14—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/46—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes silicones
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Silicon Polymers (AREA)
KR1020197010263A 2016-09-30 2017-09-29 가교된 실리콘 수지, 필름, 전자 디바이스 및 관련 방법 Active KR102317299B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201662402282P 2016-09-30 2016-09-30
US62/402,282 2016-09-30
PCT/US2017/054435 WO2018064543A1 (en) 2016-09-30 2017-09-29 Bridged silicone resin, film, electronic device and related methods

Publications (2)

Publication Number Publication Date
KR20190051027A KR20190051027A (ko) 2019-05-14
KR102317299B1 true KR102317299B1 (ko) 2021-10-26

Family

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Application Number Title Priority Date Filing Date
KR1020197010263A Active KR102317299B1 (ko) 2016-09-30 2017-09-29 가교된 실리콘 수지, 필름, 전자 디바이스 및 관련 방법

Country Status (6)

Country Link
US (1) US10793680B2 (https=)
JP (1) JP7273710B2 (https=)
KR (1) KR102317299B1 (https=)
CN (1) CN109715707B (https=)
TW (1) TWI747956B (https=)
WO (1) WO2018064543A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6447557B2 (ja) * 2016-03-24 2019-01-09 日亜化学工業株式会社 発光装置の製造方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007051152A (ja) * 1992-09-16 2007-03-01 Ck Witco Corp 柔軟な有機及び堅い無機部分を含む化合物の前駆体及びその製造法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3159601A (en) 1962-07-02 1964-12-01 Gen Electric Platinum-olefin complex catalyzed addition of hydrogen- and alkenyl-substituted siloxanes
US3296291A (en) 1962-07-02 1967-01-03 Gen Electric Reaction of silanes with unsaturated olefinic compounds
US3220972A (en) 1962-07-02 1965-11-30 Gen Electric Organosilicon process using a chloroplatinic acid reaction product as the catalyst
NL131800C (https=) 1965-05-17
US3516946A (en) 1967-09-29 1970-06-23 Gen Electric Platinum catalyst composition for hydrosilation reactions
US3814730A (en) 1970-08-06 1974-06-04 Gen Electric Platinum complexes of unsaturated siloxanes and platinum containing organopolysiloxanes
GB1476314A (en) 1973-06-23 1977-06-10 Dow Corning Ltd Coating process
US3989668A (en) 1975-07-14 1976-11-02 Dow Corning Corporation Method of making a silicone elastomer and the elastomer prepared thereby
FR2414519A1 (fr) 1978-01-16 1979-08-10 Rhone Poulenc Ind Copolymeres organopolysiloxaniques polysequences cristallins et leurs procedes de preparation
US5036117A (en) 1989-11-03 1991-07-30 Dow Corning Corporation Heat-curable silicone compositions having improved bath life
GB9103191D0 (en) 1991-02-14 1991-04-03 Dow Corning Platinum complexes and use thereof
EP0661331B1 (en) 1993-12-28 2001-05-23 Kanegafuchi Chemical Industry Co., Ltd. Silicon-containing polymer, process for preparing the same and monomer thereof
JP2000265065A (ja) 1999-03-17 2000-09-26 Dow Corning Asia Ltd 有機溶剤可溶性の水素化オクタシルセスキオキサン−ビニル基含有化合物共重合体の製造方法
US6252030B1 (en) * 1999-03-17 2001-06-26 Dow Corning Asia, Ltd. Hydrogenated octasilsesquioxane-vinyl group-containing copolymer and method for manufacture
US6368535B1 (en) * 1999-08-06 2002-04-09 Dow Corning Corporation Condensation reaction curable silsesquioxane resin composition and methods for the synthesis and cure thereof
JP2001214127A (ja) * 2000-01-31 2001-08-07 Dow Corning Toray Silicone Co Ltd 電気絶縁性薄膜形成性樹脂組成物、および電気絶縁性薄膜の形成方法
US6710450B2 (en) * 2001-02-28 2004-03-23 International Business Machines Corporation Interconnect structure with precise conductor resistance and method to form same
JP3757264B2 (ja) * 2001-03-27 2006-03-22 独立行政法人産業技術総合研究所 シルセスキオキサン系ポリマー成形体及びその製造方法
US6605734B2 (en) 2001-12-07 2003-08-12 Dow Corning Corporation Alkene-platinum-silyl complexes
JP4050631B2 (ja) * 2003-02-21 2008-02-20 株式会社ルネサステクノロジ 電子デバイスの製造方法
US7019100B2 (en) 2003-04-23 2006-03-28 Shin-Etsu Chemical Co., Ltd. Curable silicone resin composition
JP4338554B2 (ja) 2003-04-23 2009-10-07 信越化学工業株式会社 硬化性シリコーン樹脂組成物
WO2006065316A1 (en) 2004-12-17 2006-06-22 Dow Corning Corporation Method for forming anti-reflective coating
US9440869B2 (en) * 2005-09-30 2016-09-13 Abs Materials, Inc. Sol-gel derived compositions
JP2011510133A (ja) 2008-01-15 2011-03-31 ダウ・コーニング・コーポレイション シルセスキオキサン樹脂
WO2009111199A1 (en) 2008-03-04 2009-09-11 Dow Corning Corporation Silicone composition, silicone adhesive, coated and laminated substrates
US8026331B2 (en) 2009-04-21 2011-09-27 The United States Of America As Represented By The Secretary Of The Navy Polymers made from polyhedral oligomeric silsesquioxanes and diacetylene-containing compounds
KR101030019B1 (ko) * 2009-12-31 2011-04-20 제일모직주식회사 봉지재용 투광성 수지 및 이를 포함하는 전자 소자
JP5972544B2 (ja) * 2011-09-09 2016-08-17 株式会社カネカ オルガノポリシロキサン系組成物および硬化物
US8492208B1 (en) * 2012-01-05 2013-07-23 International Business Machines Corporation Compressive (PFET) and tensile (NFET) channel strain in nanowire FETs fabricated with a replacement gate process
CN104081282B (zh) * 2012-02-01 2019-07-30 日产化学工业株式会社 使用溶剂显影用形成含硅抗蚀剂下层膜的组合物的半导体装置的制造方法
JP2014205823A (ja) * 2013-03-21 2014-10-30 株式会社Adeka ケイ素含有硬化性組成物
JP5587520B1 (ja) 2013-05-08 2014-09-10 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 画像表示装置用のダム材組成物、及びそれを用いた画像表示装置
KR102289082B1 (ko) * 2014-08-13 2021-08-13 에스케이이노베이션 주식회사 하드코팅층 형성용 조성물

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007051152A (ja) * 1992-09-16 2007-03-01 Ck Witco Corp 柔軟な有機及び堅い無機部分を含む化合物の前駆体及びその製造法

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Publication number Publication date
CN109715707A (zh) 2019-05-03
TW201829557A (zh) 2018-08-16
JP2019529642A (ja) 2019-10-17
TWI747956B (zh) 2021-12-01
CN109715707B (zh) 2021-05-25
US10793680B2 (en) 2020-10-06
KR20190051027A (ko) 2019-05-14
JP7273710B2 (ja) 2023-05-15
US20200172679A1 (en) 2020-06-04
WO2018064543A1 (en) 2018-04-05

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