KR102308377B1 - 임프린트 장치 및 물품 제조 방법 - Google Patents

임프린트 장치 및 물품 제조 방법 Download PDF

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Publication number
KR102308377B1
KR102308377B1 KR1020180051062A KR20180051062A KR102308377B1 KR 102308377 B1 KR102308377 B1 KR 102308377B1 KR 1020180051062 A KR1020180051062 A KR 1020180051062A KR 20180051062 A KR20180051062 A KR 20180051062A KR 102308377 B1 KR102308377 B1 KR 102308377B1
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KR
South Korea
Prior art keywords
gas
supply
substrate
imprint
mold
Prior art date
Application number
KR1020180051062A
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English (en)
Korean (ko)
Other versions
KR20180125389A (ko
Inventor
게이지 야마시타
게이코 치바
Original Assignee
캐논 가부시끼가이샤
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Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20180125389A publication Critical patent/KR20180125389A/ko
Application granted granted Critical
Publication of KR102308377B1 publication Critical patent/KR102308377B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
KR1020180051062A 2017-05-15 2018-05-03 임프린트 장치 및 물품 제조 방법 KR102308377B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-096538 2017-05-15
JP2017096538A JP6978853B2 (ja) 2017-05-15 2017-05-15 インプリント装置、及び物品製造方法

Publications (2)

Publication Number Publication Date
KR20180125389A KR20180125389A (ko) 2018-11-23
KR102308377B1 true KR102308377B1 (ko) 2021-10-06

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180051062A KR102308377B1 (ko) 2017-05-15 2018-05-03 임프린트 장치 및 물품 제조 방법

Country Status (2)

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JP (1) JP6978853B2 (ja)
KR (1) KR102308377B1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7149872B2 (ja) * 2019-02-14 2022-10-07 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
WO2024087905A1 (zh) * 2022-10-25 2024-05-02 隆基绿能科技股份有限公司 激光转印方法和设备、太阳能电池

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039057A (ja) 2010-07-13 2012-02-23 Canon Inc インプリント装置及び物品の製造方法
JP2014056854A (ja) 2012-09-11 2014-03-27 Dainippon Printing Co Ltd インプリント方法およびそれを実施するためのインプリント装置
JP2014060385A (ja) 2012-08-24 2014-04-03 Canon Inc インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP2016111201A (ja) * 2014-12-05 2016-06-20 キヤノン株式会社 インプリント装置、および物品の製造方法
JP2016201485A (ja) * 2015-04-13 2016-12-01 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3700001B2 (ja) 2002-09-10 2005-09-28 独立行政法人産業技術総合研究所 インプリント方法及び装置
US8211214B2 (en) 2003-10-02 2012-07-03 Molecular Imprints, Inc. Single phase fluid imprint lithography method
JP5828626B2 (ja) * 2010-10-04 2015-12-09 キヤノン株式会社 インプリント方法
JP5882922B2 (ja) * 2012-01-19 2016-03-09 キヤノン株式会社 インプリント方法、およびインプリント装置
WO2014112495A1 (ja) * 2013-01-17 2014-07-24 キヤノン株式会社 インプリント方法、およびインプリント装置
JP5865332B2 (ja) * 2013-11-01 2016-02-17 キヤノン株式会社 インプリント装置、物品の製造方法、及びインプリント方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012039057A (ja) 2010-07-13 2012-02-23 Canon Inc インプリント装置及び物品の製造方法
JP2014060385A (ja) 2012-08-24 2014-04-03 Canon Inc インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP2014056854A (ja) 2012-09-11 2014-03-27 Dainippon Printing Co Ltd インプリント方法およびそれを実施するためのインプリント装置
JP2016111201A (ja) * 2014-12-05 2016-06-20 キヤノン株式会社 インプリント装置、および物品の製造方法
JP2016201485A (ja) * 2015-04-13 2016-12-01 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法

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Publication number Publication date
KR20180125389A (ko) 2018-11-23
JP6978853B2 (ja) 2021-12-08
JP2018195639A (ja) 2018-12-06

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