KR102302724B1 - 기판 라우팅 및 스루풋 모델링을 위한 그래픽 처리 유닛의 사용 - Google Patents

기판 라우팅 및 스루풋 모델링을 위한 그래픽 처리 유닛의 사용 Download PDF

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KR102302724B1
KR102302724B1 KR1020217001978A KR20217001978A KR102302724B1 KR 102302724 B1 KR102302724 B1 KR 102302724B1 KR 1020217001978 A KR1020217001978 A KR 1020217001978A KR 20217001978 A KR20217001978 A KR 20217001978A KR 102302724 B1 KR102302724 B1 KR 102302724B1
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processing
semiconductor substrates
parallel
batch
gpu
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KR20210021564A (ko
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샴 순더 에마니
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어플라이드 머티어리얼스, 인코포레이티드
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Programme-control systems
    • G05B19/02—Programme-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T1/00—General purpose image data processing
    • G06T1/20—Processor architectures; Processor configuration, e.g. pipelining
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/34—Director, elements to supervisory
    • G05B2219/34417—Multiprocessor scheduling
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/35—Nc in input of data, input till input file format
    • G05B2219/35499—Model of process, machine and parameters
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2200/00—Indexing scheme for image data processing or generation, in general
    • G06T2200/28—Indexing scheme for image data processing or generation, in general involving image processing hardware
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Automation & Control Theory (AREA)
  • Theoretical Computer Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Factory Administration (AREA)
  • Drying Of Semiconductors (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
KR1020217001978A 2018-06-22 2019-06-21 기판 라우팅 및 스루풋 모델링을 위한 그래픽 처리 유닛의 사용 Active KR102302724B1 (ko)

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KR1020217028894A KR102482316B1 (ko) 2018-06-22 2019-06-21 기판 라우팅 및 스루풋 모델링을 위한 그래픽 처리 유닛의 사용

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/015,302 2018-06-22
US16/015,302 US10698392B2 (en) 2018-06-22 2018-06-22 Using graphics processing unit for substrate routing and throughput modeling
PCT/US2019/038586 WO2019246588A1 (en) 2018-06-22 2019-06-21 Using graphics processing unit for substrate routing and throughput modeling

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KR1020217028894A Division KR102482316B1 (ko) 2018-06-22 2019-06-21 기판 라우팅 및 스루풋 모델링을 위한 그래픽 처리 유닛의 사용

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KR20210021564A KR20210021564A (ko) 2021-02-26
KR102302724B1 true KR102302724B1 (ko) 2021-09-14

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KR1020217028894A Active KR102482316B1 (ko) 2018-06-22 2019-06-21 기판 라우팅 및 스루풋 모델링을 위한 그래픽 처리 유닛의 사용

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US (2) US10698392B2 (enExample)
JP (2) JP6923766B1 (enExample)
KR (2) KR102302724B1 (enExample)
CN (2) CN114895638B (enExample)
TW (2) TWI780002B (enExample)
WO (1) WO2019246588A1 (enExample)

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US11901204B2 (en) 2020-05-22 2024-02-13 Applied Materials, Inc. Predictive wafer scheduling for multi-chamber semiconductor equipment
US11437254B2 (en) 2020-06-24 2022-09-06 Applied Materials, Inc. Sequencer time leaping execution
US11385628B2 (en) * 2020-06-24 2022-07-12 Applied Materials, Inc. Scheduling substrate routing and processing

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Publication number Publication date
JP7136977B2 (ja) 2022-09-13
JP2022000891A (ja) 2022-01-04
WO2019246588A1 (en) 2019-12-26
KR20210021564A (ko) 2021-02-26
US10698392B2 (en) 2020-06-30
CN114895638B (zh) 2023-04-07
CN112292748B (zh) 2022-05-24
US11275360B2 (en) 2022-03-15
KR20210112421A (ko) 2021-09-14
KR102482316B1 (ko) 2022-12-27
JP6923766B1 (ja) 2021-08-25
TWI758613B (zh) 2022-03-21
US20200326691A1 (en) 2020-10-15
TWI780002B (zh) 2022-10-01
CN112292748A (zh) 2021-01-29
CN114895638A (zh) 2022-08-12
JP2021522695A (ja) 2021-08-30
TW202223566A (zh) 2022-06-16
US20190391569A1 (en) 2019-12-26
TW202001634A (zh) 2020-01-01

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