KR102298194B1 - CMP polishing pad manufacturer device - Google Patents

Abstract

The present invention relates to an apparatus for manufacturing a CMP polishing pad, which can automatically perform each process and allows the minimum number of people to be involved, when manufacturing a CMP polishing pad. The apparatus comprises: a loading unit for picking up raw materials from a cart on which any one of a CMP pad, non-woven fabric, a first bonding material, a second bonding material, and a third bonding material are loaded, and placing the picked raw materials on a first conveyor; a shuttle disposed on the first conveyor, and for transporting the raw materials seated on the first conveyor; a bonding unit for bonding a hot melt and an undersheet to the raw materials transported by the shuttle and transporting the same; a cutting unit disposed on one side of the bonding unit, and for cutting the bonded hot melt and undersheet, and transporting the same to a second conveyor; and an unloading unit for picking up the cut raw materials transported to the second conveyor and placing the same on the cart.

Description

CMP polishing pad manufacturer device

The present invention relates to an apparatus for manufacturing a CMP polishing pad, and more particularly, to an apparatus for manufacturing a CMP polishing pad in which a minimum number of personnel is input while automatically performing each process when manufacturing a CMP polishing pad.

In general, a CMP (Chemical Mechanical Polishing) process is used to polish the surface of a specific workpiece in many industrial fields. In particular, in the field of manufacturing semiconductor devices, microelectronic devices, or computer products, CMP polishing pads are used to polish ceramics, silicon, glass, quartz, metals, and/or wafers thereof.

That is, in the CMP polishing pad, while supplying a slurry composition including abrasive particles and various chemical components between the CMP pad and the semiconductor substrate, the semiconductor substrate and the CMP pad are brought into contact with the CMP pad and they are relatively moved, so that the polishing target film on the substrate is formed with abrasive particles, etc. While mechanically polishing, the polishing target film is chemically polished by the action of the above chemical components.

However, in the conventional bonding of CMP polishing pads, since the 1st to 4th processes using four bonding devices are performed manually, input, discharge, and hot melt cutting of raw materials in each of the 1st, 2nd, and 4th processes A fatal problem in that the labor cost is greatly increased compared to the productivity of the CMP polishing pad, because 9 workers are input for 3 workers, and 2 workers are input for the input and discharge of raw materials in the tertiary process, so a total of 11 workers are needed. there is

Domestic Registered Patent No. 10-1509590

The present invention has been devised to solve the above problems and technical biases, and provides an apparatus for manufacturing a CMP polishing pad that automatically performs input, discharge, hot melt supply, and cutting of raw materials in each process while inputting a minimum number of personnel. It is intended to

The CMP polishing pad manufacturing apparatus of the present invention for achieving the above object is, a loading unit to be seated on the first conveyor; a shuttle disposed on the first conveyor and transporting the raw material seated on the first conveyor; a bonding unit for bonding the hot melt and the undersheet to the raw material conveyed by the shuttle and conveying the bonding unit; a cutting unit disposed on one side of the bonding unit, cutting the bonded hot melt and the undersheet, and transferring the bonding unit to a second conveyor; and an unloading unit that picks up the cut raw material transferred to the second conveyor and places it on the bogie.

In this case, the loading unit and the unloading unit, a Z-axis robot installed movably in the X-axis direction on the X-axis robot, and a lifting platform for lifting and lowering in the Z-axis direction; and a pickup means fixed to the elevator platform and picking up the raw material.

In addition, the pick-up means, a plurality of pick-up bars that are disposed below the elevator and extend to a predetermined length; and a plurality of vacuum pads disposed along the longitudinal direction of the pickup bar and configured to pick up the raw material.

In addition, the shuttle is preferably installed movably on the loading Y-axis robot disposed along the first conveyor so as to transfer the raw material seated on the first conveyor to the cementation unit.

On the other hand, the bonding unit, the upper roller and the lower roller rotating in a state arranged adjacent to each other to pressurize the raw material to be transported; a pair of diaphragms supporting both sides of the upper and lower rollers; and a hot melt roller disposed above the upper roller and supplied between the upper roller and the lower roller to supply hot melt to be bonded to the raw material.

In this case, it is preferable that the upper roller and the lower roller are heating rollers for heating the hot melt so that the hot melt can adhere to the raw material during bonding.

And, it is preferable that the upper roller is raised and lowered.

In addition, a pair of elevating members installed on the diaphragm to enable elevating through the rail and supporting both sides of the upper roller; and a pair of elevating motors disposed directly above each elevating member through a rod, and elevating the elevating member.

At this time, it is preferable that a vertical load cell is further provided between the rod of the lifting motor and the lifting member to sense the pressure generated when the upper and lower rollers are in close contact due to the lowering of the lifting member.

In addition, it is preferable that an LVDT sensor for auto-teaching the parallelism of the upper roller is provided in each of the diaphragms when the upper roller and the lower roller are adjacent to each other.

On the other hand, it is preferable that an undersheet roller for supplying an undersheet to cover one side of the raw material when hot-melt bonding with the raw material is provided on the lower side of the lower roller.

And, it is preferable that a recovery roller for rewinding the protective film of the hot melt is provided on the upper side of the upper roller.

In addition, the cutting unit may include: an X-axis transfer robot disposed in the X-axis direction to ride on an unloading Y-axis robot disposed on both sides of the second conveyor; a cutting means which is movably installed in the X-axis transfer robot and cuts the hot melt and the undersheet discharged through the bonding unit; and a pair of first grippers installed to be individually movable in the Y-axis direction, maintaining tension when cutting the hot melt and the undersheet, gripping the cut hot melt and the undersheet, and sequentially transferring the hot melt and the undersheet to the second conveyor; It is preferable that it is composed of a second gripper.

At this time, the cutting means, a moving table that moves on the X-axis transfer robot; a chuck cylinder installed on the moving table; and a knife chucked in the chuck cylinder.

In addition, it is preferable that a toolbox provided with a plurality of knives for auto-changing the knives of the chuck cylinder is further provided on one side of the second conveyor.

Preferably, the first gripper is installed on both sides in the longitudinal direction of the X-axis transfer robot, and the second gripper is movably installed on each unloading Y-axis robot.

In this case, it is preferable that the X-axis transfer robot further includes a barcode attaching device for attaching a barcode to the surface of the completed CMP polishing pad.

In addition, on the lower surface of the X-axis transfer robot, when the second conveyor and the bonding unit are separated to replace the hot melt or undersheet, the hot melt passing through the bonding unit and one end of the undersheet are exposed so that one end can be drawn out. It is preferable that a slider is further provided.

In this case, the pull-out slider may include a housing fixed to the lower surface of the X-axis transfer robot; a first slider disposed inside the housing and drawn out toward the bonding unit by a first cylinder; and a second slider disposed inside the first slider, drawn out from the first slider in the direction of the bonding unit by a second cylinder, and to which one end of the hot melt and the undersheet are adhered.

In addition, it is preferable that the first conveyor and the second conveyor are detachably attached to both sides of the bonding unit.

Finally, in the CMP polishing pad manufacturing apparatus, the first to fourth CMP polishing pad manufacturing apparatuses are combined to form a set, and in the primary or secondary CMP polishing pad manufacturing apparatus, the first cementing material or The second bonding material is cemented, and in the tertiary CMP polishing pad manufacturing apparatus, the third bonding material is manufactured through the bonding of the first bonding material and the second bonding material, and in the quaternary CMP polishing pad manufacturing apparatus, the third bonding material is manufactured. It is preferable to attach double-sided tape to the ash.

According to the CMP polishing pad manufacturing apparatus of the present invention having the above configuration, the CMP polishing pad is manufactured through the fourth process, and input, discharge, hot melt supply and cutting of raw materials are automatically performed in each process, 3 There is an excellent effect that process control from the 1st to the 4th can be achieved through the number of people.

In addition, the structural effect of preventing the safety of workers due to the heated hot melt as the heated hot melt and the protective film are pulled out through the pull-out slider when the hot melt roller or under seat roller is replaced.

1 and 2 are perspective views showing an apparatus for manufacturing a CMP polishing pad according to the present invention;
Figure 3 is a plan view of Figures 1 and 2,
Figure 4 is a sectional view of the main part of Figure 3,
5 is a perspective view showing a first conveyor and a shuttle in the configuration of an apparatus for manufacturing a CMP polishing pad according to the present invention;
6 and 7 are perspective views in which a loading part and an unloading part are given in the configuration of the CMP polishing pad manufacturing apparatus according to the present invention;
8 and 9 are perspective views showing a bonding unit in the configuration of the CMP polishing pad manufacturing apparatus according to the present invention;
10 is a sectional view of the main part of FIG. 8;
11 is a perspective view showing a cutting unit and an unloading unit in the configuration of the CMP polishing pad manufacturing apparatus according to the present invention;
12 and 13 are perspective views showing the structure of the cutting means in the construction of the CMP polishing pad manufacturing apparatus according to the present invention;
14 is a reference diagram showing the process of cutting the raw material by the cutting means,
15 and 16 are perspective views showing the structure of a pull-out slider in the configuration of the CMP polishing pad manufacturing apparatus according to the present invention;
17 is a reference view showing a state in which the CMP polishing pad manufacturing apparatus according to the present invention is arranged in four units;
18 is a reference view showing a process in which raw materials are cemented in the state of FIG. 17 .

Hereinafter, preferred embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the embodiments described below. These embodiments are provided to explain the present invention in more detail to those of ordinary skill in the art to which the present invention pertains. Accordingly, the shape of each element shown in the drawings may be exaggerated to emphasize a clearer description.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

1 and 2 are perspective views showing an apparatus for manufacturing a CMP polishing pad according to the present invention, FIG. 3 is a plan view of FIGS. 1 and 2 , FIG. 4 is a main cross-sectional view of FIG. 3 , and FIG. It is a perspective view showing a first conveyor and a shuttle in the configuration of the polishing pad manufacturing apparatus, and FIGS. 6 and 7 are perspective views providing a loading part and an unloading part in the configuration of the CMP polishing pad manufacturing apparatus according to the present invention, and FIGS. 8 and FIG. 9 is a perspective view showing a bonding unit in the configuration of the apparatus for manufacturing a CMP polishing pad according to the present invention, FIG. 10 is a cross-sectional view of a main part of FIG. 8, and FIG. It is a perspective view showing a loading part, and FIGS. 12 and 13 are major perspective views showing the structure of a cutting means in the configuration of the CMP polishing pad manufacturing apparatus according to the present invention, and FIG. 14 is a reference view showing a process in which raw materials are cut by the cutting means 15 and 16 are perspective views showing the structure of a pull-out slider in the configuration of the CMP polishing pad manufacturing apparatus according to the present invention, and FIG. 17 is a reference showing a state in which the CMP polishing pad manufacturing apparatus according to the present invention is arranged in four units. FIG. 18 is a reference view showing a process in which raw materials are cemented in the state of FIG. 17 .

1 to 18, the CMP polishing pad manufacturing apparatus 600 of the present invention includes a CMP pad (A), a nonwoven fabric (B), a first bonding material (C), a second bonding material (D), and a second bonding material (D). Loading unit 100 for picking up raw materials from the cart (K) on which any one of the three cementing materials (E) is loaded and seated on the first conveyor 140; a shuttle 200 disposed on the first conveyor 140 and transporting the raw materials seated on the first conveyor 140; a bonding unit 300 for bonding and transferring the hot melt (I) and the undersheet (H) to the raw material transferred by the shuttle 200; a cutting unit 400 disposed on one side of the bonding unit 300, cutting the bonded hot melt (I) and the undersheet (H) and transferring them to a second conveyor (450); and an unloading unit 500 that picks up the cut raw material transferred to the second conveyor 450 and places it on the bogie K.

Prior to the description, the greatest feature of the present invention CMP polishing pad manufacturing apparatus 600 is to manufacture a CMP polishing pad by arranging four CMP polishing pad manufacturing apparatus 600 having the same structure, and in particular, control of at least two workers. It is possible to process control through

In addition, each configuration of the present invention CMP polishing pad manufacturing apparatus 600 to be described later is controlled by a separate controller (not shown).

In addition, in the CMP polishing pad manufacturing apparatus 600 of the present invention, as shown in FIG. 17 , four CMP polishing pad manufacturing apparatus 600 consisting of primary to quaternary units may be combined to form a set.

When combined as above, in the primary or secondary CMP polishing pad manufacturing apparatus 600, the hot melt (I), the CM pad and the undersheet (H) are bonded to the first cementing material (C) or hot melt (I), nonwoven fabric (B) and the second cementing material (D) to which the undersheet (H) is bonded is made, and in the tertiary CMP polishing pad manufacturing apparatus 600 , the first bonding material (C) and the second bonding material (D) ), the third bonding material (E) is bonded, and in the fourth CMP polishing pad manufacturing apparatus 600, the double-sided tape and the protective film (G) are bonded to the third bonding material (E), thereby final CMP polishing. make the pad.

In addition, the CMP pad (A), nonwoven fabric (B), first cementation material (C), second cementation material (D) and The third cementation material (E) is hereinafter referred to as 'raw material'.

In addition, since all four units of the CMP polishing pad manufacturing apparatus 600 have the same structure, hereinafter, the CMP polishing pad manufacturing apparatus 600 in which the first bonding material C is manufactured by bonding the circular CMP pad A Only the structure will be described.

The loading part 100 allows raw materials to be supplied to the cementation unit 300 to be described later, and as shown in FIGS. 1 to 4 , the CMP pad (A), the nonwoven fabric (B), the first cementing material (C), the first The raw materials are picked up from the cart (K) on which any one of the second and third cemented materials (D) and the third (E) are loaded, and are seated on the first conveyor 140 .

That is, the loading unit 100 disposed on the left side of the drawing picks up the CMP pad (A), which is a raw material loaded on the bogie (K), as a sheet, and can be supplied to the bonding unit 300 connected to the first conveyor 140. It is to be seated on the first conveyor 140 so that the

Here, the bogie K may be movably disposed on the first conveyor 140 on one side of the loading unit 100 and the second conveyor 450 on one side of the unloading unit 500 to be described later, respectively, and the loading unit ( The CMP pad (A) for supply is loaded on the bogie (K) on the 100) side, and the hot melt (I) and the undersheet (H) are placed on the CMP pad (A) on the bogie (K) on the unloading part 500 side. The first cementing material (C) to which the was cemented is unloaded and loaded.

In addition, it goes without saying that the type of raw material loaded on the bogie K may vary depending on the process.

In addition, the first conveyor 140 and the second conveyor 450 to be described later are detachably disposed on both sides of the bonding unit 300 while being fixed to the first base 150 and the second base 460, respectively. Preferably, this is to ensure that the worker's work space can be secured through separation when replacement of the hot melt (I) or undersheet (H) supplied in a roll type is made.

In addition, in the case of the first conveyor 140, as shown in FIG. 5, two pairs form a pair and are fixed to the first base 150 in a spaced apart state, which saves space so that the shuttle 200 to be described later can move. in order to secure

In addition, the first conveyor 140 and the second conveyor 450 are composed of a plurality of rotating rollers (L), which is a point to prevent damage or scratches to the surface of the raw material (CMP pad) transferred in a seated state. It is intended to be transferred through contact.

The loading unit 100 is disposed adjacent to the bogie K in the structure shown in FIG. 6 , and includes a Z-axis robot 120 and a pickup means 130 .

The Z-axis robot 120 is installed movably in the X-axis direction on the X-axis robot 110 installed on the first base 150 with a predetermined length to face the first conveyor 140 direction, and on one side A lifting platform 123 having a predetermined width and area and ascending and descending in the Z-axis direction is installed.

That is, the Z-axis robot 120 moves in the X-axis direction and raises and lowers the lifting platform 123 at the same time.

The pickup means 130 is fixed to the lifting platform 123 of the Z-axis robot 120, picks up the CMP pad (A), which is a raw material loaded on the cart (K), and allows it to be seated on the first conveyor (140). .

The pickup means 130 is disposed on the lower side of the lift platform 123 and includes a plurality of pickup bars 133 extending to a predetermined length toward the upper portion of the cart K, and is disposed along the longitudinal direction of each pickup bar 133 and is CMP It is composed of a plurality of vacuum pads 135 for sucking up the surface of the pad (A).

That is, the pickup means 130 stably picks up the CMP pad A through the suction of the plurality of vacuum pads 135 .

Here, the arrangement and number of the vacuum pads 135 are not limited, and although not shown, vacuum pipes are connected to the vacuum pads 135 as a matter of course.

Accordingly, the loading unit 100 picks up the CMP pad A loaded on the bogie K through the pickup means 130 in a vacuum, and the pickup means 130 through the X-axis movement of the Z-axis robot 120 . ) is moved to the upper portion of the first conveyor 140 to seat the CMP pad (A) on the first conveyor (140).

In this embodiment, it is described that the CMP pad (A) is picked up by using the vacuum pad (135) of the loading unit (100). does not limit

The shuttle 200 is for transferring the CMP pad A seated on the first conveyor 140 through the loading unit 100 to the bonding unit 300 , and is disposed on the first conveyor 140 .

At this time, the shuttle 200 is disposed between two pairs of first conveyors 140 to be spaced apart as shown in FIG. 5, and has a vertical plate shape so as to stably transport one side of the seated CMP pad (A). is accomplishing

At this time, the shuttle 200 is disposed toward the cementation unit 300 along the first conveyor 140 so as to transfer the CMP pad A seated on the first conveyor 140 to the bonding unit 300 . It is movably installed on the loading Y-axis robot 210 .

The shuttle 200 is a bonding unit 300 for bonding the CMP pad (A) seated as a sheet on the first conveyor 140 through the loading unit 100 with the hot melt (I) and the undersheet (H). ) is continuously transferred.

The bonding unit 300 is disposed adjacent to the first conveyor 140 as shown in FIGS. 1 to 4, and hot melt (I) to the upper and lower surfaces of the raw material transferred by the shuttle 200, that is, the CMP pad (A). At the same time as heating and bonding, the undersheet (H) is bonded and transferred to a cutting unit 400 to be described later.

The bonding unit 300 includes an upper roller 310 and a lower roller 320 , a pair of diaphragms 330 and a hot melt roller 340 as shown in FIGS. 8 to 10 .

The upper roller 310 and the lower roller 320 are rotatably arranged to face each other on a vertical line and to be adjacent to each other while maintaining a predetermined distance.

Here, the interval between the upper roller 310 and the lower roller 320 is preferably set by the thickness of the raw material to be cemented, which is the thickness of the raw material to be cemented in the first, second, third and fourth orders, respectively. because they are different

On the other hand, the upper roller 310 and the lower roller 320 are raw materials and hot melt (I) supplied through a hot melt roller 340 and an under sheet roller 350 to be described later, respectively, and hot melt (I) when the under sheet (H) is cemented. ) is preferably a heating roller that heats the hot melt (I) to achieve adhesion in close contact with one surface of the raw material, and has a structure that directly heats the surface of the roller by an induction-type heating method.

In addition, since chrome plating may be formed on the outer circumferential surface of the upper roller 310 and a silicone coating may be provided on the outer circumferential surface of the lower roller 320, the hot melt (I) and the undersheet (I) and the undersheet ( H) to ensure stable cementation.

In addition, since the heating temperature of the upper roller 310 and the lower roller 320 may vary depending on the type of raw material to be bonded, the temperature range is not limited.

Although the upper roller 310 and the lower roller 320 of this embodiment have been described as an induction heating method, the method is not limited because it is possible to heat the rollers through various methods such as a cartridge heating method.

The diaphragm 330 maintains a predetermined area in the form of a plate, and rotatably supports both sides of the upper roller 310 and the lower roller 320 as a pair.

On one surface of the diaphragm 330, a driving source (unsigned) that is respectively connected for rotation of the upper roller 310 and the lower roller 320 is provided, and each driving source has an upper roller 310 and a lower roller at the same rotation ratio. 320) is rotated.

The hot melt roller 340 is disposed on the right side in the drawing from the upper side of the upper roller 310 as shown in FIG. 10 in a state in which the hot melt (I) is wound on the outer circumferential surface, between the upper roller 310 and the lower roller 320 . When the CMP pad (A) is supplied and transferred by the shuttle 200 , the hot melt (I) is supplied so that the hot melt (I) can be adhered to the upper surface of the transferred CMP pad (A).

At this time, on the left side of the drawing facing the hot melt roller 340, one side of the protective film (G) adhered to both sides to protect the hot melt (I) when the hot melt (I) is supplied between the upper roller 310 and the lower roller 320 It is preferable that a recovery roller 380 for rewinding the protective film G is provided.

In this case, one side of the hot melt (I) from which the protective film (G) is peeled off by the recovery roller 380 is adhered to the surface of the CMP pad (A) while passing the upper roller 310 and the lower roller 320, and is not recovered. The protective film (G) on the other surface of the hot melt (I) covers the exposed other surface of the hot melt (I) bonded to the CMP pad (A) (see the first of FIG. 18 ).

On the other hand, on the lower side of the lower roller 320, the CMP pad (A) and the hot melt (I) are put together at the time of bonding to supply an undersheet (H) for covering the lower surface, which is one side of the CMP pad (A). 350) is preferably provided.

An undersheet (H) that is adhered to the lower surface of the CMP pad (A) is wound on the outer peripheral surface of the undersheet roller (350), and the undersheet (H) is peeled off according to the supply of hot melt (I) to the recovery roller (380). The protective film (G) to be wound is applied, so that the reuse of the protective film (G) can be made.

On the other hand, the lower roller 320 of the upper roller 310 and the lower roller 320 which are individually rotated by each driving source (unsigned) rotates while being fixed to the diaphragm 330, and the upper roller 310 is the upper roller 310. , It is preferable to have a structure that elevates in the downward direction.

This means that when the hot melt roller 340 or the under seat roller 350 that is exhausted according to the process is replaced, the hot melt (I) and the under sheet (H) that are newly supplied are the upper roller 310 and the lower roller 320. This is to ensure that a sufficient distance between the upper roller 310 and the lower roller 320 can be easily passed therebetween.

To this end, each of the pair of bulkheads is provided with a lifting member 333 and a lifting motor 335 as shown in FIGS. 8 and 9 .

The elevating member 333 is installed so as to be elevating on the diaphragm 330 by being connected to a rail fixed to the plate surface facing the outside of the diaphragm 330, and rotatably supports both sides of the upper roller 310, respectively.

That is, the pair of lifting members 333 are supported so as to be able to ascend and descend on the rail while supporting the upper roller 310 on both sides of the partition wall.

The elevating motor 335 is disposed on the bulkhead directly above the elevating member 333 through a separate bracket, and the elevating member 333 is connected to the elevating member 333 through the rod of the elevating motor 335. elevate

That is, the lifting motor 335 is driven so that the lifting member 333 can be lifted on the bulkhead, and the lifting motor 335 is preferably a servo motor.

At this time, between the rod of the elevating motor 335 and the elevating member 333, the vertical load cell for sensing the pressure generated when the upper roller 310 and the lower roller 320 by the lowering of the elevating member 333 are in close contact. (360) is preferably further provided.

In the vertical load cell 360, after the hot melt (I) and the protective film (G) penetrate between the upper roller 310 and the lower roller 320 in a state where the upper roller 310 is raised, it is lowered to the initial position for cementation. It senses the pressure applied to the hot melt (I) and transmits it to the controller (not shown).

If the pressure of the upper roller 310 is higher or lower than the set value, the set value is controlled through the control of the controller.

In addition, each diaphragm 330 is preferably provided with an LVDT sensor 370 for auto-teaching for the parallelism of the upper roller 310 when the upper roller 310 and the lower roller 320 are adjacent to each other, At this time, the LVDT sensor 370 is in contact with the bottom surface of the elevating member 333 .

That is, assuming that the LVDT sensor 370 of each diaphragm 330 descends and the height at which the upper roller 310 comes into contact with the hot melt I is a zero point, the upper roller 310 is lowered according to the final lowering of the upper roller 310 . The parallelism inclination of the roller 310 is sensed from both sides in the longitudinal direction and transmitted to the controller.

At this time, when the inclination of the upper roller 310 occurs, the controller raises and lowers the upper roller 310 on one side based on a preset inclination value, and through this, auto-teaching of the parallelism of the upper roller 310 is performed.

To be precise, the distance between the upper roller 310 and the lower roller 320, which has been descended, should be maintained at, for example, 3 mm. When one side of the upper roller 310 is 3 mm and the other side is 2,9 mm, the other side is 1 mm By lifting and lowering, the parallelism of the upper roller 310 is matched.

In the present embodiment, the structure in which the upper roller 310 elevates is described, but the elevating roller is not limited because the lower roller 320 may have a structure in which the lower roller 320 elevates depending on the structure of the manufacturing apparatus.

The cutting unit 400 cuts the hot melt (I) and the undersheet (H) in which the hot melt (I) and the undersheet (H) are cemented to the CMP pad (A) while passing through the bonding unit 300, and the second conveyor By transferring to 450 , it is disposed on one side (discharge side) of the bonding unit 300 in a state supported by the second base 460 .

That is, the cutting unit 400 cuts the cemented raw material discharged through the cementing unit 300 to complete the first cementing material (C) (hot melt (I), CM pad and undersheet (H)). It is to be transferred to the second conveyor (450).

At this time, as shown in FIG. 11 , the second conveyor 450 enables pickup through an unloading unit 500 to be described later while allowing the first cementation material C cut by the cutting unit 400 to be discharged. It is disposed on the right side of the drawing of the cutting unit 400 in a state supported by the second base 460 .

The cutting unit 400 includes an X-axis transfer robot 410 , a cutting means 420 , a first gripper 430 , and a second gripper 440 as shown in FIGS. 11 to 13 .

The X-axis transport robot 410 is an unloading Y-axis robot 470 to ride on a pair of unloading Y-axis robots 470 disposed along the second conveyor 450 on both sides of the second conveyor 450 . It is movably installed on the , and is arranged in the X-axis direction orthogonal to the Y-axis.

The movement in the Y-axis direction of the X-axis transfer robot 410 is for discharging the first cementation material C, which has been cut through the first gripper 430 and the second gripper 440, which will be described later.

The cutting means 420 cuts the hot melt (I) and the undersheet (H) bonded to the CMP pad (A) discharged through the bonding unit 300 at a set position to complete the first bonding material (C). As a result, the X-axis transfer robot 410 is installed to be movable in the X-axis direction.

The cutting means 420 includes a moving table 422 having a predetermined width that moves in the X-axis direction on the X-axis transport robot 410, and a moving table to face the cementing unit 300 direction as shown in FIG. 12 ( It includes a chuck cylinder 423 installed at the end of the 422 and a knife 424 chucked to the chuck cylinder 423 .

The chuck cylinder 423 is provided with a plurality of variable chucks 423a for chucking the knife 424 .

The knife 424 chucked in the chuck cylinder 423 is a moving table 422 when the hot melt I and the undersheet H, which are bonded to the CMP pad A discharged from the bonding unit 300, are located on the cutting line. The hot melt (I) and the undersheet (H) are cut according to the movement in the X-axis direction (see FIG. 14 ).

On the other hand, on one side of the second conveyor 450, a toolbox 425 provided with a plurality of knives 424 for auto-changing the knife 424 chucked in the chuck cylinder 423 as shown in FIGS. 1 and 3 is further provided. It is provided, which is provided by pre-inputting the usable number of cuttings of the knife 424 into the controller, and when the cutting of the knife 424 reaches the set number of times, automatically through the chuck cylinder 423 according to the control of the controller, a new knife 424 ) to be replaced with

The first gripper 430 and the second gripper 440 are separately installed to be movable in the Y-axis direction, and are discharged from the bonding unit 300 and bonded to the cut first bonding material C, that is, the CMP pad A. The hot melt (I) and the undersheet (H) are gripped to form a pair of tongs structure so that they can be sequentially transferred to the second conveyor 450, and at the same time, the hot melt (I) and the undersheet (H) are cut when cutting The tension is maintained by gripping both sides of the hot melt (I) and the undersheet (H) at the same time so that this can be done stably.

At this time, in order to enable individual movement of the first gripper 430 and the second gripper 440, a pair of first grippers 430 are provided on both sides in the longitudinal direction of the X-axis transfer robot 410 as shown in FIGS. 12 and 13 . It is preferable that the pair of second grippers 440 be fixedly installed at the lower end and movably installed in the Y-axis direction riding on each unloading Y-axis robot 470 .

In addition, the pair of second grippers 440 have a structure connected to each other by a connecting rod so that they can be interlocked when moving on the unloading Y-axis robot 470 .

In addition, it goes without saying that the interlocking structure of the first gripper 430 and the second gripper 440 is driven by a common cylinder (unsigned) so that the grip and release of the first cementation material C can be stably performed.

Accordingly, the first gripper 430 and the second gripper 440 maintain the tension of the cutting line when the hot melt (I) and the undersheet (H) are cut to ensure the stability of the cutting, and the cut first cementation The ash (C) is quickly transferred to the second conveyor 450 to be discharged through the unloading unit (500).

Meanwhile, as shown in FIGS. 11 to 13 , the X-axis transfer robot 410 may further include a barcode attaching device 490 for attaching a barcode on which product information is printed to the surface of the finally completed CMP polishing pad.

The barcode attaching machine 490 is installed at the end of the moving table 422 toward the second conveyor 450 of the cutting means 420 installed in the X-axis transfer robot 410, and rides the X-axis transfer robot 410 on the X-axis. 11, the barcode is picked up from the barcode reader 491 provided on one side of the second base 460 and attached to the surface of the completed CMP polishing pad as shown in FIG.

And, on the lower surface of the X-axis transfer robot 410, the second conveyor 450 and the cementation unit 300 are separated for replacement when the hot melt (I) or the undersheet (H) supplied to the bonding unit 300 is exhausted. The multi-stage exposed in the direction of the bonding unit 300 so that one end of the hot melt (I) and the undersheet (H) passing through the upper roller 310 and the lower roller 320 of the bonding unit 300 can be adhered. A pull-out slider 480 of may be further provided.

The pull-out slider 480 includes a housing 481 , a first slider 482 and a second slider 484 as shown in FIGS. 12 , 13 , 15 and 16 .

The housing 481 maintains a 'C' shape with an open lower portion having a predetermined space inside, and is fixed to the lower surface of the X-axis transfer robot 410 .

The first slider 482 is slidably disposed inside the housing 481 in the same 'C' shape as the housing 481, and is shown in FIG. 16 by driving the first cylinder 483 disposed on the right side in the drawing. The same is drawn out from the inside of the housing 481 in the direction of the bonding unit 300 .

The second slider 484 has one end of the hot melt (I) and the undersheet (H) attached to it in the form of a plate having a predetermined width, and is slidably disposed inside the first slider 482 and is disposed on the right side of the drawing As shown in FIG. 16 by the driving of the second cylinder 485, it is drawn out in the direction of the bonding unit 300 from the inside of the first slider 482.

That is, the first slider 482 is primarily slid out of the housing 481 and secondarily, the second slider 484 to which one end of the hot melt (I) and the undersheet (H) is adhered is the first slider 482 . ) and is drawn out by sliding.

At this time, the housing 481, the first slider 482, and the first slider 482 and the second slider 484 are respectively arranged so that the first slider 482 and the second slider 484 can slide in multiple stages. connected by rails.

Therefore, the pull-out slider 480 passes through the upper and lower rollers 310 and 320 when replacing the hot melt (I) or the under sheet (H) and connects the heated hot melt (I) and the under sheet (H) to the second conveyor ( 450) to ensure a space for the worker to enter according to the separation, and at the same time to ensure the safety of the worker due to the heated hot melt (I).

The unloading unit 500 is disposed on one side of the second conveyor 450 on the right side in the drawing as shown in FIGS. 1 to 4 , 7 and 11 , and is formed by the first gripper 430 and the second gripper 440 . The first cementing material C, which is the cut raw material transferred to the second conveyor 450, is picked up and seated on the prepared bogie K.

The unloading unit 500 has the same structure as the loading unit 100 , and includes a Z-axis robot 520 and a pickup means 530 .

The Z-axis robot 520 is installed movably in the X-axis direction on the X-axis robot 510 installed at a predetermined length on the second base 460 so as to face the second conveyor 450 direction. A lifting platform 523 having a predetermined width and area and ascending and descending in the Z-axis direction is installed.

That is, the Z-axis robot 520 moves in the X-axis direction and raises and lowers the elevator 523 at the same time.

The pickup means 530 is fixed to the elevator 523 of the Z-axis robot 520, picks up the first cementation material C transferred to the second conveyor 450, and unloads the unloading unit 500, the bogie (K). to allow it to be mounted on

The pickup means 530 is disposed on the lower side of the elevator 523 and includes a plurality of pickup bars 533 extending to a predetermined length toward the upper portion of the cart K, and disposed along the longitudinal direction of each pickup bar 533 , 1 It is composed of a plurality of vacuum pads 535 for adsorbing and picking up the surface of the bonding material (C).

Therefore, the unloading unit 500 picks up the first cementation material C transferred to the second conveyor 450 through the pickup means 530 in a vacuum, and moves the Z-axis robot 520 in the X-axis direction. The picked-up first cementing material (C) is seated by moving it to the bogie (K).

Hereinafter, a process of manufacturing a CMP polishing pad using the CMP polishing pad manufacturing apparatus 600 according to the present invention will be described with reference to the accompanying drawings.

First, a process of manufacturing the first cementation material C using a single CMP polishing pad manufacturing apparatus 600 will be described.

A truck (K) on which the CMP pad (A) is loaded is disposed toward the loading unit (100).

When the bogie K is disposed, the pickup means 130 and 530 of the loading unit 100 pick up the CMP pad A loaded on the bogie K in a single sheet, and the X-axis in a state in which the CMP pad A is picked up. The CMP pad (A) is seated on the first conveyor (140) by moving in the X-axis direction on the robots (110, 510).

When the CMP pad A is seated on the first conveyor 140 , the shuttle 200 moves the CMP pad A while pushing it in the arrow direction shown in FIG. 4 .

The CMP pad A transported by the shuttle 200 enters between the upper roller 310 and the lower roller 320 which are rotated by a driving source in the bonding unit 300 as shown in FIG. 10 .

At this time, the upper roller 310 and the lower roller 320 are heated to a predetermined temperature, and the hot melt (I) and the undersheet (H) are heated to the upper roller 310 and the lower roller 320 as shown in FIG. is in supply.

In addition, a protective film (G) is adhered to both surfaces of the supplied hot melt (I), and the protective film (G) on either side is recovered through a recovery roller 380 as shown in FIG. 10 .

When the CMP pad (A) enters between the upper roller (310) and the lower roller (320), the hot melt (I) and the undersheet (H) are rolled by the upper roller (310) and the lower roller (320). 18, the first cementing material C before cutting is formed while bonding to the upper and lower surfaces of the CMP pad A, respectively.

Here, the uppermost side in the drawing of the first bonding material (C) is a protective film (G) that is not recovered after being adhered to the hot melt (I).

The bonding of the CMP pad (A), the hot melt (I) and the undersheet (H) is gradually made in the process of passing between the upper roller 310 and the lower roller 320 .

At this time, when the CMP pad (A) to which the hot melt (I) and the undersheet (H) are bonded passes through the upper roller 310 and the lower roller 320, the first gripper ( The tension is maintained by gripping the hot melt (I) and the undersheet (H) between the CMP pad (A) and the CMP pad (A) to which the second gripper 430 and the second gripper 440 are bonded.

In the above state, while the cutting means moves in the X-axis direction, the cutting line indicated by the dotted line between the CMP pad (A) and the CMP pad (A) is cut using the knife 424 to form a single first cementation material (C). to manufacture

Thereafter, the cut first cementation material C is transferred to the second conveyor 450 along the arrow direction as shown in (b) of 14 through the movement of the second gripper 440 .

At this time, the first gripper 430 is in a state of continuously gripping the other side on which the cut is made.

When the transfer of the first cementing material C is completed, the second gripper 440 moves in the direction of the arrow as shown in (c) of 14 to grip the portion gripped by the first gripper 430 in an adjacent state.

At the same time, the first cementation material C (dotted and dashed line) transferred to the second conveyor 450 is picked up by the pickup means 130 and 530 of the unloading unit 500 and the unloading unit 500 side of the bogie K ) is mounted on

Thereafter, the second gripper 440 moves in the direction of the arrow as shown in (d) of 14 while gripping the hot melt I and the undersheet H to the adjacent portion of the first gripper 430 .

At this time, the first gripper 430 releases the grip when the hot melt I and the undersheet H are transferred by the second gripper 440, and the movement of the second gripper 440 is ) until the cutting line between the CMP pad (A) and the CMP pad (A) coincides with the line through which the knife 424 passes.

When the cutting lines coincide, the first gripper 430 grips the hot melt I and the undersheet H to maintain the tension as shown in FIG. 14A .

And, as the above-described series of processes is repeatedly performed, the continuous production of the first cementation material (C) is made.

On the other hand, the process of manufacturing a CMP polishing pad by combining the CMP polishing pad manufacturing apparatus 600 according to the present invention to form a set of four primary to fourth units as shown in FIG. 17 will be described as follows.

First, in the first step, the final first cementing material (C) is manufactured as in the first step of 18 through the above-described bonding process while supplying the CMP pad (A), the hot melt (I) and the undersheet (H).

In the second step, while supplying the nonwoven fabric (B), the hot melt (I), and the undersheet (H), the final second cementing material (D) is manufactured as in the second step of 18 through the above-described bonding process.

In the third car, the first and second cementing materials (C) and second cementing materials (D) prepared in the first and second steps are supplied to the cart (K), and the first and second cementing materials (C) and (D) are supplied. ), the protective film (G) and the undersheet (H) are peeled off and supplied to the bonding unit 300 .

At this time, the hot melt (I) of the first and second cementing materials (C) and (D) are supplied to face each other, and any one of the first and second cementing materials (C) and (D) is The first conveyor 140 is supplied in the horizontal direction, and the other cementing material is supplied with a predetermined inclination.

The supplied first cementing material (C) and the second cementing material (D) are cemented as shown in the third step of FIG. 18 to prepare a third cementing material (E).

In addition, as in the first and second rounds, the hot melt (I) and the undersheet as in the first and second rounds as the third cementing material (E) is manufactured by the cementation of the first and second cementing materials (C) and the second cementing material (D) in the third. No supply of (H) is required.

In the 4th car, it is for bonding (423a) the double-sided tape and the protective film (G) with the supplementary cloth of the third cementing material (E) prepared in the third, from the cart (K) on which the third cementing material (E) is loaded. The third cementing material (E) is picked up and seated on the first conveyor (140).

At this time, the third bonding material (E) is seated such that the CMP pad (A) faces downward so that the double-sided tape and the protective film (G) can be adhered to the nonwoven fabric (B). Thereafter, while moving the third bonding material (E) to the bonding unit (300), the double-sided tape and the protective film (G) are supplied to manufacture the final CMP polishing pad as shown in the fourth step of FIG. 18 through the above-described bonding process. do.

By the above process, since the input and discharge of raw materials are automatically made while four units of the CMP polishing pad manufacturing apparatus 600 of the present invention form a group, in the automated process (1st, 2nd, 4th), Two workers are required for supply and discharge, and one worker is required for supplying raw materials in the 4th round, thereby significantly reducing the number of workers.

As described so far, the CMP polishing pad manufacturing apparatus of the present invention enables the input, discharge, hot melt supply and cutting of raw materials to be automatically performed in each process while the CMP polishing pad is manufactured through the fourth process, and three There is an excellent effect that process control from the 1st to the 4th can be achieved through personnel.

In addition, the structural effect of preventing the safety of workers due to the heated hot melt as the heated hot melt and the protective film are pulled out through the pull-out slider when the hot melt roller or under seat roller is replaced.

As mentioned above, the CMP polishing pad manufacturing apparatus of the present invention has been described with reference to the preferred embodiment and the accompanying drawings, but it goes without saying that this is only intended to help the understanding of the present invention and is not intended to limit the technical scope of the present invention.

That is, without departing from the technical gist of the present invention, various modifications and alterations are possible by those skilled in the art to which the present invention pertains. It goes without saying that it is within.

100: loading part 100,100': X-axis robot
120, 120': Z-axis robot 123,123': Lifting platform
130,130': pickup means 133,133': pickup bar
135,135': vacuum pad 140: first conveyor
150: first base 200: shutter tool
210: loading Y-axis robot 300: cementation unit
310: upper roller 320: lower roller
330: diaphragm 333: elevating member
335: elevating motor 340: hot melt roller
350: under seat roller 360: vertical load cell
370: LVDT sensor 380: recovery roller
400: cutting unit 410: X-axis transport robot
420: cutting means 422: moving table
423: chuck cylinder 424: knife
425: toolbox 430: first gripper
440: second gripper 450: second conveyor
460: second base 470: unloading Y-axis robot
480: pull-out slider 481: housing
482: first slider 483: first cylinder
484: second slider 485: second cylinder
490: barcode attacher 491: code reader
500: CMP polishing pad manufacturing device A: CMP pad
B: Non-woven fabric C: First cementation material
D: Second clad material E: Third clad material
F : CMP polishing pad G : Protective film
H : Undersheet I : Hot melt
K : Bogie L : Rotating roller
M : double-sided tape

Claims (21)

Picking up raw materials from the cart (K) loaded with any one of the CMP pad (A), nonwoven fabric (B), first cementing material (C), second cementing material (D), and third cementing material (E) The loading unit 100 to be seated on the first conveyor 140;
a shuttle 200 disposed on the first conveyor 140 and transporting the raw materials seated on the first conveyor 140;
a bonding unit 300 for bonding and transferring the hot melt (I) and the undersheet (H) to the raw material transferred by the shuttle 200;
a cutting unit 400 disposed on one side of the bonding unit 300, cutting the bonded hot melt (I) and the undersheet (H) and transferring them to a second conveyor (450); and
and an unloading unit 500 that picks up the cut raw material transferred to the second conveyor 450 and places it on the bogie K.
The shuttle 200 moves to the loading Y-axis robot 210 disposed along the first conveyor 140 so as to transfer the raw material seated on the first conveyor 140 to the cementation unit 300 . CMP polishing pad manufacturing apparatus, characterized in that installed possible.
According to claim 1,
The loading unit 100 and the unloading unit 500,
A Z-axis robot ( 120,520); and
CMP polishing pad manufacturing apparatus, characterized in that it is fixed to the lifting platform (123,523), and pickup means (130,530) for picking up the raw material.
3. The method of claim 2,
The pickup means (130, 530) is,
a plurality of pickup bars (133, 533) disposed below the elevator (123, 523) and extending to a predetermined length; and
A CMP polishing pad manufacturing apparatus, characterized in that it is arranged along the longitudinal direction of the pickup bar (133,533), comprising a plurality of vacuum pads (135,535) for picking up the raw material.
delete According to claim 1,
The bonding unit 300,
an upper roller 310 and a lower roller 320 rotating in a state of being adjacent to each other to pressurize the raw material to be transported;
a pair of diaphragms 330 supporting both sides of the upper roller 310 and the lower roller 320; and
A hot melt roller 340 disposed above the upper roller 310 and supplied between the upper roller 310 and the lower roller 320 to supply the hot melt (I) to be bonded to the raw material; characterized in that it is composed of CMP polishing pad manufacturing equipment.
6. The method of claim 5,
The upper roller 310 and the lower roller 320 are heating rollers for heating the hot melt (I) so that the hot melt (I) can adhere to the raw material during bonding.
6. The method of claim 5,
The upper roller 310 is a CMP polishing pad manufacturing apparatus, characterized in that elevating.
8. The method of claim 7,
a pair of elevating members 333 installed on the diaphragm 330 to enable elevating through the rail and supporting both sides of the upper roller 310; and
A CMP polishing pad manufacturing apparatus comprising: a pair of lifting motors (335) disposed directly above each of the lifting members (333) in a state of being connected to each other through a rod, and lifting and lowering the lifting members (333).
9. The method of claim 8,
Between the rod of the elevating motor 335 and the elevating member 333, a vertical load cell 360 for sensing the pressure generated when the upper and lower rollers 310 and 320 are in close contact due to the lowering of the elevating member 333. CMP polishing pad manufacturing apparatus, characterized in that further provided.
6. The method of claim 5,
Each diaphragm 330 is provided with an LVDT sensor 370 for auto-teaching the parallelism of the upper roller 310 when the upper roller 310 and the lower roller 320 are adjacent to each other. CMP polishing pad manufacturing equipment.
6. The method of claim 5,
CMP polishing pad manufacturing apparatus, characterized in that the lower side of the lower roller (320) is provided with an undersheet roller (350) for supplying an undersheet (H) to cover one side of the raw material when the raw material and the hot melt (I) are adhered.
6. The method of claim 5,
CMP polishing pad manufacturing apparatus, characterized in that the upper side of the upper roller (310) is provided with a recovery roller (380) for rewinding the protective film (G) of the hot melt (I).
According to claim 1,
The cutting unit 400,
an X-axis transfer robot 410 disposed in the X-axis direction to ride on the unloading Y-axis robot 470 disposed on both sides of the second conveyor 450;
a cutting means 420 that is movably installed in the X-axis transfer robot 410 and cuts the hot melt (I) and the undersheet (H) discharged through the bonding unit 300; and
The second conveyor ( A CMP polishing pad manufacturing apparatus comprising: a pair of first grippers 430 and second grippers 440 sequentially transferred to 450).
14. The method of claim 13,
The cutting means 420,
A moving table 422 that moves on the X-axis transport robot 410;
a chuck cylinder 423 installed on the moving table 422; and
A CMP polishing pad manufacturing apparatus comprising a knife (424) chucked to the chuck cylinder (423).
15. The method of claim 14,
CMP polishing pad manufacturing, characterized in that the toolbox 425 provided with a plurality of knives 424 for auto-changing the knife 424 of the chuck cylinder 423 is further provided on one side of the second conveyor 450 . Device.
14. The method of claim 13,
The first gripper 430 is installed on both sides in the longitudinal direction of the X-axis transfer robot 410, and the second gripper 440 is movably installed on each unloading Y-axis robot 470. CMP polishing pad manufacturing equipment.
14. The method of claim 13,
CMP polishing pad manufacturing apparatus, characterized in that the X-axis transfer robot (410) is further provided with a barcode attaching machine (490) for attaching a barcode to the surface of the completed CMP polishing pad.
14. The method of claim 13,
When the second conveyor 450 and the cementation unit 300 are separated for replacement of the hot melt (I) or the undersheet (H) on the lower surface of the X-axis transport robot 410, the cementation unit 300 is penetrated. CMP polishing pad manufacturing apparatus, characterized in that the multi-stage pull-out slider (480) exposed so that one end of the hot melt (I) and the undersheet (H) can be adhered.
19. The method of claim 18,
The pull-out slider 480 is,
a housing 481 fixed to the lower surface of the X-axis transport robot 410;
a first slider 482 disposed inside the housing 481 and drawn out toward the bonding unit 300 by a first cylinder 483;
It is disposed inside the first slider 482, is drawn out from the first slider 482 in the direction of the bonding unit 300 by a second cylinder 485, and the hot melt (I) and the undersheet (H) are formed. A CMP polishing pad manufacturing apparatus comprising a second slider (484) to which one end is adhered.
According to claim 1,
The first conveyor (140) and the second conveyor (450) are CMP polishing pad manufacturing apparatus, characterized in that detachable from both sides of the bonding unit (300).
According to claim 1,
The CMP polishing pad manufacturing apparatus 600 is combined to form a set of four CMP polishing pad manufacturing apparatus 600 consisting of primary to quaternary,
In the primary or secondary CMP polishing pad manufacturing apparatus 600, the first cementing material (C) or the second cementing material (D) is cemented,
In the tertiary CMP polishing pad manufacturing apparatus 600 , the third cementation material (E) is manufactured by bonding the first cementing material (C) and the second cementing material (D),
In the fourth CMP polishing pad manufacturing apparatus (600), a CMP polishing pad manufacturing apparatus, characterized in that the double-sided tape is bonded to the third bonding material (E).

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