KR102294736B1 - 보강 필름 - Google Patents

보강 필름 Download PDF

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Publication number
KR102294736B1
KR102294736B1 KR1020180098992A KR20180098992A KR102294736B1 KR 102294736 B1 KR102294736 B1 KR 102294736B1 KR 1020180098992 A KR1020180098992 A KR 1020180098992A KR 20180098992 A KR20180098992 A KR 20180098992A KR 102294736 B1 KR102294736 B1 KR 102294736B1
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South Korea
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meth
less
polymer
sensitive adhesive
weight
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Korean (ko)
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KR20190058277A (ko
Inventor
다케시 나카노
다츠야 스즈키
쇼고 사사키
히로키 이에다
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닛토덴코 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/10—Block or graft copolymers containing polysiloxane sequences
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/40—Adhesives in the form of films or foils characterised by release liners
    • C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2451/00—Presence of graft polymer

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Laminated Bodies (AREA)
  • Materials For Medical Uses (AREA)
  • Separation Using Semi-Permeable Membranes (AREA)
KR1020180098992A 2017-11-20 2018-08-24 보강 필름 Active KR102294736B1 (ko)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JPJP-P-2017-222777 2017-11-20
JP2017222777 2017-11-20
JPJP-P-2018-107849 2018-06-05
JP2018107849A JP6496066B1 (ja) 2017-11-20 2018-06-05 補強フィルム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020210008652A Division KR20210011045A (ko) 2017-11-20 2021-01-21 보강 필름

Publications (2)

Publication Number Publication Date
KR20190058277A KR20190058277A (ko) 2019-05-29
KR102294736B1 true KR102294736B1 (ko) 2021-08-30

Family

ID=65999502

Family Applications (2)

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KR1020180098992A Active KR102294736B1 (ko) 2017-11-20 2018-08-24 보강 필름
KR1020210008652A Withdrawn KR20210011045A (ko) 2017-11-20 2021-01-21 보강 필름

Family Applications After (1)

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KR1020210008652A Withdrawn KR20210011045A (ko) 2017-11-20 2021-01-21 보강 필름

Country Status (4)

Country Link
JP (2) JP6496066B1 (https=)
KR (2) KR102294736B1 (https=)
CN (1) CN110003806B (https=)
TW (1) TWI784008B (https=)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102290643B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102290629B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102293550B1 (ko) * 2018-07-27 2021-08-24 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102293935B1 (ko) * 2018-07-27 2021-08-24 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102290640B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102293551B1 (ko) * 2018-07-27 2021-08-24 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
KR102290639B1 (ko) * 2018-07-27 2021-08-17 주식회사 엘지화학 점착제 조성물, 이를 포함하는 점착 필름, 점착 필름을 포함하는 백플레이트 필름 및 점착 필름을 포함하는 플라스틱 유기 발광 디스플레이
JP7268277B2 (ja) * 2019-11-08 2023-05-08 日本カーバイド工業株式会社 粘着剤組成物、粘着シート、及び光学部材
JP7268278B2 (ja) * 2019-11-08 2023-05-08 日本カーバイド工業株式会社 粘着剤組成物、粘着シート、及び光学部材
KR102306997B1 (ko) * 2019-11-11 2021-09-29 도레이첨단소재 주식회사 초경박리 이형필름
DE102020215236A1 (de) * 2019-12-02 2021-06-02 Nippon Mektron, Ltd. Klebefilm und flexible gedruckte schaltungsplatine
JP6893576B2 (ja) * 2019-12-02 2021-06-23 日本メクトロン株式会社 接着フィルム及びフレキシブルプリント基板
KR102430601B1 (ko) * 2020-03-03 2022-08-08 삼성에스디아이 주식회사 점착 필름, 이를 포함하는 광학 부재 및 이를 포함하는 광학표시장치
KR102881921B1 (ko) * 2020-03-27 2025-11-06 현대모비스 주식회사 차량 램프용 통기부재 및 이의 제조방법
JP7733976B2 (ja) * 2020-08-06 2025-09-04 日東電工株式会社 補強用フィルム、光学部材および電子部材
JP7645057B2 (ja) * 2020-08-06 2025-03-13 日東電工株式会社 補強用フィルム、光学部材および電子部材
JP7638639B2 (ja) * 2020-08-06 2025-03-04 日東電工株式会社 補強用フィルム、光学部材および電子部材
JP7638640B2 (ja) * 2020-08-06 2025-03-04 日東電工株式会社 補強用フィルム、光学部材および電子部材
CN114015385A (zh) * 2021-10-08 2022-02-08 常州都铂高分子有限公司 一种初粘性低的胶水
CN120202262A (zh) * 2022-11-16 2025-06-24 日东电工株式会社 层叠体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002370315A (ja) * 2001-06-14 2002-12-24 Sony Chem Corp 剥離フィルム及び剥離フィルムを用いた接着フィルム
JP5951153B2 (ja) * 2014-06-11 2016-07-13 日東電工株式会社 粘着シート
JP2017100397A (ja) * 2015-12-03 2017-06-08 三井化学東セロ株式会社 プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5951153B2 (ja) 1977-02-01 1984-12-12 三菱電機株式会社 半導体装置の製造方法
JPS5916258Y2 (ja) * 1979-04-09 1984-05-14 本州ダンボ−ル工業株式会社 手掛補強用中仕切板
JPH08309912A (ja) * 1995-05-18 1996-11-26 Nitto Denko Corp ポリカルボジイミド熱圧着シートおよびその製法ならびにそれを用いた熱圧着方法
JP2001315261A (ja) * 2000-05-10 2001-11-13 Sumitomo Chem Co Ltd 離型フィルム
JP5328005B2 (ja) * 2006-12-25 2013-10-30 日立化成ポリマー株式会社 粘着テープ用剥離剤組成物及び剥離ライナー
JP4888722B2 (ja) * 2007-08-03 2012-02-29 東レフィルム加工株式会社 離型フィルム
JP2009122219A (ja) 2007-11-13 2009-06-04 Nitto Denko Corp シリコーンラベル
CN102159658A (zh) * 2008-09-23 2011-08-17 芬欧汇川木业公司 用于木板的胶层材料和木板
JP5737573B2 (ja) * 2011-05-31 2015-06-17 三菱レイヨン株式会社 離型フィルム及び樹脂積層体の製造方法
JP6223836B2 (ja) 2013-04-15 2017-11-01 日東電工株式会社 粘着剤組成物および粘着シート
JP6071762B2 (ja) * 2013-06-04 2017-02-01 日東電工株式会社 ポリ塩化ビニル系樹脂フィルムおよびポリ塩化ビニル系粘着テープ
JP6182379B2 (ja) * 2013-07-23 2017-08-16 日東電工株式会社 積層フィルムおよび粘着テープ
JP6284313B2 (ja) 2013-08-02 2018-02-28 ライオン・スペシャリティ・ケミカルズ株式会社 剥離フィルムの製造方法および剥離フィルム
JP2017078026A (ja) * 2014-01-29 2017-04-27 日本農薬株式会社 害虫の防除方法及び防除剤
US10792902B2 (en) 2014-04-22 2020-10-06 Nitto Denko Corporation Pressure-sensitive adhesive sheet
JP6352196B2 (ja) 2015-01-23 2018-07-04 日本カーバイド工業株式会社 粘着剤組成物及び粘着フィルム
JP6511317B2 (ja) * 2015-03-30 2019-05-15 リンテック株式会社 剥離シートおよび粘着シート
JP2016204659A (ja) * 2015-04-23 2016-12-08 キヤノン株式会社 接着部材
JP6750202B2 (ja) * 2015-10-14 2020-09-02 味の素株式会社 樹脂組成物、接着フィルムおよびコアレス基板の製造方法
JP6852332B2 (ja) * 2015-10-28 2021-03-31 味の素株式会社 接着フィルム
CN108137978A (zh) * 2015-11-06 2018-06-08 琳得科株式会社 剥离剂组合物、剥离片及粘合体
TWI823831B (zh) * 2016-01-28 2023-12-01 日商三井化學東賽璐股份有限公司 外觀性能佳的製程用離型薄膜，其用途，及使用其的樹脂封裝半導體的製造方法
JP6142396B1 (ja) * 2016-07-28 2017-06-07 サイデン化学株式会社 光学フィルム粘着シート

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002370315A (ja) * 2001-06-14 2002-12-24 Sony Chem Corp 剥離フィルム及び剥離フィルムを用いた接着フィルム
JP5951153B2 (ja) * 2014-06-11 2016-07-13 日東電工株式会社 粘着シート
JP2017100397A (ja) * 2015-12-03 2017-06-08 三井化学東セロ株式会社 プロセス用離型フィルム、その用途、及びそれを用いた樹脂封止半導体の製造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JPWO2017078026 A1

Also Published As

Publication number Publication date
JP2019094508A (ja) 2019-06-20
JP2019094476A (ja) 2019-06-20
CN110003806A (zh) 2019-07-12
TW201923005A (zh) 2019-06-16
KR20210011045A (ko) 2021-01-29
JP6496066B1 (ja) 2019-04-03
CN110003806B (zh) 2022-10-25
KR20190058277A (ko) 2019-05-29
JP7171473B2 (ja) 2022-11-15
TWI784008B (zh) 2022-11-21

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