KR102278300B1 - 활성 에스테르 수지와 그 경화물 - Google Patents

활성 에스테르 수지와 그 경화물 Download PDF

Info

Publication number
KR102278300B1
KR102278300B1 KR1020187037832A KR20187037832A KR102278300B1 KR 102278300 B1 KR102278300 B1 KR 102278300B1 KR 1020187037832 A KR1020187037832 A KR 1020187037832A KR 20187037832 A KR20187037832 A KR 20187037832A KR 102278300 B1 KR102278300 B1 KR 102278300B1
Authority
KR
South Korea
Prior art keywords
compound
resin
active ester
group
novolak
Prior art date
Application number
KR1020187037832A
Other languages
English (en)
Korean (ko)
Other versions
KR20190025852A (ko
Inventor
유타카 사토우
다츠야 오카모토
아키토 가와사키
가즈히사 야모토
Original Assignee
디아이씨 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 디아이씨 가부시끼가이샤 filed Critical 디아이씨 가부시끼가이샤
Publication of KR20190025852A publication Critical patent/KR20190025852A/ko
Application granted granted Critical
Publication of KR102278300B1 publication Critical patent/KR102278300B1/ko

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/91—Polymers modified by chemical after-treatment
    • C08G63/914—Polymers modified by chemical after-treatment derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/916—Dicarboxylic acids and dihydroxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/02—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds
    • C08G63/12—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds
    • C08G63/123—Polyesters derived from hydroxycarboxylic acids or from polycarboxylic acids and polyhydroxy compounds derived from polycarboxylic acids and polyhydroxy compounds the acids or hydroxy compounds containing carbocyclic rings
    • C08G63/133—Hydroxy compounds containing aromatic rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Resins (AREA)
  • Polyesters Or Polycarbonates (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
KR1020187037832A 2016-07-06 2017-06-22 활성 에스테르 수지와 그 경화물 KR102278300B1 (ko)

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
JP2016134227 2016-07-06
JPJP-P-2016-134227 2016-07-06
JPJP-P-2016-140419 2016-07-15
JPJP-P-2016-140420 2016-07-15
JP2016140419 2016-07-15
JP2016140420 2016-07-15
JP2016140422 2016-07-15
JP2016140421 2016-07-15
JPJP-P-2016-140421 2016-07-15
JPJP-P-2016-140422 2016-07-15
JPJP-P-2016-156536 2016-08-09
JP2016156536 2016-08-09
PCT/JP2017/022995 WO2018008409A1 (ja) 2016-07-06 2017-06-22 活性エステル樹脂とその硬化物

Publications (2)

Publication Number Publication Date
KR20190025852A KR20190025852A (ko) 2019-03-12
KR102278300B1 true KR102278300B1 (ko) 2021-07-19

Family

ID=60912685

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020187037832A KR102278300B1 (ko) 2016-07-06 2017-06-22 활성 에스테르 수지와 그 경화물

Country Status (5)

Country Link
JP (1) JP6332719B1 (ja)
KR (1) KR102278300B1 (ja)
CN (1) CN109415485B (ja)
TW (1) TWI740969B (ja)
WO (1) WO2018008409A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111918891B (zh) * 2018-03-29 2023-02-28 Dic株式会社 固化性组合物及其固化物
US20230097650A1 (en) * 2020-02-17 2023-03-30 Nippon Steel Chemical & Material Co., Ltd. Active ester resin, method for producing thereof, epoxy resin composition, cured product thereof, prepreg, laminated board, and material for circuit substrate

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001254000A (ja) 2000-03-09 2001-09-18 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
JP2003082063A (ja) 2001-09-12 2003-03-19 Dainippon Ink & Chem Inc 電子材料用エポキシ樹脂組成物および低誘電性電子材料
US20150024173A1 (en) 2012-02-07 2015-01-22 Hitachi Chemical Co., Ltd. Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4608406A (en) * 1985-04-18 1986-08-26 Celanese Corporation Stable aqueous epoxy resin dispersions
JP2001146511A (ja) * 1999-09-06 2001-05-29 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
EP1137708A1 (en) * 1999-09-06 2001-10-04 Sumitomo Bakelite Co., Ltd. Epoxy resin composition and semiconductor device
JP2002121356A (ja) * 2000-10-11 2002-04-23 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び半導体装置
JP3826322B2 (ja) 2002-10-31 2006-09-27 大日本インキ化学工業株式会社 エポキシ樹脂組成物およびその硬化物
JP5245496B2 (ja) * 2008-03-31 2013-07-24 Ｄｉｃ株式会社 エポキシ樹脂組成物、及びその硬化物
EP2589625B1 (en) * 2010-07-02 2016-10-26 DIC Corporation Thermosetting resin composition, cured product thereof, active ester resin, semiconductor sealing material, prepreg, printed circuit board, and build-up film
CN103221442B (zh) * 2011-05-27 2014-04-16 Dic株式会社 活性酯树脂、其制造方法、热固性树脂组合物、其固化物、半导体密封材料、预浸料、电路基板、及积层薄膜
CN102504201A (zh) * 2011-10-18 2012-06-20 广东生益科技股份有限公司 环氧树脂组合物及使用其制作的高频电路基板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001254000A (ja) 2000-03-09 2001-09-18 Sumitomo Bakelite Co Ltd 難燃性樹脂組成物およびこれを用いた半導体封止材料
JP2003082063A (ja) 2001-09-12 2003-03-19 Dainippon Ink & Chem Inc 電子材料用エポキシ樹脂組成物および低誘電性電子材料
US20150024173A1 (en) 2012-02-07 2015-01-22 Hitachi Chemical Co., Ltd. Photosensitive resin composition, method for manufacturing patterned cured film, and electronic component

Also Published As

Publication number Publication date
CN109415485B (zh) 2021-02-02
CN109415485A (zh) 2019-03-01
WO2018008409A1 (ja) 2018-01-11
TW201833165A (zh) 2018-09-16
KR20190025852A (ko) 2019-03-12
TWI740969B (zh) 2021-10-01
JP6332719B1 (ja) 2018-05-30
JPWO2018008409A1 (ja) 2018-07-05

Similar Documents

Publication Publication Date Title
KR102276114B1 (ko) 활성 에스테르 수지 조성물과 그 경화물
KR102268344B1 (ko) 활성 에스테르 조성물 및 그 경화물
KR102268343B1 (ko) 경화성 조성물과 그 경화물
KR102343074B1 (ko) 활성 에스테르 수지와 그 경화물
TWI726121B (zh) 環氧樹脂溶液與其製造方法、及環氧樹脂膜之製造方法
JP6862701B2 (ja) 活性エステル樹脂とその硬化物
KR102278300B1 (ko) 활성 에스테르 수지와 그 경화물
TWI766025B (zh) 活性酯化合物及硬化性組成物
KR102197902B1 (ko) 활성 에스테르 수지와 그 경화물
TWI820025B (zh) 硬化性組成物、硬化物、半導體密封材料及印刷配線基板
KR20200020693A (ko) 활성 에스테르 조성물 및 반도체 봉지 재료
KR20240070654A (ko) 경화성 조성물, 그 경화물, 프리프레그, 회로 기판, 빌드 업 필름, 반도체 밀봉재 및 반도체 장치
JP2018193470A (ja) δ−バレロラクトン骨格含有樹脂
KR20190125321A (ko) 폴리에스테르 수지와 그 경화물

Legal Events

Date Code Title Description
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant