KR102264357B1 - 패턴화된 나노와이어 투명 전도체 상의 인쇄된 전도성 패턴을 위한 보호 코팅 - Google Patents
패턴화된 나노와이어 투명 전도체 상의 인쇄된 전도성 패턴을 위한 보호 코팅 Download PDFInfo
- Publication number
- KR102264357B1 KR102264357B1 KR1020167010931A KR20167010931A KR102264357B1 KR 102264357 B1 KR102264357 B1 KR 102264357B1 KR 1020167010931 A KR1020167010931 A KR 1020167010931A KR 20167010931 A KR20167010931 A KR 20167010931A KR 102264357 B1 KR102264357 B1 KR 102264357B1
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- conductive
- substrate
- delete delete
- patterned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/13338—Input devices, e.g. touch panels
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133302—Rigid substrates, e.g. inorganic substrates
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1377—Protective layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
- H10D62/117—Shapes of semiconductor bodies
- H10D62/118—Nanostructure semiconductor bodies
- H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
- H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
- H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
- H10D84/0186—Manufacturing their interconnections or electrodes, e.g. source or drain electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H10D84/02—Manufacture or treatment characterised by using material-based technologies
- H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
- H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/70—Nanostructure
- Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/84—Manufacture, treatment, or detection of nanostructure
- Y10S977/89—Deposition of materials, e.g. coating, cvd, or ald
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S977/00—Nanotechnology
- Y10S977/902—Specified use of nanostructure
- Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
- Y10S977/953—Detector using nanostructure
- Y10S977/956—Of mechanical property
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Human Computer Interaction (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Non-Insulated Conductors (AREA)
- Liquid Crystal (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361884954P | 2013-09-30 | 2013-09-30 | |
| US61/884,954 | 2013-09-30 | ||
| PCT/US2014/056768 WO2015047944A1 (en) | 2013-09-30 | 2014-09-22 | Protective coating for printed conductive pattern on patterned nanowire transparent conductors |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160063368A KR20160063368A (ko) | 2016-06-03 |
| KR102264357B1 true KR102264357B1 (ko) | 2021-06-15 |
Family
ID=52744376
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020167010931A Expired - Fee Related KR102264357B1 (ko) | 2013-09-30 | 2014-09-22 | 패턴화된 나노와이어 투명 전도체 상의 인쇄된 전도성 패턴을 위한 보호 코팅 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10362685B2 (enExample) |
| EP (1) | EP3053012B1 (enExample) |
| JP (1) | JP6480428B2 (enExample) |
| KR (1) | KR102264357B1 (enExample) |
| CN (1) | CN105593796B (enExample) |
| BR (1) | BR112016006975A2 (enExample) |
| SG (1) | SG11201602419WA (enExample) |
| WO (1) | WO2015047944A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102543985B1 (ko) * | 2015-10-27 | 2023-06-14 | 삼성전자주식회사 | 전도막 및 이를 포함하는 전자 소자 |
| JP6654954B2 (ja) * | 2016-03-31 | 2020-02-26 | デクセリアルズ株式会社 | 異方性導電接続構造体 |
| GB2551502A (en) * | 2016-06-17 | 2017-12-27 | M-Solv Ltd | Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display |
| US10327332B2 (en) * | 2016-10-06 | 2019-06-18 | Microsoft Technology Licensing, Llc | Connecting a flexible circuit to other structures |
| WO2018145106A1 (en) * | 2017-02-06 | 2018-08-09 | Carnegie Mellon University | A flexible circuit and a method of manufacture |
| CN110825253A (zh) * | 2018-08-13 | 2020-02-21 | 南昌欧菲光科技有限公司 | 触控组件和触摸显示屏 |
| JP2023523765A (ja) * | 2020-05-01 | 2023-06-07 | スリーエム イノベイティブ プロパティズ カンパニー | 反射光学メタ表面フィルム |
| CN114698254B (zh) * | 2020-12-31 | 2025-01-24 | 天材创新材料科技(厦门)有限公司 | 叠构结构及触控感应器 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010507261A (ja) * | 2006-10-18 | 2010-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | ポリマー基材上で物質をパターニングする方法 |
| JP2012178149A (ja) * | 2011-02-04 | 2012-09-13 | Shin Etsu Polymer Co Ltd | 静電容量式センサーシートおよびその製造方法 |
Family Cites Families (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3660088A (en) | 1970-09-16 | 1972-05-02 | Grace W R & Co | Photo-resist process |
| JPS5388163A (en) * | 1977-01-14 | 1978-08-03 | Esu Kei Kk | Method of producing printed circuit board |
| DE3029521A1 (de) * | 1980-08-04 | 1982-03-04 | Helmuth 2058 Lauenburg Schmoock | Schaltung mit aufgedruckten leiterbahnen und verfahren zu deren herstellung |
| JPS62154793A (ja) * | 1985-12-27 | 1987-07-09 | 三菱レイヨン株式会社 | パタ−ン印刷基材の製法 |
| US6975067B2 (en) | 2002-12-19 | 2005-12-13 | 3M Innovative Properties Company | Organic electroluminescent device and encapsulation method |
| US20040152240A1 (en) * | 2003-01-24 | 2004-08-05 | Carlos Dangelo | Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits |
| US7175876B2 (en) | 2003-06-27 | 2007-02-13 | 3M Innovative Properties Company | Patterned coating method employing polymeric coatings |
| EP2477230B1 (en) | 2005-08-12 | 2015-02-25 | Cambrios Technologies Corporation | Nanowires-based transparent conductors on a flexible donor substrate |
| US8018568B2 (en) | 2006-10-12 | 2011-09-13 | Cambrios Technologies Corporation | Nanowire-based transparent conductors and applications thereof |
| WO2008127313A2 (en) | 2006-11-17 | 2008-10-23 | The Regents Of The University Of California | Electrically conducting and optically transparent nanowire networks |
| US8026903B2 (en) | 2007-01-03 | 2011-09-27 | Apple Inc. | Double-sided touch sensitive panel and flex circuit bonding |
| JP5041214B2 (ja) * | 2007-06-15 | 2012-10-03 | ソニー株式会社 | 金属薄膜の形成方法および電子デバイスの製造方法 |
| CN101903477B (zh) | 2007-12-19 | 2013-10-30 | 3M创新有限公司 | 用于微接触印刷的油墨溶液 |
| WO2009108771A2 (en) | 2008-02-28 | 2009-09-03 | 3M Innovative Properties Company | Methods of patterning a conductor on a substrate |
| EP4300190B1 (en) | 2008-02-28 | 2025-06-25 | 3M Innovative Properties Co. | Touch screen sensor |
| KR20100028306A (ko) * | 2008-09-04 | 2010-03-12 | 삼성전기주식회사 | 인쇄회로기판 및 그 제조 방법 |
| WO2010061206A1 (en) * | 2008-11-03 | 2010-06-03 | Cambridge Enterprise Limited | Method of patterning an electronic of photonic material |
| KR101219139B1 (ko) * | 2009-12-24 | 2013-01-07 | 제일모직주식회사 | 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체 |
| JP2013522814A (ja) * | 2010-02-24 | 2013-06-13 | カンブリオス テクノロジーズ コーポレイション | ナノワイヤベースの透明導体およびそれをパターン形成するための方法 |
| KR101314779B1 (ko) * | 2010-08-18 | 2013-10-08 | 엘지디스플레이 주식회사 | 정전용량 방식 터치 스크린 패널 및 그 제조방법 |
| US8673049B2 (en) | 2010-08-27 | 2014-03-18 | Dowa Electronics Materials Co., Ltd. | Low-temperature sintered silver nanoparticle composition and electronic articles formed using the same |
| CN103109391B (zh) * | 2010-09-24 | 2016-07-20 | 加利福尼亚大学董事会 | 纳米线-聚合物复合材料电极 |
| CN103460123B (zh) | 2011-04-15 | 2016-02-10 | 3M创新有限公司 | 用于电子显示器的透明电极 |
| KR101812606B1 (ko) * | 2011-04-26 | 2017-12-27 | 니폰 메크트론 가부시키가이샤 | 투명인쇄회로 제조방법 및 투명터치패널 제조방법 |
| US9603242B2 (en) * | 2011-12-21 | 2017-03-21 | 3M Innovative Properties Company | Laser patterning of silver nanowire-based transparent electrically conducting coatings |
| WO2013133272A1 (ja) | 2012-03-06 | 2013-09-12 | デクセリアルズ株式会社 | 透明導電膜、導電性素子、組成物、入力装置、表示装置および電子機器 |
| WO2014088950A1 (en) | 2012-12-07 | 2014-06-12 | 3M Innovative Properties Company | Method of making transparent conductors on a substrate |
| US9980394B2 (en) | 2013-07-31 | 2018-05-22 | 3M Innovative Properties Company | Bonding electronic components to patterned nanowire transparent conductors |
-
2014
- 2014-09-22 WO PCT/US2014/056768 patent/WO2015047944A1/en not_active Ceased
- 2014-09-22 BR BR112016006975A patent/BR112016006975A2/pt not_active Application Discontinuation
- 2014-09-22 KR KR1020167010931A patent/KR102264357B1/ko not_active Expired - Fee Related
- 2014-09-22 SG SG11201602419WA patent/SG11201602419WA/en unknown
- 2014-09-22 CN CN201480053997.5A patent/CN105593796B/zh not_active Expired - Fee Related
- 2014-09-22 US US15/025,696 patent/US10362685B2/en active Active
- 2014-09-22 EP EP14850091.1A patent/EP3053012B1/en active Active
- 2014-09-22 JP JP2016518723A patent/JP6480428B2/ja not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010507261A (ja) * | 2006-10-18 | 2010-03-04 | スリーエム イノベイティブ プロパティズ カンパニー | ポリマー基材上で物質をパターニングする方法 |
| JP2012178149A (ja) * | 2011-02-04 | 2012-09-13 | Shin Etsu Polymer Co Ltd | 静電容量式センサーシートおよびその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| US10362685B2 (en) | 2019-07-23 |
| EP3053012A1 (en) | 2016-08-10 |
| JP2016535433A (ja) | 2016-11-10 |
| US20160249461A1 (en) | 2016-08-25 |
| JP6480428B2 (ja) | 2019-03-13 |
| BR112016006975A2 (pt) | 2017-08-01 |
| KR20160063368A (ko) | 2016-06-03 |
| SG11201602419WA (en) | 2016-04-28 |
| EP3053012A4 (en) | 2017-05-03 |
| EP3053012B1 (en) | 2019-10-23 |
| WO2015047944A1 (en) | 2015-04-02 |
| CN105593796A (zh) | 2016-05-18 |
| CN105593796B (zh) | 2019-01-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102264357B1 (ko) | 패턴화된 나노와이어 투명 전도체 상의 인쇄된 전도성 패턴을 위한 보호 코팅 | |
| US9980394B2 (en) | Bonding electronic components to patterned nanowire transparent conductors | |
| US10831233B2 (en) | Method of making transparent conductors on a substrate | |
| KR101362863B1 (ko) | 투명 도전층 패턴의 형성 방법 | |
| US20190114003A1 (en) | Nanowire contact pads with enhanced adhesion to metal interconnects | |
| US10492305B2 (en) | Patterned overcoat layer | |
| US11284521B2 (en) | Electronic devices comprising a via and methods of forming such electronic devices | |
| US20190357360A1 (en) | Methods for Preparing Electrically Conductive Patterns and Articles Containing Electrically Conductive Patterns |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| D13-X000 | Search requested |
St.27 status event code: A-1-2-D10-D13-srh-X000 |
|
| D14-X000 | Search report completed |
St.27 status event code: A-1-2-D10-D14-srh-X000 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| E701 | Decision to grant or registration of patent right | ||
| PE0701 | Decision of registration |
St.27 status event code: A-1-2-D10-D22-exm-PE0701 |
|
| GRNT | Written decision to grant | ||
| PR0701 | Registration of establishment |
St.27 status event code: A-2-4-F10-F11-exm-PR0701 |
|
| PR1002 | Payment of registration fee |
St.27 status event code: A-2-2-U10-U12-oth-PR1002 Fee payment year number: 1 |
|
| PG1601 | Publication of registration |
St.27 status event code: A-4-4-Q10-Q13-nap-PG1601 |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: A-4-4-U10-U13-oth-PC1903 Not in force date: 20240609 Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE |
|
| PC1903 | Unpaid annual fee |
St.27 status event code: N-4-6-H10-H13-oth-PC1903 Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE Not in force date: 20240609 |