JP6480428B2 - パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ - Google Patents

パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ Download PDF

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JP6480428B2
JP6480428B2 JP2016518723A JP2016518723A JP6480428B2 JP 6480428 B2 JP6480428 B2 JP 6480428B2 JP 2016518723 A JP2016518723 A JP 2016518723A JP 2016518723 A JP2016518723 A JP 2016518723A JP 6480428 B2 JP6480428 B2 JP 6480428B2
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conductive
layer
substrate
interconnect circuit
patterned
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JP2016535433A (ja
JP2016535433A5 (enExample
Inventor
エム．ギルマン アン
エム．ギルマン アン
エル．ペクロフスキー ミカイル
エル．ペクロフスキー ミカイル
エス．ステイ マシュー
エス．ステイ マシュー
シー．ドッズ ショーン
シー．ドッズ ショーン
ジェイ．セイス ダニエル
ジェイ．セイス ダニエル
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3M Innovative Properties Co
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3M Innovative Properties Co
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/13338—Input devices, e.g. touch panels
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/027—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed by irradiation, e.g. by photons, alpha or beta particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133302—Rigid substrates, e.g. inorganic substrates
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04102—Flexible digitiser, i.e. constructional details for allowing the whole digitising part of a device to be flexed or rolled like a sheet of paper
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04107—Shielding in digitiser, i.e. guard or shielding arrangements, mostly for capacitive touchscreens, e.g. driven shields, driven grounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1377—Protective layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/10—Shapes, relative sizes or dispositions of the regions of the semiconductor bodies; Shapes of the semiconductor bodies
    • H10D62/117—Shapes of semiconductor bodies
    • H10D62/118—Nanostructure semiconductor bodies
    • H10D62/119—Nanowire, nanosheet or nanotube semiconductor bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/0123—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs
    • H10D84/0126—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs
    • H10D84/0165—Integrating together multiple components covered by H10D12/00 or H10D30/00, e.g. integrating multiple IGBTs the components including insulated gates, e.g. IGFETs the components including complementary IGFETs, e.g. CMOS devices
    • H10D84/0186—Manufacturing their interconnections or electrodes, e.g. source or drain electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • H10D84/02—Manufacture or treatment characterised by using material-based technologies
    • H10D84/03—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology
    • H10D84/038—Manufacture or treatment characterised by using material-based technologies using Group IV technology, e.g. silicon technology or silicon-carbide [SiC] technology using silicon technology, e.g. SiGe
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/70—Nanostructure
    • Y10S977/762—Nanowire or quantum wire, i.e. axially elongated structure having two dimensions of 100 nm or less
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/84—Manufacture, treatment, or detection of nanostructure
    • Y10S977/89—Deposition of materials, e.g. coating, cvd, or ald
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S977/00—Nanotechnology
    • Y10S977/902—Specified use of nanostructure
    • Y10S977/932—Specified use of nanostructure for electronic or optoelectronic application
    • Y10S977/953—Detector using nanostructure
    • Y10S977/956—Of mechanical property

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Human Computer Interaction (AREA)
  • Nonlinear Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Liquid Crystal (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
JP2016518723A 2013-09-30 2014-09-22 パターン化されたナノワイヤ透明導電体上の印刷された導電性パターンのための保護用コーティイグ Expired - Fee Related JP6480428B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361884954P 2013-09-30 2013-09-30
US61/884,954 2013-09-30
PCT/US2014/056768 WO2015047944A1 (en) 2013-09-30 2014-09-22 Protective coating for printed conductive pattern on patterned nanowire transparent conductors

Publications (3)

Publication Number Publication Date
JP2016535433A JP2016535433A (ja) 2016-11-10
JP2016535433A5 JP2016535433A5 (enExample) 2017-10-19
JP6480428B2 true JP6480428B2 (ja) 2019-03-13

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Country Status (8)

Country Link
US (1) US10362685B2 (enExample)
EP (1) EP3053012B1 (enExample)
JP (1) JP6480428B2 (enExample)
KR (1) KR102264357B1 (enExample)
CN (1) CN105593796B (enExample)
BR (1) BR112016006975A2 (enExample)
SG (1) SG11201602419WA (enExample)
WO (1) WO2015047944A1 (enExample)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102543985B1 (ko) * 2015-10-27 2023-06-14 삼성전자주식회사 전도막 및 이를 포함하는 전자 소자
JP6654954B2 (ja) * 2016-03-31 2020-02-26 デクセリアルズ株式会社 異方性導電接続構造体
GB2551502A (en) * 2016-06-17 2017-12-27 M-Solv Ltd Apparatus and methods for manufacturing a sensor and a display, and a sensor and a display
US10327332B2 (en) * 2016-10-06 2019-06-18 Microsoft Technology Licensing, Llc Connecting a flexible circuit to other structures
US11184975B2 (en) * 2017-02-06 2021-11-23 Carnegie Mellon University Method of creating a flexible circuit
CN110825253A (zh) * 2018-08-13 2020-02-21 南昌欧菲光科技有限公司 触控组件和触摸显示屏
JP2023523765A (ja) * 2020-05-01 2023-06-07 スリーエム イノベイティブ プロパティズ カンパニー 反射光学メタ表面フィルム
CN114698254B (zh) * 2020-12-31 2025-01-24 天材创新材料科技(厦门)有限公司 叠构结构及触控感应器

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3660088A (en) * 1970-09-16 1972-05-02 Grace W R & Co Photo-resist process
JPS5388163A (en) * 1977-01-14 1978-08-03 Esu Kei Kk Method of producing printed circuit board
DE3029521A1 (de) * 1980-08-04 1982-03-04 Helmuth 2058 Lauenburg Schmoock Schaltung mit aufgedruckten leiterbahnen und verfahren zu deren herstellung
JPS62154793A (ja) * 1985-12-27 1987-07-09 三菱レイヨン株式会社 パタ−ン印刷基材の製法
US6975067B2 (en) 2002-12-19 2005-12-13 3M Innovative Properties Company Organic electroluminescent device and encapsulation method
US20040152240A1 (en) * 2003-01-24 2004-08-05 Carlos Dangelo Method and apparatus for the use of self-assembled nanowires for the removal of heat from integrated circuits
US7175876B2 (en) 2003-06-27 2007-02-13 3M Innovative Properties Company Patterned coating method employing polymeric coatings
KR101333012B1 (ko) 2005-08-12 2013-12-02 캄브리오스 테크놀로지즈 코포레이션 나노와이어 기반의 투명 도전체
US8018568B2 (en) * 2006-10-12 2011-09-13 Cambrios Technologies Corporation Nanowire-based transparent conductors and applications thereof
US8764996B2 (en) * 2006-10-18 2014-07-01 3M Innovative Properties Company Methods of patterning a material on polymeric substrates
WO2008127313A2 (en) 2006-11-17 2008-10-23 The Regents Of The University Of California Electrically conducting and optically transparent nanowire networks
US8026903B2 (en) * 2007-01-03 2011-09-27 Apple Inc. Double-sided touch sensitive panel and flex circuit bonding
JP5041214B2 (ja) * 2007-06-15 2012-10-03 ソニー株式会社 金属薄膜の形成方法および電子デバイスの製造方法
JP5543367B2 (ja) * 2007-12-19 2014-07-09 スリーエム イノベイティブ プロパティズ カンパニー マイクロコンタクトプリンティング用のインク溶液
EP2263141B1 (en) 2008-02-28 2018-11-21 3M Innovative Properties Company Touch screen sensor
US8425792B2 (en) * 2008-02-28 2013-04-23 3M Innovative Properties Company Methods of patterning a conductor on a substrate
KR20100028306A (ko) * 2008-09-04 2010-03-12 삼성전기주식회사 인쇄회로기판 및 그 제조 방법
EP2356706B1 (en) 2008-11-03 2013-11-20 Cambridge Enterprise Ltd. Method of patterning an electronic or photonic material
KR101219139B1 (ko) 2009-12-24 2013-01-07 제일모직주식회사 이방 도전성 페이스트, 필름 및 이를 포함하는 회로접속구조체
WO2011106438A1 (en) 2010-02-24 2011-09-01 Cambrios Technologies Corporation Nanowire-based transparent conductors and methods of patterning same
KR101314779B1 (ko) * 2010-08-18 2013-10-08 엘지디스플레이 주식회사 정전용량 방식 터치 스크린 패널 및 그 제조방법
JP5632852B2 (ja) 2010-08-27 2014-11-26 Ｄｏｗａエレクトロニクス株式会社 低温焼結性銀ナノ粒子組成物および該組成物を用いて形成された電子物品
EP2619816A4 (en) * 2010-09-24 2014-06-11 Univ California NANO WIRE POLYMER COMPOSITE ELECTRODES
US9482693B2 (en) * 2011-02-04 2016-11-01 Shin-Etsu Polymer Co., Ltd. Capacitive sensor sheet and production method thereof
WO2012145157A1 (en) 2011-04-15 2012-10-26 3M Innovative Properties Company Transparent electrode for electronic displays
EP2712284A4 (en) * 2011-04-26 2014-11-05 Nippon Mektron Kk METHOD FOR PRODUCING A TRANSPARENT PRINTED PCB AND METHOD FOR PRODUCING A TRANSPARENT TOUCH SCREEN
CN104094362B (zh) * 2011-12-21 2017-01-18 3M创新有限公司 基于银纳米线的透明导电涂层的激光图案化
US20150017457A1 (en) 2012-03-06 2015-01-15 Dexerials Corporation Transparent conductive film, conductive element, composition, input device, display device and electronic instrument
CN104838342B (zh) 2012-12-07 2018-03-13 3M创新有限公司 在基板上制作透明导体的方法
CN105453001B (zh) * 2013-07-31 2018-10-16 3M创新有限公司 将电子部件粘结到图案化纳米线透明导体

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Publication number Publication date
EP3053012A4 (en) 2017-05-03
WO2015047944A1 (en) 2015-04-02
KR20160063368A (ko) 2016-06-03
CN105593796B (zh) 2019-01-04
SG11201602419WA (en) 2016-04-28
JP2016535433A (ja) 2016-11-10
BR112016006975A2 (pt) 2017-08-01
US10362685B2 (en) 2019-07-23
CN105593796A (zh) 2016-05-18
EP3053012B1 (en) 2019-10-23
US20160249461A1 (en) 2016-08-25
KR102264357B1 (ko) 2021-06-15
EP3053012A1 (en) 2016-08-10

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