KR102259441B1 - 파단 장치 및 분단 방법 - Google Patents

파단 장치 및 분단 방법 Download PDF

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Publication number
KR102259441B1
KR102259441B1 KR1020140073640A KR20140073640A KR102259441B1 KR 102259441 B1 KR102259441 B1 KR 102259441B1 KR 1020140073640 A KR1020140073640 A KR 1020140073640A KR 20140073640 A KR20140073640 A KR 20140073640A KR 102259441 B1 KR102259441 B1 KR 102259441B1
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KR
South Korea
Prior art keywords
substrate
brittle material
composite substrate
material substrate
breaking
Prior art date
Application number
KR1020140073640A
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English (en)
Korean (ko)
Other versions
KR20150044367A (ko
Inventor
히로유키 토미모토
나오히로 쿠로다
유마 이와츠보
이쿠요시 나카타니
마사카즈 타케다
켄지 무라카미
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of KR20150044367A publication Critical patent/KR20150044367A/ko
Application granted granted Critical
Publication of KR102259441B1 publication Critical patent/KR102259441B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0017—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools
    • B28D5/0023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing using moving tools rectilinearly
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/76—Making of isolation regions between components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Laminated Bodies (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020140073640A 2013-10-16 2014-06-17 파단 장치 및 분단 방법 KR102259441B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-215394 2013-10-16
JP2013215394A JP6115438B2 (ja) 2013-10-16 2013-10-16 破断装置及び分断方法

Publications (2)

Publication Number Publication Date
KR20150044367A KR20150044367A (ko) 2015-04-24
KR102259441B1 true KR102259441B1 (ko) 2021-06-01

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020140073640A KR102259441B1 (ko) 2013-10-16 2014-06-17 파단 장치 및 분단 방법

Country Status (4)

Country Link
JP (1) JP6115438B2 (ja)
KR (1) KR102259441B1 (ja)
CN (1) CN104552629B (ja)
TW (1) TWI620636B (ja)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6243699B2 (ja) * 2013-10-25 2017-12-06 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置
JP6407056B2 (ja) * 2015-02-20 2018-10-17 株式会社ディスコ 分割装置と分割方法
JP6561565B2 (ja) * 2015-04-30 2019-08-21 三星ダイヤモンド工業株式会社 貼り合わせ基板の分割方法及び分割装置
JP2017001180A (ja) * 2016-09-29 2017-01-05 三星ダイヤモンド工業株式会社 脆性材料基板の表面層破断装置
EP3410473B1 (de) * 2017-05-30 2021-02-24 Infineon Technologies AG Anordnung und verfahren zum vereinzeln von substraten
TW202041343A (zh) * 2018-12-18 2020-11-16 日商三星鑽石工業股份有限公司 陶瓷片的製造方法及陶瓷片製造用之煅燒前片的製造方法
KR20220032522A (ko) * 2019-07-16 2022-03-15 닛토덴코 가부시키가이샤 복합재의 분단 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012066479A (ja) 2010-09-24 2012-04-05 Mitsuboshi Diamond Industrial Co Ltd 樹脂付き脆性材料基板の分割方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS639950A (ja) * 1986-06-30 1988-01-16 Nec Kansai Ltd 半導体素子の分離方法
JP3787489B2 (ja) * 2000-10-02 2006-06-21 三星ダイヤモンド工業株式会社 脆性基板のブレイク方法及び装置
JP2002151443A (ja) * 2000-11-08 2002-05-24 Victor Co Of Japan Ltd 半導体素子の劈開装置
JP3792508B2 (ja) * 2000-12-19 2006-07-05 三星ダイヤモンド工業株式会社 貼り合わせ脆性基板の分断方法
JP3779237B2 (ja) 2002-07-04 2006-05-24 住友電気工業株式会社 基板切断方法及び基板切断装置
JP4210981B2 (ja) * 2002-09-27 2009-01-21 住友電気工業株式会社 劈開装置及び劈開方法
KR101170587B1 (ko) * 2005-01-05 2012-08-01 티에이치케이 인텍스 가부시키가이샤 워크의 브레이크 방법 및 장치, 스크라이브 및 브레이크방법, 및 브레이크 기능을 갖는 스크라이브 장치
JP5356931B2 (ja) 2008-11-26 2013-12-04 三星ダイヤモンド工業株式会社 基板割断装置
JP5421699B2 (ja) * 2009-09-07 2014-02-19 三菱電機株式会社 半導体素子分離方法および半導体素子分離装置
JP2013089622A (ja) * 2011-10-13 2013-05-13 Mitsuboshi Diamond Industrial Co Ltd 半導体基板のブレイク方法
JP5824365B2 (ja) * 2012-01-16 2015-11-25 三星ダイヤモンド工業株式会社 脆性材料基板のブレイク方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012066479A (ja) 2010-09-24 2012-04-05 Mitsuboshi Diamond Industrial Co Ltd 樹脂付き脆性材料基板の分割方法

Also Published As

Publication number Publication date
CN104552629A (zh) 2015-04-29
TWI620636B (zh) 2018-04-11
CN104552629B (zh) 2017-11-10
TW201515802A (zh) 2015-05-01
KR20150044367A (ko) 2015-04-24
JP2015079824A (ja) 2015-04-23
JP6115438B2 (ja) 2017-04-19

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