KR102248777B1 - 총 측정 불확도의 정량화 및 감소 - Google Patents

총 측정 불확도의 정량화 및 감소 Download PDF

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KR102248777B1
KR102248777B1 KR1020197014620A KR20197014620A KR102248777B1 KR 102248777 B1 KR102248777 B1 KR 102248777B1 KR 1020197014620 A KR1020197014620 A KR 1020197014620A KR 20197014620 A KR20197014620 A KR 20197014620A KR 102248777 B1 KR102248777 B1 KR 102248777B1
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South Korea
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tmu
tools
manufacturing
cli
measurement
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KR20190059329A (ko
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카렌 비아지니
브라이언트 맨티플리
라오 라비찬데르 자얀다
개리 탄
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케이엘에이 코포레이션
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37525—Mean, average values, statistical derived values
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020197014620A 2016-10-21 2017-10-19 총 측정 불확도의 정량화 및 감소 Active KR102248777B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/299,616 US10372114B2 (en) 2016-10-21 2016-10-21 Quantifying and reducing total measurement uncertainty
US15/299,616 2016-10-21
PCT/US2017/057467 WO2018075814A2 (en) 2016-10-21 2017-10-19 Quantifying and reducing total measurement uncertainty

Publications (2)

Publication Number Publication Date
KR20190059329A KR20190059329A (ko) 2019-05-30
KR102248777B1 true KR102248777B1 (ko) 2021-05-04

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197014620A Active KR102248777B1 (ko) 2016-10-21 2017-10-19 총 측정 불확도의 정량화 및 감소

Country Status (7)

Country Link
US (1) US10372114B2 (https=)
JP (1) JP6941169B2 (https=)
KR (1) KR102248777B1 (https=)
CN (1) CN109844664B (https=)
DE (1) DE112017005308T5 (https=)
TW (1) TWI725244B (https=)
WO (1) WO2018075814A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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US10360671B2 (en) 2017-07-11 2019-07-23 Kla-Tencor Corporation Tool health monitoring and matching
DE102018211099B4 (de) 2018-07-05 2020-06-18 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Bewerten eines statistisch verteilten Messwertes beim Untersuchen eines Elements eines Photolithographieprozesses
KR102441849B1 (ko) * 2020-09-04 2022-09-08 한국표준과학연구원 계측 센서 근접대응스팬교정에 의한 측정값의 불확도 정량화 방법 및 장치
US20240142948A1 (en) * 2022-11-01 2024-05-02 Kla Corporation Methods And Systems For Monitoring Metrology Fleet Productivity
CN116387208B (zh) * 2023-06-02 2023-08-18 合肥喆塔科技有限公司 基于阈值管控的腔室匹配分析方法、系统、设备及介质
CN117259466B (zh) * 2023-10-07 2024-04-09 河北华伦线缆有限公司 电缆导体用不确定度控制方法

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US6430456B1 (en) 1999-07-26 2002-08-06 Advanced Micro Devices, Inc. Efficient process tool utilization in semiconductor manufacturing using an additional process tool state
US6738682B1 (en) 2001-09-13 2004-05-18 Advances Micro Devices, Inc. Method and apparatus for scheduling based on state estimation uncertainties
US20030079121A1 (en) 2001-10-19 2003-04-24 Applied Materials, Inc. Secure end-to-end communication over a public network from a computer inside a first private network to a server at a second private network
US7143288B2 (en) * 2002-10-16 2006-11-28 Vormetric, Inc. Secure file system server architecture and methods
US7352478B2 (en) * 2002-12-20 2008-04-01 International Business Machines Corporation Assessment and optimization for metrology instrument
CN1695040B (zh) * 2002-12-20 2010-07-28 国际商业机器公司 用于计量仪器的评估和优化方法
WO2004072668A1 (en) * 2003-02-13 2004-08-26 Mcgill Iniversity Mixed-signal-device testing
US7848911B2 (en) 2004-02-20 2010-12-07 Agilent Technologies, Inc. Method of determining measurement uncertainties using circuit simulation
US7107177B2 (en) 2005-02-14 2006-09-12 International Business Machines Corporation Combining multiple reference measurement collections into a weighted reference measurement collection
TWI276932B (en) 2005-02-17 2007-03-21 Powerchip Semiconductor Corp Methods for determining tool assignment sequence and manufacturing systems using the same
US7340374B2 (en) * 2005-02-25 2008-03-04 International Business Machines Corporation Determining fleet matching problem and root cause issue for measurement system
KR100613821B1 (ko) * 2005-05-19 2006-08-22 인터내셔널 비지네스 머신즈 코포레이션 계측 기구에 대한 평가 및 최적화
US7065425B1 (en) * 2005-06-22 2006-06-20 Internaitonal Business Machines Corporation Metrology tool error log analysis methodology and system
DE102005030586A1 (de) 2005-06-30 2007-01-11 Advanced Micro Devices, Inc., Sunnyvale Verfahren und System für eine fortschrittliche Prozesssteuerung unter Anwendung der Messunsicherheit als Steuerungseingang
US8335670B2 (en) 2006-03-17 2012-12-18 Canberra Industries, Inc. Probabilistic uncertainty estimator
TWI306149B (en) * 2007-01-05 2009-02-11 Chroma Ate Inc Optical device for sensing distance
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JP5209012B2 (ja) 2010-09-22 2013-06-12 株式会社東芝 位置合わせ測定方法及び位置合わせ測定装置
US8193007B1 (en) * 2011-02-17 2012-06-05 Tokyo Electron Limited Etch process control using optical metrology and sensor devices
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Also Published As

Publication number Publication date
TW201827966A (zh) 2018-08-01
JP6941169B2 (ja) 2021-09-29
WO2018075814A3 (en) 2018-07-26
TWI725244B (zh) 2021-04-21
WO2018075814A2 (en) 2018-04-26
CN109844664B (zh) 2020-11-10
CN109844664A (zh) 2019-06-04
JP2019537788A (ja) 2019-12-26
US10372114B2 (en) 2019-08-06
DE112017005308T5 (de) 2019-08-08
US20180113441A1 (en) 2018-04-26
KR20190059329A (ko) 2019-05-30

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