CN109844664B - 量化并减小总测量不确定度 - Google Patents

量化并减小总测量不确定度 Download PDF

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Publication number
CN109844664B
CN109844664B CN201780064588.9A CN201780064588A CN109844664B CN 109844664 B CN109844664 B CN 109844664B CN 201780064588 A CN201780064588 A CN 201780064588A CN 109844664 B CN109844664 B CN 109844664B
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tools
tmu
measurement
manufacturing
tool
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Chinese (zh)
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CN109844664A (zh
Inventor
K·比亚吉尼
B·曼蒂普利
R·贾扬塔拉奥
G·塔安
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KLA Corp
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KLA Tencor Corp
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    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4184—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by fault tolerance, reliability of production system
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B23/00—Testing or monitoring of control systems or parts thereof
    • G05B23/02—Electric testing or monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0616—Monitoring of warpages, curvatures, damages, defects or the like
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/37—Measurements
    • G05B2219/37525—Mean, average values, statistical derived values
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Automation & Control Theory (AREA)
  • General Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Quality & Reliability (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201780064588.9A 2016-10-21 2017-10-19 量化并减小总测量不确定度 Active CN109844664B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/299,616 US10372114B2 (en) 2016-10-21 2016-10-21 Quantifying and reducing total measurement uncertainty
US15/299,616 2016-10-21
PCT/US2017/057467 WO2018075814A2 (en) 2016-10-21 2017-10-19 Quantifying and reducing total measurement uncertainty

Publications (2)

Publication Number Publication Date
CN109844664A CN109844664A (zh) 2019-06-04
CN109844664B true CN109844664B (zh) 2020-11-10

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US (1) US10372114B2 (https=)
JP (1) JP6941169B2 (https=)
KR (1) KR102248777B1 (https=)
CN (1) CN109844664B (https=)
DE (1) DE112017005308T5 (https=)
TW (1) TWI725244B (https=)
WO (1) WO2018075814A2 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
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US10360671B2 (en) 2017-07-11 2019-07-23 Kla-Tencor Corporation Tool health monitoring and matching
DE102018211099B4 (de) 2018-07-05 2020-06-18 Carl Zeiss Smt Gmbh Verfahren und Vorrichtung zum Bewerten eines statistisch verteilten Messwertes beim Untersuchen eines Elements eines Photolithographieprozesses
KR102441849B1 (ko) * 2020-09-04 2022-09-08 한국표준과학연구원 계측 센서 근접대응스팬교정에 의한 측정값의 불확도 정량화 방법 및 장치
US20240142948A1 (en) * 2022-11-01 2024-05-02 Kla Corporation Methods And Systems For Monitoring Metrology Fleet Productivity
CN116387208B (zh) * 2023-06-02 2023-08-18 合肥喆塔科技有限公司 基于阈值管控的腔室匹配分析方法、系统、设备及介质
CN117259466B (zh) * 2023-10-07 2024-04-09 河北华伦线缆有限公司 电缆导体用不确定度控制方法

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CN1695040B (zh) * 2002-12-20 2010-07-28 国际商业机器公司 用于计量仪器的评估和优化方法
CN102687073A (zh) * 2009-10-13 2012-09-19 Asml荷兰有限公司 检验方法和设备
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US7143288B2 (en) * 2002-10-16 2006-11-28 Vormetric, Inc. Secure file system server architecture and methods
US7352478B2 (en) * 2002-12-20 2008-04-01 International Business Machines Corporation Assessment and optimization for metrology instrument
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CN101460944A (zh) * 2005-02-25 2009-06-17 国际商业机器公司 为测量系统确定队列匹配问题和根本原因要点
CN102687073A (zh) * 2009-10-13 2012-09-19 Asml荷兰有限公司 检验方法和设备
CN104736962A (zh) * 2012-09-05 2015-06-24 科磊股份有限公司 用于估计及校正偏移目标不准确度的方法

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Publication number Publication date
KR102248777B1 (ko) 2021-05-04
TW201827966A (zh) 2018-08-01
JP6941169B2 (ja) 2021-09-29
WO2018075814A3 (en) 2018-07-26
TWI725244B (zh) 2021-04-21
WO2018075814A2 (en) 2018-04-26
CN109844664A (zh) 2019-06-04
JP2019537788A (ja) 2019-12-26
US10372114B2 (en) 2019-08-06
DE112017005308T5 (de) 2019-08-08
US20180113441A1 (en) 2018-04-26
KR20190059329A (ko) 2019-05-30

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