KR102238611B1 - 전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판 - Google Patents

전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판 Download PDF

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Publication number
KR102238611B1
KR102238611B1 KR1020200147293A KR20200147293A KR102238611B1 KR 102238611 B1 KR102238611 B1 KR 102238611B1 KR 1020200147293 A KR1020200147293 A KR 1020200147293A KR 20200147293 A KR20200147293 A KR 20200147293A KR 102238611 B1 KR102238611 B1 KR 102238611B1
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KR
South Korea
Prior art keywords
electromagnetic wave
wave shielding
layer
metal layer
adhesive layer
Prior art date
Application number
KR1020200147293A
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English (en)
Korean (ko)
Inventor
다이스케 키시
쇼타 모리
Original Assignee
토요잉크Sc홀딩스주식회사
토요켐주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 토요잉크Sc홀딩스주식회사, 토요켐주식회사 filed Critical 토요잉크Sc홀딩스주식회사
Application granted granted Critical
Publication of KR102238611B1 publication Critical patent/KR102238611B1/ko

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Structure Of Printed Boards (AREA)
  • Laminated Bodies (AREA)
KR1020200147293A 2020-01-21 2020-11-06 전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판 KR102238611B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-007344 2020-01-21
JP2020007344A JP6690801B1 (ja) 2020-01-21 2020-01-21 電磁波シールドシート、および電磁波シールド性配線回路基板

Publications (1)

Publication Number Publication Date
KR102238611B1 true KR102238611B1 (ko) 2021-04-09

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ID=70413872

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200147293A KR102238611B1 (ko) 2020-01-21 2020-11-06 전자파 차폐 시트 및 전자파 차폐성 배선 회로 기판

Country Status (4)

Country Link
JP (2) JP6690801B1 (ja)
KR (1) KR102238611B1 (ja)
CN (1) CN112616306B (ja)
TW (1) TWI776347B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI826240B (zh) * 2023-01-16 2023-12-11 蘇憲強 可絕緣及抑制電磁波之無線電路模組及製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0345610B2 (ja) * 1985-05-28 1991-07-11 Manyufuakuchuuru Dapareiyu Erekutoriiku Do Kaooru
WO2013077108A1 (ja) 2011-11-24 2013-05-30 タツタ電線株式会社 シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法
JP2019121731A (ja) 2018-01-10 2019-07-22 タツタ電線株式会社 電磁波シールドフィルム

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5581163B2 (ja) * 2010-09-30 2014-08-27 日東電工株式会社 ワイヤレス電力伝送用電磁波シールドシート
CN104487534B (zh) * 2012-07-11 2016-11-09 大自达电线股份有限公司 硬化导电胶组成物、电磁波屏蔽膜、导电胶膜、黏合方法及线路基板
JP2014090162A (ja) * 2012-10-04 2014-05-15 Shin Etsu Polymer Co Ltd カバーレイフィルムおよびフレキシブルプリント配線板
JP2015065342A (ja) * 2013-09-25 2015-04-09 タツタ電線株式会社 シールド収容体、プリント回路板、及び、電子機器
US9949359B2 (en) * 2014-03-18 2018-04-17 Apple Inc. Multi-layer thin-film coatings for system-in-package assemblies in portable electronic devices
KR101862121B1 (ko) * 2015-02-02 2018-05-29 토요잉크Sc홀딩스주식회사 전자파 차폐 시트, 프린트 배선판 및 전자 기기
CN105120643B (zh) * 2015-06-30 2019-04-19 保定乐凯新材料股份有限公司 一种用于快速加工的热塑性电磁波屏蔽膜
CN105246313B (zh) * 2015-09-29 2018-07-27 朱春芳 一种电磁波屏蔽膜、含有该屏蔽膜的印刷线路板及该线路板的制备方法
CN107660113A (zh) * 2016-07-26 2018-02-02 昆山雅森电子材料科技有限公司 高传输高屏蔽效能的电磁干扰屏蔽膜及其制备方法
JP2018166166A (ja) * 2017-03-28 2018-10-25 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板
JP6898127B2 (ja) * 2017-03-28 2021-07-07 信越ポリマー株式会社 電磁波シールドフィルムおよび電磁波シールドフィルム付きプリント配線板

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0345610B2 (ja) * 1985-05-28 1991-07-11 Manyufuakuchuuru Dapareiyu Erekutoriiku Do Kaooru
WO2013077108A1 (ja) 2011-11-24 2013-05-30 タツタ電線株式会社 シールドフィルム、シールドプリント配線板、及び、シールドフィルムの製造方法
JP2019121731A (ja) 2018-01-10 2019-07-22 タツタ電線株式会社 電磁波シールドフィルム

Also Published As

Publication number Publication date
CN112616306B (zh) 2022-03-08
TWI776347B (zh) 2022-09-01
JP6690801B1 (ja) 2020-04-28
JP2021118343A (ja) 2021-08-10
JP2021114574A (ja) 2021-08-05
TW202130262A (zh) 2021-08-01
CN112616306A (zh) 2021-04-06

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