KR102206690B1 - 레지스트 조성물 및 레지스트 패턴 형성 방법 - Google Patents
레지스트 조성물 및 레지스트 패턴 형성 방법 Download PDFInfo
- Publication number
- KR102206690B1 KR102206690B1 KR1020140033594A KR20140033594A KR102206690B1 KR 102206690 B1 KR102206690 B1 KR 102206690B1 KR 1020140033594 A KR1020140033594 A KR 1020140033594A KR 20140033594 A KR20140033594 A KR 20140033594A KR 102206690 B1 KR102206690 B1 KR 102206690B1
- Authority
- KR
- South Korea
- Prior art keywords
- group
- formula
- substituent
- carbon atoms
- atom
- Prior art date
Links
- 0 CCC(C)(*)C(OC(C)(C)*C(OC(C)(CC)C(C(C1*)O2)C(*)C*([C@](C)*)C1C2=O)=O)=O Chemical compound CCC(C)(*)C(OC(C)(C)*C(OC(C)(CC)C(C(C1*)O2)C(*)C*([C@](C)*)C1C2=O)=O)=O 0.000 description 18
- LYFYEICYYRVGIJ-UHFFFAOYSA-N CC(C(C=C1C)[S+](c2ccccc2)c2ccccc2)C(C)=C1OCC(OC)=O Chemical compound CC(C(C=C1C)[S+](c2ccccc2)c2ccccc2)C(C)=C1OCC(OC)=O LYFYEICYYRVGIJ-UHFFFAOYSA-N 0.000 description 1
- HCRKCIUGMPURRV-UHFFFAOYSA-N CC(CC(C=C1C)S(C(F)(F)F)c2ccccc2)=C1OC Chemical compound CC(CC(C=C1C)S(C(F)(F)F)c2ccccc2)=C1OC HCRKCIUGMPURRV-UHFFFAOYSA-N 0.000 description 1
- FSWCCQWDVGZMRD-UHFFFAOYSA-N CC1CC=CCC1 Chemical compound CC1CC=CCC1 FSWCCQWDVGZMRD-UHFFFAOYSA-N 0.000 description 1
- FYFUZDATLFPVNW-UHFFFAOYSA-N COC(C1(CC2CC3C4)CC23C4C1)=O Chemical compound COC(C1(CC2CC3C4)CC23C4C1)=O FYFUZDATLFPVNW-UHFFFAOYSA-N 0.000 description 1
- REXXMRNGADBZMM-UHFFFAOYSA-N CO[NH+](CCO)[O-] Chemical compound CO[NH+](CCO)[O-] REXXMRNGADBZMM-UHFFFAOYSA-N 0.000 description 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Cc1ccccc1 Chemical compound Cc1ccccc1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 1
Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07D—HETEROCYCLIC COMPOUNDS
- C07D498/00—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms
- C07D498/02—Heterocyclic compounds containing in the condensed system at least one hetero ring having nitrogen and oxygen atoms as the only ring hetero atoms in which the condensed system contains two hetero rings
- C07D498/04—Ortho-condensed systems
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/26—Esters containing oxygen in addition to the carboxy oxygen
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials For Photolithography (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2013-064407 | 2013-03-26 | ||
JP2013064407A JP6181955B2 (ja) | 2013-03-26 | 2013-03-26 | レジスト組成物及びレジストパターン形成方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20140117289A KR20140117289A (ko) | 2014-10-07 |
KR102206690B1 true KR102206690B1 (ko) | 2021-01-22 |
Family
ID=51837388
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020140033594A KR102206690B1 (ko) | 2013-03-26 | 2014-03-21 | 레지스트 조성물 및 레지스트 패턴 형성 방법 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6181955B2 (zh) |
KR (1) | KR102206690B1 (zh) |
TW (1) | TWI599849B (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6518475B2 (ja) * | 2015-03-20 | 2019-05-22 | 東京応化工業株式会社 | レジスト組成物、レジストパターン形成方法、酸発生剤及び化合物 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010138330A (ja) * | 2008-12-12 | 2010-06-24 | Fujifilm Corp | 感活性光線または感放射線性樹脂組成物及びそれを用いたパターン形成方法 |
JP2012073508A (ja) * | 2010-09-29 | 2012-04-12 | Fujifilm Corp | 感活性光線性または感放射線性樹脂組成物、感活性光線性または感放射線性膜およびパターン形成方法 |
JP2012208432A (ja) | 2011-03-30 | 2012-10-25 | Fujifilm Corp | パターン形成方法、感活性光線性又は感放射線性樹脂組成物、レジスト膜、電子デバイスの製造方法、及び、電子デバイス |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3895224B2 (ja) | 2001-12-03 | 2007-03-22 | 東京応化工業株式会社 | ポジ型レジスト組成物及びそれを用いたレジストパターン形成方法 |
JP5009015B2 (ja) | 2007-03-22 | 2012-08-22 | 株式会社ダイセル | 電子吸引性置換基及びラクトン骨格を含む多環式エステル及びその高分子化合物、フォトレジスト組成物 |
JP2009025723A (ja) | 2007-07-23 | 2009-02-05 | Fujifilm Corp | ネガ型現像用レジスト組成物及びこれを用いたパターン形成方法 |
JP4513990B2 (ja) * | 2008-01-18 | 2010-07-28 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
JP4513989B2 (ja) * | 2008-01-18 | 2010-07-28 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
JP4771101B2 (ja) * | 2008-09-05 | 2011-09-14 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
JP5499889B2 (ja) * | 2009-05-20 | 2014-05-21 | 信越化学工業株式会社 | スピロ環構造を有する酸脱離性エステル型単量体、高分子化合物、レジスト材料及びパターン形成方法 |
JP5206986B2 (ja) * | 2009-06-04 | 2013-06-12 | 信越化学工業株式会社 | ポジ型レジスト材料及びパターン形成方法 |
JP5666408B2 (ja) * | 2011-01-28 | 2015-02-12 | 信越化学工業株式会社 | レジスト組成物、及びこれを用いたパターン形成方法 |
JP5776580B2 (ja) * | 2011-02-25 | 2015-09-09 | 信越化学工業株式会社 | ポジ型レジスト材料及びこれを用いたパターン形成方法 |
TWI450038B (zh) * | 2011-06-22 | 2014-08-21 | Shinetsu Chemical Co | 圖案形成方法及光阻組成物 |
JP5910361B2 (ja) * | 2011-07-14 | 2016-04-27 | 信越化学工業株式会社 | パターン形成方法及びレジスト組成物 |
-
2013
- 2013-03-26 JP JP2013064407A patent/JP6181955B2/ja active Active
-
2014
- 2014-02-11 TW TW103104410A patent/TWI599849B/zh active
- 2014-03-21 KR KR1020140033594A patent/KR102206690B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010138330A (ja) * | 2008-12-12 | 2010-06-24 | Fujifilm Corp | 感活性光線または感放射線性樹脂組成物及びそれを用いたパターン形成方法 |
JP2012073508A (ja) * | 2010-09-29 | 2012-04-12 | Fujifilm Corp | 感活性光線性または感放射線性樹脂組成物、感活性光線性または感放射線性膜およびパターン形成方法 |
JP2012208432A (ja) | 2011-03-30 | 2012-10-25 | Fujifilm Corp | パターン形成方法、感活性光線性又は感放射線性樹脂組成物、レジスト膜、電子デバイスの製造方法、及び、電子デバイス |
Also Published As
Publication number | Publication date |
---|---|
JP6181955B2 (ja) | 2017-08-16 |
KR20140117289A (ko) | 2014-10-07 |
TW201447490A (zh) | 2014-12-16 |
TWI599849B (zh) | 2017-09-21 |
JP2014191060A (ja) | 2014-10-06 |
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