KR102203976B1 - The system of supplying a chemical enabling removal of air-pocket and the method thereof - Google Patents

Abstract

The present invention relates to a chemical supply system having an air pocket removal function, and a supply method thereof. More particularly, the present invention relates to a chemical supply system and a supply method having an air pocket removal function, which maintains a certain area of a pipe through which chemicals move in a vacuum state in the process of replacing a tank (canister) that stores chemicals with a new tank, and allows chemicals to be sucked into the vacuum air pocket when the new tank is installed. According to the present invention, when a chemical tank that supplies chemicals is replaced, the chemical inside the pipe can be completely removed, so safety is improved, and when the chemical tank is newly installed, there is an effect of preventing air from entering the inside of the pipe by allowing the chemical to flow naturally by the negative pressure inside the pipe.

Description

Chemical supply system and supply method with air pocket removal function {THE SYSTEM OF SUPPLYING A CHEMICAL ENABLING REMOVAL OF AIR-POCKET AND THE METHOD THEREOF}

The present invention relates to a chemical supply system and a supply method having an air pocket removal function, and more particularly, a certain area of a pipe through which chemicals move in the process of replacing a tank (canister) storing chemicals with a new tank. The present invention relates to a chemical supply system and a supply method having an air pocket removal function that maintains the vacuum in a vacuum state and allows chemicals to be sucked into the vacuum air pocket when a new tank is installed.

The epitaxy process, one of the manufacturing processes of semiconductors, LEDs, and solar cells, is a coating process that covers the surface of silicon with a kind of thin film to place various semiconductor-related materials on single crystal silicon. Basic construction is performed so that each material can be accurately positioned at a specific location. In the general selective epitaxy growth method, a semiconductor film of the same or different type is grown only on the surface of the exposed semiconductor material, and an insulating film such as an oxide film or a nitride film is formed. It is a technology that prevents any film from growing on the covered surface.

It is commonly called CVD (Chemical Vapor Deposition) because it chemically deposits a coating material using a special gas.

Specifically, the epitaxy process includes LPCVD (Low Pressure CVD), which is deposited through a chemical reaction with a special gas at low pressure, APCVD (Atmospheric Pressure CVD), which is deposited at a general atmospheric pressure, and HPCVD (High Pressure CVD), which is deposited at high pressure. It is divided into PECVD (Plasma Enhanced CVD), which generates and deposits plasma with a strong voltage, and MOCVD (Metal-Organic Chemical Vapor Deposition), which deposits metallic organic substances such as gallium, phosphorus, and aluminum.

In this process, chemicals (special chemicals) such as high purity TEOS, TiCL4, TMA, LTO520, TEMAZr, TEMAHf, HBO, 4MS, 3MS, TEB, and TEPO are used. As a carrier gas, high purity argon (Ar), Helium (He), hydrogen (H2), nitrogen (N2), and the like are used.

It uses a pump that uses the pressure of a transport gas such as argon to apply a driving force to the chemicals for deposition to move the chemicals.

However, in the process of separating a chemical tank storing chemicals in order to replace it with a new chemical tank, there are cases where chemicals remain in some spaces of the pipe. Since chemicals remaining in the piping can be a risk to the operator, a purge process is performed to remove them.If the purge process is carried out in a conventional way, the air becomes full inside the piping, so the pressure is unstable. And there is a problem in that the chemical does not flow smoothly due to the occurrence of an impact in the flow of the fluid.

KR 10-1384604 B1

The present invention for solving the above-described problem is to separate the chemical tank while maintaining a part of the pipe through which the chemical is transferred in a vacuum state, and the chemicals inside the newly installed chemical tank are transferred to the vacuum space (air It is an object of the present invention to provide a chemical supply system and supply method having an air pocket removal function that allows it to be sucked into a pocket).

The present invention conceived to solve the above-described problem is to remove chemicals or foreign substances remaining in the pipe of the supply line supplying the chemicals used in the semiconductor production device 106 for semiconductor manufacturing, and As a supply system for removing pockets, the first pressurizer 102 and the gas inlet of the first chemical tank 10 are connected, and the 1-1 valve 134, the 1-2 valve 136, and the 1- A first pipe 114 to which three valves 138 are sequentially installed; The second pipe 116 which connects the gas inlet of the second pressurizer 104 and the second chemical tank 20, and the 2-1 valve 140 and the 2-2 valve 142 are sequentially installed, ; A connection between the chemical outlet of the first chemical tank 10 and the chemical outlet of the second chemical tank 20, and the 3-1 valve 143, the 3-2 valve 144, and the third A third pipe 118 in which the -4 valve 146 and the 3-3 valve 145 are sequentially installed; A fourth pipe 120 that connects the semiconductor production device 106 to a branch point formed between the 3-2 valve 144 and the 3-4 valve 146, and is installed with the fourth valve 148 )and; The first pipe 114 connects the vacuum pump 112 between the 1-1 valve 134 and the 1-2 valve 136, and an eighth valve 162 is installed. A pipe 128; And a ninth pipe 130 connecting the first-3 valve 138 and the 3-1 valve 143 to which the ninth valve 164 is installed, and the vacuum pump 112 In the state in which the first chemical tank 10 is mounted, the air in the air pocket between the 3-1 valve 143 and the 3-2 valve 144 is discharged to the outside to form a vacuum space. It is characterized.

In the process of replacing the first chemical tank 10, while operating the vacuum pump 112, the eighth valve 162, the 1-2 valve 136, the 1-3 valve 138, Opening both the ninth valve 164 and the 3-1 valve 143, and closing both the 1-1 valve 134 and the 3-2 valve 144 to form the vacuum space It is characterized.

When the formation of the vacuum space is completed, the operation of the vacuum pump 112 is stopped, and the eighth valve 162, the 1-2 valve 136, the 1-3 valve 138, and the It is characterized in that it closes the ninth valve 164.

The present invention according to another embodiment is a supply method using the above-described supply system, comprising: a first step of mounting the first chemical tank 10 in which chemicals are stored; While operating the vacuum pump 112, the eighth valve 162, the 1-2 valve 136, the 1-3 valve 138, the ninth valve 164, the 3-1 A second step of opening the valve 143; A third step of closing the 1-1 valve 134 and the 3-2 valve 144; A fourth step of closing the ninth valve (164) and stopping the operation of the vacuum pump (112) when the air stored in the air pocket is discharged and a vacuum space is formed; A fifth step of closing the eighth valve 162, the 1-2 valve 136, and the 1-3 valve 138; And a sixth step of opening the 3-1 valve 143 to allow the chemicals stored in the first chemical tank 10 to flow into the vacuum space.

According to the present invention, when the chemical tank supplying chemicals is replaced, the chemicals inside the pipe can be completely removed, so safety is improved. When the chemical tank is newly installed, the chemicals are naturally absorbed by the negative pressure inside the pipe. It has the effect of preventing air from entering the pipe by allowing it to flow.

1 is a connection diagram showing the structure of a supply system according to an embodiment of the present invention.
FIG. 2 is a connection diagram showing a state in which an inert gas is injected into a first chemical tank from a first pressurizer so that chemicals are supplied to a semiconductor production device.
Figure 3 is a connection diagram showing a state in which the supply source of chemicals is switched from the first chemical tank to the second chemical tank.
4 is a connection diagram showing a state in which a purge gas is injected to discharge chemicals remaining in the pipe in the vent direction.
5 is a connection diagram showing a state in which the first chemical tank is removed after the purge process is completed.
6 is a connection diagram showing a state in which a new first chemical tank in which chemicals are stored is installed.
Figure 7 is a connection diagram showing a process of making the air pocket formed portion in a vacuum state.
8 is a connection diagram showing a state in which a vacuum space is maintained inside the pipe by stopping the operation of the vacuum pump.
9 is a connection diagram showing a state in which chemicals stored in the first chemical tank flow into the vacuum space.

Hereinafter, a "chemical supply system and supply method having an air pocket removal function" according to an embodiment of the present invention will be described with reference to the drawings.

1 is a connection diagram showing the structure of a purification system according to an embodiment of the present invention.

A "chemical supply system having an air pocket removal function" (hereinafter, referred to as a'supply system') according to an embodiment of the present invention comprises a supply system 100 having a structure similar to a pipe connection structure of the prior art. However, several pipes and valves are added to change the path of chemicals or solvents.

In the semiconductor production apparatus 106, a circuit pattern is formed while deposition is performed on the surface of a semiconductor substrate. The supply system 100 for supplying the deposition chemical used in the semiconductor production device 106 is connected to the semiconductor production device 106 and a pressurizer, a chemical tank, a waste tank, and the like by various types of pipes and valves.

Two lines having the same configuration are provided inside the chemical supply system 100. The first line is a system that connects the first pressurizer 102 and the first chemical tank 10 to supply chemicals to the semiconductor production device 106, and the second line is the second pressurizer 104 and the second chemicals. When the chemicals in the first chemical tank 10 are exhausted while connecting the tank 20, the chemicals are supplied to the semiconductor production device 106.

Both the first and second lines are made of the same components, and chemicals are sequentially supplied to the semiconductor production apparatus 106 in the same manner. Among the constituent elements included in each line, the constituent elements corresponding to each other have the same structure and are driven in the same manner, and the same object is stored.

First, in the first pipe 114 connecting the gas inlet of the first pressurizer 102 and the first chemical tank 10, the 1-1 valve 134, the 1-2 valve 136, and the 1- Three valves 138 are installed sequentially. In addition, the 2-1 valve 140 and the 2-2 valve 142 are sequentially installed in the second pipe 116 connecting the gas inlet of the second pressurizer 104 and the second chemical tank 20 do.

In addition, a third pipe 118 is connected between the chemical outlet of the first chemical tank 10 and the chemical outlet of the second chemical tank 20, and a fourth pipe branched from the middle of the third pipe 118 The pipe 120 is connected to the semiconductor production device 106. Therefore, the chemicals discharged from the first chemical tank 10 or the second chemical tank 20 move along the third pipe 118 and then flow into the semiconductor production apparatus 106 along the fourth pipe 120. .

Among the third pipes 118, a 3-1 valve 143 and a 3-2 valve 144 are sequentially installed between the branch points of the first chemical tank 10 to the fourth pipe 120. In addition, between the branch point of the fourth pipe 120 from the second chemical tank 20, the 3-3 valve 145 and the 3-4 valve 146 are sequentially installed.

In the middle of the third pipe 118, a fifth pipe 122 connecting both sides is installed. The fifth pipe 122 connects the center of the 3-1 valve 143 and the 3-2 valve 144 and the center of the 3-3 valve 145 and the 3-4 valve 146 to each other. do. The 5-1 valve 150 and the 5-2 valve 152 are installed in the fifth pipe 122, and a sixth valve in the center of the 5-1 valve 150 and the 5-2 valve 152 One side of the pipe 124 is connected. The other side of the sixth pipe 124 in which the sixth valve 154 is installed is connected to the purge pressurizer 108. Therefore, the purge inert gas supplied from the purge pressurizer 108 flows into the center of the fifth pipe 122 according to the opening and closing operation of the sixth valve 154, and branches to the left and right to enter the third pipe 118. do.

One side of the seventh pipe 126 is connected to the vent 110 for discharging the gas. The other side of the seventh pipe 126 is branched into two paths, and the ends of each branched pipe are connected to the first pipe 114 and the second pipe 116, respectively. The ends of the two branched pipes of the seventh pipe are between the 1-1 valve 134 and the 1-2 valve 136, respectively, of the 2-1 valve 140 and the second pressurizer 104. Is connected between.

In addition, the 7-1 valve 156 is installed between the vent 110 and the branch point in the seventh pipe 126, and the 7-2 valve 158 and the 7-3 valve ( 160) is installed. The 7-2 valve 158 controls the flow of gas introduced from the first pipe 114, and the 7-3 valve 160 controls the flow of gas introduced from the second pipe 116.

An eighth pipe 128 is connected between the vacuum pump 112 and the first pipe 114, and an eighth valve 162 is installed in the eighth pipe 128. The eighth pipe 128 is connected between the 1-1 valve 134 and the 1-2 valve 136 in the first pipe 114.

In addition, the 1-3 valve 138 and the 3-1 valve 143 are connected to each other by a ninth pipe 130 in which the ninth valve 164 is installed. In addition, the 3-3 valve 145 and the 2-2 valve 142 are connected to each other by a tenth pipe 132 in which the tenth valve 166 is installed.

The piping included in the present invention serves as a passage through which substances such as chemicals, inert gas, air or solvent move, and the valve serves to limit or allow the movement of these substances by opening or closing the piping. Whether the valve is operated or not is controlled together by a control unit (not shown) for controlling the operation of the pressurizer or the like.

Hereinafter, a process of supplying chemicals from the supply system 100 having such a configuration and removing residual substances remaining in the pipe will be described.

FIG. 2 is a connection diagram showing a state in which an inert gas is injected into a first chemical tank from a first pressurizer so that chemicals are supplied to a semiconductor production device. FIG. 3 is a second chemical supply source from the first chemical tank. A connection diagram showing the state of conversion to a chemical tank, FIG. 4 is a connection diagram showing a state in which a purge gas is injected to discharge the chemicals remaining in the pipe in the vent direction, and FIG. 5 is a first A connection diagram showing a state in which the chemical tank is removed, and FIG. 6 is a connection diagram showing a state in which a new first chemical tank in which chemicals are stored is installed.

First, the chemicals stored in the first chemical tank 10 are supplied among the two chemical tanks. While the first chemical tank 10 is in use, the second chemical tank 20 maintains a supply standby state. As shown in FIG. 2, while the first pressurizer 102 operates, an inert gas is injected into the gas inlet of the first chemical tank 10 through the first pipe 114. To this end, the 1-1 valve 134, the 1-2 valve 136, and the 1-3 valve 138 are opened.

When an inert gas is introduced, chemicals stored in the first chemical tank 10 are discharged through the chemical outlet and move through the third pipe 118 and the fourth pipe 120 due to an increase in the pressure inside the first chemical tank 10 to move to the semiconductor. It is supplied to the production device 106. In this state, the 3-1 valve 143, the 3-2 valve 144, and the fourth valve 148 are opened, and the ninth valve 164, the 5-1 valve 150, and the The 3-4 valve 146 is in a closed state.

When the chemicals stored in the first chemical tank 10 are exhausted or reduced to a certain amount or less, the supply path is switched to use the second chemical tank 20 filled with chemicals. As shown in FIG. 3, while the second pressurizer 104 is operating, an inert gas is injected into the second chemical tank 20, and chemicals are discharged in the same manner, so that the third pipe 118 and the fourth pipe ( It passes through 120 and is supplied to the semiconductor production apparatus 106.

Stop the operation of the first pressurizer 102 so that chemicals are not supplied from the first chemical tank 10 or the chemicals are not supplied to the first chemical tank 10, and the first installed in the first pipe 114 The -1 valve 134, the 1-2 valve 136, and the 1-3 valve 138 are switched to the closed state. And the 3-1 valve 143 and the 3-2 valve 144 are also closed. In the second pipe 116, the 2-1 valve 140, the 2-1 valve 140, the 3-3 valve 145, and the 3-4 valve 146 are opened, and the 10th valve 166 ) And the 5-2 valve 152 are closed.

In this state, the chemicals of the second chemical tank 20 are supplied to the semiconductor production device 106, and the first chemical tank 10 is ready for replacement.

And, in order to separate the first chemical tank 10 and install a new first chemical tank 10 in which chemicals are stored, a purging process for removing chemicals, solvents, moisture, etc. remaining in the internal piping (purification work ) To proceed.

As shown in FIG. 4, while the purge pressurizer 108 operates, an inert gas for the purge process is supplied to the fifth pipe 122 through the sixth pipe 124. At this time, the sixth valve 154 installed in the sixth pipe 124 and the 5-1 valve 150 installed in the fifth pipe 122 are opened, and the 3-1 valve 143 and the ninth valve ( 164), the 1-3 valve 138, the 1-2 valve 136, the 7-2 valve 158, and the 7-1 valve 156 are all opened. The 1-1 valve 134 and the 8th valve 162 are maintained in a closed state.

Chemicals or solvents remaining in the first pipe 114, the third pipe 118, and the ninth pipe 130 due to the pressure of the inert gas for purge are discharged to the vent 110. Accordingly, accidents due to leakage of dangerous substances can be prevented in the process of replacing the first chemical tank 10.

When the purge process is finished, the operation of the purge pressurizer 108 is stopped, and the sixth valve 154 and the 5-1 valve 150 are closed. In addition, the 7-1 valve 156 and the 7-2 valve 158 are also closed.

Next, as shown in FIG. 5, the first chemical tank 10, which is exhausted of chemicals, is separated. In this state, the second chemical tank 20 maintains a state in which chemicals are continuously supplied to the semiconductor production apparatus 106.

Next, as shown in FIG. 6, the first chemical tank 10 in which the new chemical is stored is mounted on the supply system 100. In this state, the inside of the pipe from the chemical agent outlet of the first chemical tank 10 to the 3-2 valve 144 is filled with air. If the air pocket formed here is not removed, air enters in the initial stage of supplying the chemicals stored in the first chemical tank 10 to the semiconductor production apparatus 106 or an impact occurs in the flow of the fluid. Therefore, the supply of the second chemical tank 20 is terminated, and it is necessary to remove the air pocket before switching the supply line to the first chemical tank 10.

Hereinafter, a method of removing the air pocket formed in the pipe will be described.

7 is a connection diagram showing a process of making a part in which an air pocket is formed in a vacuum state, FIG. 8 is a connection diagram showing a state in which a vacuum space is maintained inside the pipe by stopping the operation of the vacuum pump, and FIG. 9 is inside the vacuum space It is a connection diagram showing the state in which the chemicals stored in the first chemical tank flow in.

First, as shown in FIG. 7, after the first chemical tank 10 is newly installed in the supply system 100, the vacuum pump 112 is operated to discharge the air inside the pipe to the outside while vacuuming or vacuuming the inside. It makes it close to. A vacuum or a place close to a vacuum is described as a vacuum space. In the present invention, it is necessary to make a vacuum space by removing the air pocket formed in the third pipe 118 from the chemical outlet of the first chemical tank 10 to the branch point connected to the fourth pipe 120.

While operating the vacuum pump 112, all of the 8th valve 162, the 1-2 valve 136, the 1-3 valve 138, the 9th valve 164, and the 3-1 valve 143 Open it. In addition, the 1-1 valve 134, the 3-2 valve 144, the 5-1 valve 150, and the 7-2 valve 158 are all closed. The 1-3 valve 138 and the 3-1 valve 143 function as a branch point branching in three directions, and they close in the direction connected to the first chemical tank 10, and the 9th pipe ( 130). Therefore, the inside of the first chemical tank 10 is not made into a vacuum.

If the vacuum space is sufficiently created by the operation of the vacuum pump 112, the operation of the vacuum pump 112 is stopped at the same time as the ninth valve 164 is closed. In addition, the eighth valve 162, the 1-2 valve 136, and the 1-3 valve 138 are also closed.

In this case, as shown in FIG. 8, the air contained in the air pocket by the operation of the vacuum pump 112 is discharged toward the vacuum pump 112, and the inside of the pipe that previously formed the air pocket is a vacuum space. Becomes.

Finally, by opening the 3-1 valve 143 to open the chemical outlet of the first chemical tank 10 and the third pipe 118, the inside of the first chemical tank 10 due to the negative pressure inside the vacuum space Chemicals naturally flow into the vacuum space.

In this state, if the supply of the second chemical tank 20 is stopped and the supply of the first chemical tank 10 is started, the filling between the 3-1 valve 143 to the 3-2 valve 144 As the chemicals enter the semiconductor production apparatus 106, the chemicals can be smoothly supplied without interruption of the flow of fluid or instability of pressure due to an impact.

Although preferred embodiments of the present invention have been described above with reference to the accompanying drawings, the technical configuration of the present invention described above is another specific form without changing the technical spirit or essential features of the present invention by those skilled in the art. It will be appreciated that it can be implemented with. Therefore, the embodiments described above should be understood as illustrative and non-limiting in all respects, and the scope of the present invention is indicated by the claims to be described later rather than the detailed description, and the meaning and scope of the claims and All changes or modified forms derived from the equivalent concept should be interpreted as being included in the scope of the present invention.

10: first chemical tank 20: second chemical tank
100: supply system 102: first pressurizer
104: second pressurizer 106: semiconductor production equipment
108: pressurizer for purge 110: vent
112: vacuum pump 114: first pipe
116: second pipe 118: third pipe
120: 4th pipe 122: 5th pipe
124: 6th pipe 126: 7th pipe
128: pipe 8 130: pipe 9
132: No. 10 pipe 134: No. 1-1 valve
136: the 1-2 valve 138: the 1-3 valve
140: 2-1 valve 142: 2-2 valve
143: 3-1 valve 144: 3-2 valve
145: 3-3 valve 146: 3-4 valve
148: fourth valve 150: fifth-1 valve
152: 5-2 valve 154: 6th valve
156: 7-1 valve 158: 7-2 valve
160: 7-3 valve 162: 8 valve
164: 9th valve 166: 10th valve

Claims (4)

As a supply system that removes chemicals or foreign substances remaining inside the pipes of the supply line that supplies chemicals used in the semiconductor production device 106 for semiconductor manufacturing, and removes air pockets inside the pipes,
The first pressurizer 102 and the gas inlet of the first chemical tank 10 are connected, and the 1-1 valve 134, the 1-2 valve 136, and the 1-3 valve 138 are sequentially A first pipe 114 to be installed;
The second pipe 116 which connects the gas inlet of the second pressurizer 104 and the second chemical tank 20, and the 2-1 valve 140 and the 2-2 valve 142 are sequentially installed, ;
A connection between the chemical outlet of the first chemical tank 10 and the chemical outlet of the second chemical tank 20, and the 3-1 valve 143, the 3-2 valve 144, and the third A third pipe 118 in which the -4 valve 146 and the 3-3 valve 145 are sequentially installed;
A fourth pipe 120 that connects the semiconductor production device 106 to a branch point formed between the 3-2 valve 144 and the 3-4 valve 146, and is installed with the fourth valve 148 )and;
The first pipe 114 connects the vacuum pump 112 between the 1-1 valve 134 and the 1-2 valve 136, and an eighth valve 162 is installed. A pipe 128;
Including; a ninth pipe 130 connecting the 1-3 valve 138 and the 3-1 valve 143 and in which the ninth valve 164 is installed,
The vacuum pump 112 discharges air in the air pocket between the 3-1 valve 143 and the 3-2 valve 144 to the outside while the first chemical tank 10 is mounted. To form a vacuum space,
While operating the vacuum pump 112, the eighth valve 162, the 1-2 valve 136, the 1-3 valve 138, the ninth valve 164, the 3-1 The vacuum space is formed by opening all the valves 143 and closing both the 1-1 valve 134 and the 3-2 valve 144,
When the formation of a vacuum space in the pipe between the 3-1 valve 143 and the 3-2 valve 144 among the third pipe 118 is completed, the operation of the vacuum pump 112 is stopped, Closes the eighth valve 162, the 1-2 valve 136, the 1-3 valve 138, the ninth valve 164, and the 3-1 valve 143,
When the formation of the vacuum space is completed, the first chemical tank 10 filled with chemicals is mounted, and the 3-1 valve 143 is opened to reduce the negative pressure inside the vacuum space formed in the third pipe 118. A chemical supply system having an air pocket removal function, characterized in that the chemicals inside the first chemical tank 10 flow into the third pipe 118. delete delete As a supply method using the supply system of claim 1,
A first step of mounting the first chemical tank 10 in which chemicals are stored;
While operating the vacuum pump 112, the eighth valve 162, the 1-2 valve 136, the 1-3 valve 138, the ninth valve 164, the 3-1 A second step of opening the valve 143;
A third step of closing the 1-1 valve 134 and the 3-2 valve 144;
When the air stored in the air pocket is discharged and a vacuum space is formed in the pipe between the 3-1 valve 143 and the 3-2 valve 144 among the third pipe 118, the ninth valve 164 A fourth step of stopping the operation of the vacuum pump 112 at the same time as closing the valve;
A fifth step of closing the eighth valve 162, the 1-2 valve 136, the 1-3 valve 138, and the 3-1 valve 143;
A sixth step of opening the 3-1 valve 143 so that the chemicals stored in the first chemical tank 10 flow into the third pipe 118 by the negative pressure inside the vacuum space; A method of supplying chemicals with an air pocket removal function.

Images