KR20230171668A - System of auto flushing for semiconductor equipment - Google Patents

Abstract

The present invention relates to an auto-flushing system for semiconductor equipment provided in the chemical supply or connection line of semiconductor equipment to remove residues inside the pipe, the main line for connecting the chemical tank lorry and the storage tank, and the main line branching to the main line It includes a branch line and a fluid supplier installed in the branch line to supply fluid into the piping of the main line.

Description

Auto flushing system for semiconductor equipment {SYSTEM OF AUTO FLUSHING FOR SEMICONDUCTOR EQUIPMENT}

The present invention relates to an auto-flushing system for semiconductor equipment, and more specifically, to an auto-flushing system for semiconductor equipment provided in a chemical supply or connection line of semiconductor equipment to remove residues inside piping.

Recently, as the use of semiconductors has increased, various types of chemicals are being used in the manufacturing process of semiconductor devices, and as the degree of integration of semiconductor devices increases, their usage is also increasing. To this end, chemical supply methods are also diversifying. Most of the chemicals used in the manufacturing process of semiconductor devices are harmful to the environment and the human body, so workers must minimize direct exposure to chemicals at all stages and be careful when handling them.

In the semiconductor device manufacturing process, chemicals are supplied by transferring chemicals from a tank lorry to a chemical storage tank and then transferring them from the chemical storage tank to a chamber where unit processes are performed. The Chemical Central Supply System (CCSS) is used as a device for transporting, storing, and mixing these chemicals.

The chemical supply system according to the prior art is equipped with a chemical relay means called an ACQC unit (Automatic Clean Quick Coupler Unit, also known as "automatic cleaning chemical transfer unit") between the tank lorry and the chemical storage tank, and the chemicals in the tank lorry are supplied through the ACQC unit. High-pressure nitrogen is supplied to the tank, and chemicals are discharged under the pressure of the supplied nitrogen and stored in the chemical storage tank through the ACQC unit. Through this process, chemicals are first transferred from the tank lorry to the ACQC unit, and then from the ACQC unit to the chemical storage tank. Therefore, during the transfer process from the ACQC unit to the chemical storage tank, there is little risk of workers being exposed to chemicals or chemicals leaking to the outside, causing a fire.

However, in the step of transferring chemicals from the chemical tank lorry to the ACQC unit, the tank lorry driver (worker) pulls out the chemical supply hose connected to the tank lorry and then connects it to the male connector provided at the end of the chemical supply hose and the ACQC unit. After removing the cap of the provided female connector and connecting the male connector to the female connector of the ACQC unit, chemicals are discharged from the tank of the tanker through high-pressure nitrogen supply, preventing unexpected chemicals from spewing out. However, there is always a risk of leakage. Due to an operator's connection mistake, chemicals may erupt from the connection area during chemical supply, and the male and female connectors may become separated during chemical supply. In addition, due to abnormal operation of the ACQC unit, chemicals may not be properly injected and may be discharged to the outside through the inlet. This is because it may leak out. If such chemical eruption or leakage occurs, it can cause fatal damage to the human body of nearby workers and other people, and even a single leak can seriously pollute the surrounding environment. When a chemical erupts or leaks, an explosion or fire may occur if there are flammable substances nearby, which can develop into a major disaster. In other words, in the process of supplying chemicals from a tank lorry to the ACQC unit, if the worker connects and disconnects the chemical supply hose manually and transfers the chemicals using a nitrogen-charged method, there is a possibility of the worker coming into contact with the chemicals and the possibility of an external chemical leak accident. , there are always many risks, such as the possibility of explosion or fire.

To solve this problem, in the past, operator manipulation and intervention were minimized during the entire process of supplying chemicals from the chemical tank truck to the ACQC unit, and the possibility of external leakage of chemicals was blocked, thereby reducing the risk of workers being exposed to chemicals and ensuring safety. , is launching an automatic fastening system between chemical tank rollies and ACQC units that can not only improve the working environment but also prevent environmental pollution.

In this way, conventionally, chemicals are automatically supplied through the ACQC unit to prepare for chemical exposure, but when removing old or old facilities or changing facilities, there is a risk of accidents (mixing or leakage, etc.) caused by chemicals remaining in the existing piping. Due to the risk, flushing of the pipe is required.

Generally, various types of piping lines are installed in semiconductor manufacturing equipment or chemical manufacturing equipment. In the case of semiconductor manufacturing equipment, wafers are manufactured into semiconductor devices by repeatedly performing processes such as photography, diffusion, etching, and deposition. The semiconductor device manufacturing facility where each of these processes is performed is essentially equipped with a chemical supply system as described above to supply chemicals (hereinafter referred to as “reaction gas”) required on the wafer. As such, semiconductor device manufacturing equipment is generally referred to as main equipment, and the chemical supply system is referred to as auxiliary equipment. The chemical supply system, which is an auxiliary equipment, consists of an MFC (Mass Flow Controller), various valves, and chemical supply pipes.

Meanwhile, the reaction gases used in the semiconductor device manufacturing process are most corrosive gases, such as HBr, HF, and HCl gases used in dry etching or CF4, SF6, and CF4 used in the CVD (chemical vapor deposition) process. As a gas such as PF5, its purity is very high.

Because of this, in the actual semiconductor manufacturing process, when replacing a gas cylinder or supplying reaction gas to a reaction chamber, the moisture that penetrates and the corrosive gas stored in the gas cylinder react to produce acid, impure fine particles, or gaseous substances. Problems arise due to impurities occurring. These impurities quickly corrode stainless steel, etc., causing malfunction of the MFC (mass flow controller) or defects in the process.

Accordingly, in order to completely remove impurities present in the piping line and install a new chemical supply means, a purge or flush process is performed as a preparatory process immediately before connecting the chemical supply means. For normal gases, purge work is performed using an inert gas, etc., and for chemicals, a flush work is performed using inert gas or DIW (De-Ionized Water).

This purge or flush process is a process that prevents air (oxygen) or chemicals from remaining inside the pipe by flowing an appropriate amount of inert gas (Argon) or nitrogen (N2) gas inside the pipe, which determines the reliability of the semiconductor manufacturing process. It acts as an important variable.

Moreover, when change or demolition of oil-fluid equipment is necessary, or in the process of separating a chemical tank storing reaction gas or chemicals to replace it with a new chemical tank, chemicals may remain in some spaces of the piping. Chemicals remaining in the piping can pose a risk to workers, so a purge or flush process is performed to remove them. When the purge process is performed in the normal way, air is filled inside the piping, so the pressure is reduced. There is a problem that chemicals do not flow smoothly due to instability and shock to the fluid flow.

In addition, when temporarily connecting temporary pipes when changing or replacing piping lines, there are problems such as chemical leakage and safety accidents. Not only are a large number of workers required to work due to the wide work scope, but a considerable amount of time and money are spent. , workers have problems with work difficulties and pain due to wearing chemical-resistant protective gear while working.

Meanwhile, conventionally, if the flushing operation is insufficient, harmful substances remaining in the pipe may leak to workers when the pipe is removed. To prevent such damage, the neutrality of the inside of the gas pipe is checked before demolition. The number of flush processes to secure neutrality may vary depending on the equipment specifications. However, because it was unknown whether the inside of the pipe had been sufficiently flushed, the flushing process was performed by setting an appropriate cycle time for the flushing process for each material and proceeding with the work according to the standard time. After this flushing operation, the operator uses a gas detector, pH test paper, pH meter, etc. to confirm that the measured value of the gas used is "0" and that organic/acid/alkali is maintained at neutral (pH 7).

However, conventionally, as workers directly check the neutrality in the pipes, they are required to be equipped with the relevant equipment when checking neutrality, so not only are the working conditions not good due to the difficulty of one person working alone and carrying the equipment, but also the residual harmful substances in the pipes. There is a problem that there is a risk of exposure to the substance.

Republic of Korea Patent Publication No. 10-2005-0070272 (published on July 7, 2005) Republic of Korea Patent No. 10-1384604 (registered on April 7, 2014) Republic of Korea Patent No. 10-1424725 (registered on July 23, 2014) Republic of Korea Patent No. 10-2203976 (registered on January 12, 2021)

The present invention was created to solve the above-mentioned problems, and the purpose of the present invention is to provide an auto-flushing system for semiconductor equipment that can reduce chemical leakage and safety accidents by eliminating the need for temporary piping connections.

Additionally, the purpose of the present invention is to provide an auto-flushing system for semiconductor equipment that can improve productivity by supplying high-quality chemicals and reducing particles in piping during a regular flushing process.

And, the purpose of the present invention is to provide an auto-flushing system for semiconductor equipment that can be designed to change even existing equipment that is already installed.

Furthermore, the purpose of the present invention is to provide an auto-flushing system for semiconductor equipment that can achieve cost savings by reducing work labor costs and risks by enabling work without inputting a lot of manpower.

Furthermore, the purpose of the present invention is to provide an auto-flushing system for semiconductor equipment that can be used in a variety of piping facilities regardless of the type of chemical used and that can change the chemistry by applying it to a facility for a single chemical.

In addition, the purpose of the present invention is to provide an auto-flushing system for semiconductor equipment that can standardize a neutralization confirmation device.

The auto-flushing system for semiconductor equipment of the present invention to achieve the above-described purpose is a flushing device connected to a pipe for supplying or transporting chemicals used in semiconductor manufacturing to remove internal residues, and is used in chemical tank trucks and storage. A main line to connect the tank, an ACQC module installed on the path of the main line, a branch line that is separated from the ACQC module and branches off to the main line, and a fluid supplier installed in the branch line to supply fluid into the piping of the main line. Includes.

Here, the fluid supplier includes a DIW pipe connected to a branch line and supplying DIW, a gas pipe spaced apart from the DIW pipe and connected to the branch line to supply gas, and a gas pipe spaced apart from the DIW pipe and gas pipe and connected to the branch line to the main Includes exhaust piping to discharge residual material in the line or branch line.

Additionally, the fluid supplier further includes a valve unit installed in at least one of the pipes to prevent backflow.

In addition, the present invention further includes a connection line that receives chemicals transported through the main line from a storage tank, and a neutralization check unit connected to the connection line.

Furthermore, the neutralization check unit includes a box-type main body in which an inlet connected to the connection line is formed on one side and a storage tank connected to the inlet is provided inside, a socket formed to be open in the main body and connected to the storage tank, and a socket in the socket. Includes a detachably coupled sampling sheet.

In addition, the neutralization check unit further includes a second valve unit provided between the main body and the connection line.

Meanwhile, the auto-flushing method using the auto-flushing system for semiconductor equipment of the present invention is connected to a pipe for supplying or transporting chemicals used in semiconductor manufacturing to remove internal residues, and is connected to a branch line in the pipe of the semiconductor equipment. It includes a flushing unit connection step of connecting and installing a fluid supply, a neutralization step of performing a flushing process using at least one fluid, and a sampling step of checking the neutralization status of the pipe after the neutralization step.

As described above, the auto-flushing system for semiconductor equipment according to the present invention can reduce chemical leakage and safety accidents by eliminating the need for temporary piping connections.

In addition, the auto-flushing system for semiconductor equipment according to the present invention can supply high-quality chemicals during the flushing process and can further improve productivity by reducing particles in the pipe.

In addition, the auto-flushing system for semiconductor equipment according to the present invention can be designed to change even existing equipment that is already installed, so it can be freely used in existing equipment and new equipment and is effective in equipment automation.

Furthermore, the auto-flushing system for semiconductor equipment according to the present invention allows work to be performed without investing a large amount of manpower, thereby achieving cost savings due to reduced labor costs and risks.

In addition, the auto-flushing system for semiconductor equipment according to the present invention can be used in a variety of piping facilities regardless of the type of chemical used, and can be applied to facilities for a single chemical to change the chemistry, making it possible to change the facility for chemical replacement. Costs can be reduced.

In addition, the present invention provides an auto-flushing system for semiconductor equipment that can be used in both existing and new facilities by standardizing the neutralization confirmation device.

1 is a diagram schematically showing an auto-flushing system for semiconductor equipment according to an embodiment of the present invention.
Figure 2 is a flowchart schematically showing a flushing method using an auto-flushing system for semiconductor equipment according to an embodiment of the present invention.
Figure 3 is a flowchart schematically showing a flushing method using an auto-flushing system for semiconductor equipment according to an embodiment of the present invention.

The advantages and features of the present invention and methods for achieving them will become clear by referring to the embodiments described in detail below along with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and will be implemented in various different forms.

Hereinafter, the technical features of the present invention will be described in detail with reference to the attached drawings.

An auto-flushing system for semiconductor equipment according to an embodiment of the present invention relates to a flushing device connected to a pipe for supplying or transporting chemicals (or referred to as chemicals) used in semiconductor manufacturing to remove internal residues. It is installed in the Chemical Central Supply System (CCSS), which is connected to semiconductor equipment, and can perform a flushing process inside the pipe. It reduces chemical leaks and safety accidents through automation while requiring a lot of manpower. Since it is possible to work without having to do anything, the effect of cost reduction can be achieved by reducing work labor costs and risks.

Meanwhile, the Chemical Central Supply System (CCSS), a device that transports, stores, and mixes chemicals, transports chemicals from chemical manufacturers through tank trucks and supplies them to semiconductor/display production sites. Clean Quick Coupler System), a chemical storage and transfer system (Chemical Storage Tank & Transfer System), which is a device that stores and supplies supplied chemicals in large quantities, and is distributed to several mass production facilities while being supplied from the supply device to mass production facilities. VMB (Valve Manifold Box), which is a combination of valves to supply chemical substances, and a chemical blending system (Chemical Blending System), which is a device that supplies chemicals after diluting and mixing them at the precise concentration requested by the mass production facility. It may be configured to include a chemical supply system, which is a device that continuously supplies supplied chemicals to the final mass production facility at a constant pressure and flow rate.

The auto-flushing system 100 for semiconductor equipment of the present invention can be provided in a CCSS and includes a main line (ML) and a flushing unit 10 connected to the main line (ML), as shown in FIG. can do. Here, the flushing unit 10 is for a flushing process and may include a branch line 20 and a fluid supplier 30. In addition, the auto-flushing system 100 for semiconductor equipment of the present invention may be configured to include a separate control unit (not shown) for controlling the flushing unit 10 and other components, and may be configured to control the semiconductor equipment instead of the control unit. You can also use the control device provided in CCSS.

Specifically, the main line (ML) is for connecting the chemical tank lorry (TL) and the storage tank (ST), and both ends may be connected to the chemical tank lorry (TL) and the storage tank (ST). Here, the chemical tank lorry (TL) is usually configured as a chemical storage container of a chemical transport vehicle, and the storage tank (ST) may be configured as a chemical storage container that stores chemicals for supply to semiconductor facilities. This main line (ML) can flow chemicals stored in the chemical tank lorry (TL) into the storage tank (ST) by the ACQC module (AM).

The ACQC module (AM) is used to transport chemicals from the chemical tank truck (TL) to the storage tank (ST) and can be installed on the main line (ML). At this time, the ACQC module (AM) may be configured to include the main line (ML) as its own configuration, or may be installed on the path of the main line (ML). This ACQC module (AM) has a normal structure and can be connected to the main line (ML) or to each tank by a connector connection method. In the case of the ACQC module (AM), remove each cap of the male connector provided at the end of the chemical supply hose and the female connector of the ACQC module (AM) and connect the male connector to the female connector of the ACQC module to connect to the main line (ML). Can be connected to or installed on. In addition, the ACQC module (AM) supplies high-pressure nitrogen to the chemical tank lorry (TL), and chemicals are discharged under the pressure of the supplied nitrogen and can be stored in the storage tank (ST) through the main line (ML). To this end, a first pipe (P1) for supplying nitrogen and a second pipe (P2) for exhaust may be connected to the chemical tank lorry (TL). At this time, the ACQC module (AM) may be provided as a first module (AM1) for the main line (ML) and a second module (AM2) for the first pipe (P1) and the second pipe (P2). The first module may be installed on the main line (ML) and may be involved in the supply of chemicals, and the second module may be connected to the chemical tanker (TL) through a line connected to the first or second pipe to supply nitrogen gas. may be involved in the supply of

The branch line 20 is for flowing fluid supplied to flush the inside of the pipe of the main line ML, and may be branched and connected to the main line ML. Depending on the configuration of the ACQC module (AM), this branch line 20 may be connected to a pipe provided as part of the ACQC module (AM) or may be connected to the main line (ML) in a branch manner while being spaced apart from the ACQC module (AM). .

The fluid supplier 30 is intended to supply fluid into the piping of the main line ML through the branch line 20, and may be installed at the end of the branch line 20. This fluid supply 30 may include a first fluid supply pipe 31, a second fluid supply pipe 32, and an exhaust pipe 33.

The first fluid supply pipe 31 may be connected to the branch line 20 to supply the first fluid. The first fluid may be made of a liquid material to clean the inside of the pipe, and may be composed of DIW (De-Ionized Water) or UPW (Ultra Pure Water). Here, according to this embodiment, DIW can be used as the first fluid, and the first fluid supply pipe 31 is composed of a DIW pipe to supply DIW to the main line ML through the branch line 20. there is. The first fluid supply pipe 31 can supply the first fluid through the DIW supplier of the separately connected fluid supplier 30, and the DIW supplier transports the DIW in the DIW tank through a pump or motor.

The second fluid supply pipe 32 may be spaced apart from the first fluid supply pipe 31 and connected to the branch line 20 to supply the second fluid. The second fluid may be an inert gas, and the inert gas used in the flush process is helium (He, atomic number 2), neon (Ne, atomic number 10), argon (Ar, atomic number 18), and krypton (Kr, There are atomic number 36), xenon (Xe, atomic number 54), radon (Rn, atomic number 86), and Air, of which N2 gas or Air are mainly used. Here, according to an embodiment of the present invention, nitrogen gas (N2 gas) may be used as the second fluid, and the second fluid supply pipe 32 is composed of a pipe for N2 to supply N2 through the branch line 20. It can be supplied to the mainline (ML). The second fluid supply pipe 32 can supply the second fluid through the N2 supplier of the separately connected fluid supplier 30, and the N2 supplier can transport N2 from the N2 gas tank through a pump or motor. When using the second fluid, which is an inert gas, purge methods such as vacuum, pressure, sweep, or siphon may be used. The vacuum method involves using a vacuum pump to evacuate a container or pipe designed to withstand vacuum, injecting inert gas, and then confirming inactivation and repeating the process until inactivation is complete. The pressure method is to use inert gas. After injecting and discharging the mixed gas, check for inactivation and repeat until inactivation is complete. The sweep method separates the inlet and outlet, continuously injects the inert gas into the inlet side, discharges the mixed gas from the outlet side, and repeats this process until inertization is complete. It has the characteristic of being applied at atmospheric pressure and released from the large inlet. The siphon method is to inject gas while injecting a suitable liquid such as water, non-flammable, non-reactive, etc., and then inject inert gas while discharging the liquid again.

The supply of the first fluid by the fluid supplier 30 supplies the first fluid to a pump or the like under a pressure condition of about 10 psi to 100 psi, and the supply of the second fluid is provided under a pressure condition of about 10 psi to 100 psi. 2 Fluid can be supplied by a pump, etc.

The exhaust pipe 33 is arranged to be spaced apart from the first fluid supply pipe 31 and the second fluid supply pipe 32 and is connected to the branch line 20 to remove residual substances in the main line (ML) or branch line 20. can be released. A discharge pump, etc. may be connected to the exhaust pipe 33 to discharge residual substances, and an exhaust tank storing residual chemicals or residual fluid may be connected to the exhaust pipe 33. Additionally, the exhaust pipe 33 may further include a vent line. That is, dust such as fume generated internally can be removed through the exhaust pipe 33.

The auto-flushing system for semiconductor equipment according to an embodiment of the present invention configured as described above sequentially or selectively supplies the first fluid and the second fluid to the main line (ML) via the branch line (20) by the fluid supplier (30). By injecting it, it is possible to clean the inside of the pipe, including the valve of the main line (ML), or perform neutralization work.

At this time, in the case of a general purge method using gas, it is difficult to remove residual substances, and in particular, in the case of Yufu equipment, it is often limited. Accordingly, the present invention can perform pipe cleaning and neutralization work more stably while making up for the shortcomings of the purge process due to the combined structure of the flushing method using DIW. In particular, the present invention has a great advantage in improving workability and safety because it is possible to perform an automated flushing process as it is provided in CCSS.

In other words, similar to the chemical connection by the ACQC module (AM) and the automatic chemical supply method by CCSS, the branch line (20) and fluid supplier (30) connected to the main line (ML) can be controlled and function in an automated manner. It becomes possible. In addition, in the case of connecting the branch line 20 to existing semiconductor equipment, the coupler connection method of the ACQC module (AM) can be used to connect without much difficulty in branching, and chemical transfer is controlled by the ACQC module (AM). As a result, the safety of branching operations can be further improved.

Here, the auto-flushing system for semiconductor equipment according to an embodiment of the present invention is mainly used to remove residual substances in the pipe when changing or dismantling old semiconductor equipment, and is used for the main purpose of removing residual substances in the pipe when adding or changing chemicals. It can be used for neutralization and removal of residual fluid or internally generated fumes. The purpose of removing residual substances can also be seen as a neutralization operation.

Additionally, the auto-flushing system 100 for semiconductor equipment of the present invention may further include a valve unit 40.

The valve unit 40 is installed in at least one of the above-mentioned pipes to prevent backflow of fluid such as chemicals, and may be configured in the form of an auto valve or a line check valve. For example, the valve unit 40 may be connected to the branch line 20 and may be configured as a check valve or an automatic valve for preventing backflow.

Additionally, the valve unit 40 may be made of a material that has corrosion resistance or durability against chemicals used in semiconductor equipment. That is, in order to solve problems such as corrosion or erosion, for example, it may be metal or non-metal, and PVC material, PFA, PVDF, ETFE, or PTFE Teflon material can be used.

Furthermore, the auto-flushing system 100 for semiconductor equipment of the present invention may further include a neutralization check unit 50. Here, the neutralization check unit 50 may be connected to the main line (ML), branch line 20, or connection line (CL).

The connection line (CL) is used to receive chemicals transported to the storage tank (ST) through the main line (ML) from the storage tank (ST) and deliver them to the supply unit (SU). It can be connected to the storage tank (ST). there is.

The neutralization check unit 50 is used to check whether the pipe is neutralized and may be connected to the connection line CL. Additionally, the neutralization check unit 50 may be connected to the main line (ML) or branch line (20).

At this time, the neutralization check unit 50 is not shown, but may include a main body, a socket, and a sampling sheet.

The main body includes an inlet connected to a pipe such as a connection line (CL) formed on one side, and a storage tank provided inside connected to the inlet. This body may be provided in the form of an enclosure or container.

The socket may be formed in the main body to be connected to the storage tank. These sockets may be formed to be open on the outer surface of the main body and allow passage of the sampling sheet. One or more sockets may be provided.

The sampling sheet can be detachably coupled to the socket. This sampling sheet can be composed of a verification device that performs the functions of a normal gas detector, pH test paper, or pH meter. Alternatively, the sampling sheet may be prepared with a tester, such as litmus paper, that can sample the pH concentration for neutralization check.

This neutralization check unit 50 is connected in a branched form to the piping of each line without a separate solution collection operation for sampling, so that neutralization can be confirmed through a sampling sheet inserted into the internal space.

In this way, the neutralization check unit 50 of the present invention can improve the safety of work because it can perform a sampling process for toxic substances inside the pipe without exposing workers.

Additionally, a second valve unit 60 may be connected to the neutralization check unit 50, and the second valve unit 60 may function as a valve for the neutralization check unit 50 and the piping line.

As described above, the auto-flushing system 100 for semiconductor equipment according to the present invention can reduce chemical leakage and safety accidents by eliminating the need for temporary piping connections.

In addition, the auto-flushing system 100 for semiconductor equipment according to the present invention can supply high-quality chemicals during the flushing process and can further improve productivity by reducing particles in the pipe.

In addition, the auto-flushing system 100 for semiconductor equipment according to the present invention can be designed to change even existing equipment that is already installed, so it can be freely used in existing equipment and new equipment and is effective in equipment automation.

Furthermore, the auto-flushing system 100 for semiconductor equipment according to the present invention allows work to be performed without inputting a large number of manpower, thereby achieving cost savings due to reduced work labor costs and risks.

In addition, the auto-flushing system 100 for semiconductor equipment according to the present invention can be used in various piping facilities regardless of the type of chemical used, and can change the chemistry by applying it to facilities for a single chemical, so it can be used for chemical replacement. You can reduce the cost of changing.

In addition, the present invention can standardize a neutralization confirmation device, providing an auto-flushing system for semiconductor equipment that can be used in both existing and new facilities.

Meanwhile, the auto-flushing system for semiconductor equipment according to an embodiment of the present invention includes a branch line 20, which is an additional line, on the main line (ML) at the rear end of the ACQC module (AM) connected to the chemical tank lorry (TL). Perform the branching operation, install the valve unit 40 to prevent backflow in the branch line 20, and connect the fluid supplier 30 to the branch line 20 to perform an auto-flushing process for the main line (ML). You can prepare. At this time, the auto-flushing system for semiconductor equipment of the present invention can be controlled by a control device included in the CCSS or by a separately connected control unit (not shown) to perform the flushing process in an automatic manner.

That is, the flushing method using the auto-flushing system for semiconductor equipment of the present invention can largely be comprised of an auto-flushing system connection step and a flushing step.

Specifically, the flushing method of the present invention may include a flushing unit connection step (S100), a neutralization step (S200), and a sampling step (S300).

The flushing unit connection step (S100) is the step of connecting the auto flushing system, which is performed by connecting a line to an existing semiconductor facility through a branching operation or, in the case of a new semiconductor facility, using a system integrally included in the semiconductor facility. It can be. In the flushing unit connection step (S100), additional branch lines are connected to the DIW (De-Ionized Water) or UPW (Ultra Pure Water), N2, and exhaust lines at the rear end of the ACQC module connected to the chemical vehicle. At this time, a check valve and an auto valve for backflow prevention are installed in the branch line or each line. These connections can be made using the existing ACQC module coupling method or the normal piping branching method.

The neutralization step (S200) is a step of performing a flushing process using a flushing unit. This neutralization step (S200) may include a first fluid input step (S210), a second fluid input step (S220), and an internal material discharge step (S230). For example, chemicals stored in a vehicle's tank lorry are introduced through a line and then neutralized. During neutralization work, the first auto-flushing (neutralization) is performed through DIW in the branch line, the second flushing operation is performed to further remove residual chemicals and DIW in the pipe using N2 gas pressurization, and internally generated dust is removed through the exhaust line. (Fume, etc.) can be removed.

The sampling step (S300) is a step to confirm the suitability of the flushing or neutralization process and may include a drain step (S310) and a check step (S320). The sampling step (S300) is to collect and confirm samples that have completed the primary work by draining them after neutralization work in the pipe or tank. In the drain step (S310), internal residues are discharged, and in the check step (S320), sampling and It is carried out as a verification process.

Here, in the case of the check step (S320), confirmation can be performed without separate sampling by using the sampling sheet of the neutralization check unit 50 of the auto flushing system described above.

After the sampling step (S300), an additional neutralization step (S400) may be performed, and the method proceeds in the same manner as described above. In other words, if additional neutralization work is needed for the rear end of the tank, additional neutralization work can be performed with the connected pump, and it can also be performed separately by additionally connecting a second auto flushing line to the rear end of the pump.

The flushing method of the present invention described above can be performed by an operator controlling sequential operations for each process, or can be performed automatically by operating a preset process by a control unit. In other words, the present invention can perform the flushing process through a branch line already included in new equipment, and in the case of existing equipment, the flushing process can be performed by only performing a separate branch line connection operation, so it does not require the input of many workers. It has the advantage of being able to perform a flushing process for semiconductor equipment with improved safety without sacrificing safety.

In this way, according to the present invention, an auto-flushing system can be installed in existing semiconductor equipment, so auto-flushing can be performed when replacing old equipment or equipment, which has great advantages in terms of safety and cost. In particular, since the flushing unit can be connected to the supply line in a branch manner, it has the advantage of being able to be used in both existing and new facilities.

The above description is merely an illustrative explanation of the technical idea of the present invention, and those skilled in the art will be able to make various modifications and variations without departing from the essential characteristics of the present invention. Accordingly, the embodiments disclosed in the present invention are for illustrative purposes rather than limiting the technical idea of the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments.

100: Auto flushing system
ML: Main line CL: Connection line
TL: Tank lorry ST: Storage tank
AM: ACQC module SU: Supply unit
10: Flushing unit 20: Branch line
30: fluid supplier 40: valve unit
50: Neutralization check unit 60: Second valve unit

Claims (6)

In a flushing device connected to a pipe for supplying or transporting chemicals used in semiconductor manufacturing to remove internal residues,
Main line to connect chemical tank lorry and storage tank;
a branch line branching off from the main line; and
An auto-flushing system for semiconductor equipment including a fluid supplier installed in the branch line and supplying fluid into the piping of the main line. The method of claim 1, wherein the fluid supply device,
DIW pipe connected to the branch line to supply DIW;
a gas pipe spaced apart from the DIW pipe and connected to the branch line to supply gas; and
An auto-flushing system for semiconductor equipment including an exhaust pipe that is spaced apart from the DIW pipe and the gas pipe and connected to the branch line to discharge residual substances in the main line or the branch line. The method of claim 2, wherein the fluid supply device,
An auto-flushing system for semiconductor equipment further comprising a valve unit installed in at least one of the pipes to prevent backflow. In claim 1,
A connection line that receives chemicals transported through the main line from the storage tank; and
An auto-flushing system for semiconductor equipment further comprising a neutralization check unit connected to the connection line. The method of claim 4, wherein the neutralization check unit,
A box-type body in which an inlet connected to the connection line is formed on one side and a storage tank connected to the inlet is provided therein;
A socket formed to be open in the main body and connected to the storage tank; and
An auto-flushing system for semiconductor equipment including a sampling sheet detachably coupled to the socket. A flushing method using a flushing device connected to a pipe for supplying or transporting chemicals used in semiconductor manufacturing to remove internal residues,
A flushing unit connection step of connecting a branch line to the piping of the semiconductor facility and installing a fluid supply;
A neutralization step of performing a flushing process using at least one fluid; and
A flushing method using an auto-flushing system for semiconductor equipment, including a sampling step of checking the neutralization state of the pipe after the neutralization step.

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