KR100189737B1 - Exhaust apparatus - Google Patents

Exhaust apparatus Download PDF

Info

Publication number
KR100189737B1
KR100189737B1 KR1019960001985A KR19960001985A KR100189737B1 KR 100189737 B1 KR100189737 B1 KR 100189737B1 KR 1019960001985 A KR1019960001985 A KR 1019960001985A KR 19960001985 A KR19960001985 A KR 19960001985A KR 100189737 B1 KR100189737 B1 KR 100189737B1
Authority
KR
South Korea
Prior art keywords
pipe
air
solvent
chemical
supply pipe
Prior art date
Application number
KR1019960001985A
Other languages
Korean (ko)
Other versions
KR970060370A (en
Inventor
박은수
Original Assignee
구본준
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 구본준, 엘지반도체주식회사 filed Critical 구본준
Priority to KR1019960001985A priority Critical patent/KR100189737B1/en
Publication of KR970060370A publication Critical patent/KR970060370A/en
Application granted granted Critical
Publication of KR100189737B1 publication Critical patent/KR100189737B1/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/4412Details relating to the exhausts, e.g. pumps, filters, scrubbers, particle traps

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Exhaust Gas After Treatment (AREA)

Abstract

본 발명은 저장탱크에 연결된 주배기관의 입구가 케미컬의 증착으로 인하여 막히는 것을 방지하고자, 용제탱크와 제1용제공급관 사이에 제2용제공급관을 설치하고 이를 주배기관 입구에 연결하여 용제를 공급하며, 또한 제1솔레노이드밸브와 제2솔레노이드밸브를 전기적으로 연결하여 동시에 같은 신호로써 동작하도록 하며, 즉 케미컬이 케미컬공급관으로 공급되는 동시에 용제가 용제반응조와 주배기관 입구에 공급되도록 하는 배기장치에 관한 것이다.The present invention is to prevent the inlet of the main exhaust pipe connected to the storage tank due to the deposition of the chemical, to install a second solvent supply pipe between the solvent tank and the first solvent supply pipe and to supply the solvent by connecting it to the inlet of the main exhaust pipe, In addition, the first solenoid valve and the second solenoid valve is electrically connected to operate at the same time at the same signal, that is to say that the chemical supply to the chemical supply pipe at the same time the solvent is supplied to the solvent reaction tank and the main exhaust pipe inlet.

Description

배기장치Exhaust system

제1도는 종래의 배기장치를 설명하기 위한 계통도이고,1 is a system diagram for explaining a conventional exhaust device,

제2도는 본 발명의 배기장치를 설명하기 위한 게통도이다.2 is a schematic diagram illustrating the exhaust system of the present invention.

* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings

10, 30 : 제1에어관 11, 31 : 제1솔레노이드밸브10, 30: 1st air pipe 11, 31: 1st solenoid valve

12, 32 : 노즐 13, 33 : 케미컬공급관12, 32: nozzle 13, 33: chemical supply pipe

14, 34 : 제1에어밸브 15, 35 : 제2에어관14, 34: 1st air valve 15, 35: 2nd air pipe

16, 36 : 제2솔레노이드밸브 17 : 용제공급관16, 36: second solenoid valve 17: solvent supply pipe

37 : 제1용제공급관 18, 38 : 유량계37: the first solvent supply pipe 18, 38: flow meter

19, 39 : 제2에어밸브 20, 40 : 부배기관19, 39: second air valve 20, 40: secondary exhaust pipe

21, 41 : 용제반응조 22, 42 : 주배기관21, 41: solvent reaction tank 22, 42: main exhaust pipe

43 : 제2용제공급관 44 : 제2유량계43: second solvent supply pipe 44: the second flow meter

45 : 제 3에어밸브 46 : 제 3에어관45: third air valve 46: third air pipe

본 발명은 배기장치에 관한 것으로, 특히 웨이퍼(WAFER) 상에 피아이큐코팅막(PIQ COATING LAYER) 증착시, 증착을 좀 더 유리하도록 하기 위하여 웨이퍼 상에 분사되는 알루미늄-킬레이트(ALUMINUM-CHELATE)의 증착으로 인한 배기관 입구의 막힘 현상을 방지하는 데 적당한 배기장치에 관한 것이다.BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exhaust device, and in particular, when depositing a PIQ COATING LAYER on a wafer, the deposition of an aluminum chelate (ALUMINUM-CHELATE) sprayed on the wafer to make the deposition more favorable The present invention relates to an exhaust device suitable for preventing the blockage of the exhaust pipe inlet.

열경화성수지인 피아이큐코팅막(PIQ:POLYIMIDE-ISOINDROQUINAZORINE-DIONE COATING LAYER)은 알파 파티클(α-PARTICLE) 방지막으로 웨이퍼 상에 형성된 소자를 보호하는 역할을 하며, 간단한 예로 개별적인 반도체 칩을 만들기 위한 웨이퍼 쏘잉(SAWING) 공정 이전에 이러한 코팅막을 웨이퍼 상에 증착함으로써 소자를 보호하는 데 사용된다.A thermosetting resin, PIQ (POLYIMIDE-ISOINDROQUINAZORINE-DIONE COATING LAYER), is an alpha particle (α-PARTICLE) protection layer that protects devices formed on the wafer. SAWING) is used to protect the device by depositing this coating on the wafer prior to the process.

이때, 알루미늄-킬레이트(ALUMINUM-CHELATE)를 도포함으로써 웨이퍼 상에 좀더 피아이큐코팅막이 우수하게 증착되는 것을 도와주나, 알루미늄-킬레이트는 침전하여 증착하는 성질이 있으며, 이러한 증착된 알루미늄-킬레이트를 용해시키는 물질로는 신나등을 사용한다.At this time, by applying the aluminum chelate (ALUMINUM-CHELATE) helps to deposit a better P coating coating on the wafer, but the aluminum chelate has a property of depositing and depositing, so as to dissolve the deposited aluminum chelate Use thinners as materials.

여기서는 알루미늄-킬레이트를 편의상 케미컬로, 신나등의 알루미늄-킬레이트를 용해시키는 물질을 용제라 명명하겠다.Here, aluminum-chelate is referred to as a chemical for convenience, and a substance that dissolves aluminum-chelate such as thinner is called a solvent.

제1도는 종래의 배기장치를 설명하기 위한 계통도로, 이하 첨부된 도면을 참고로 하여 설명하겠다.1 is a schematic diagram illustrating a conventional exhaust apparatus, which will be described below with reference to the accompanying drawings.

제1도와 같이, 종래의 배기장치는 에어탱크(AIR TANK)에 연결된 제1에어관(10)과 제2에어관(15)과 제1에어관(10)에 설치되어, 제1에어관(10) 내의 에어의 공급과 차단을 조절하는 제1솔레노이드밸브(SOLENOID VALVE)(11)와, 제1에어관(10)에 설치되어, 제1에어관(10)내의 에어속도를 제어하는 제1속도조절부, 일측에는 용제탱크가 또 다른 일측에는 노즐(NOZZLE)(12)이 연결된 케미컬공급관(13)과, 케미컬공급관(13)에 설치되어, 제1속도조절부의 제어에 의해 구동되는 제1에어밸브(14)와 제2에어관(15)에 설치되어, 제2에어관(15)내의 에어의 공급과 차단을 조절하는 제2솔레노이드밸브(16)와 제2에어관(15)에 설치되어, 제2에어관(15)내의 에어속도를 제어하는 제2속도조절부와, 일측에 용제탱크가 연결된 용제공급관(17)과, 용제공급관(17)에 설치되어, 용제공급관(17)내의 용제의 유량을 조절하는 유량계(18)와 용제공급관(17)에 설치되어 제2속도조절부의 제어에 의해 구동되는 제2에어밸브(19)와 일측에는 용제공급관(17)이 연결되고, 하단에는 부배기관(20)이 설치된 용제반응조(21)와 부배기관(20)이 연결되고, 상단에는 반응실이 연결되어 형성된 주배기관(22)과 주배기관(22) 하단에 설치된 저장탱크로 이루어진다.As shown in FIG. 1, the conventional exhaust device is installed in the first air pipe 10, the second air pipe 15, and the first air pipe 10 connected to an air tank. 10) a first solenoid valve 11 for controlling supply and shutoff of air in the air and a first air pipe 10 to control air velocity in the first air pipe 10; The speed adjusting part, the solvent tank on one side and the chemical supply pipe 13 connected to the nozzle (NOZZLE) 12 on the other side, and the chemical supply pipe 13, the first driven by the control of the first speed control unit Installed in the air valve 14 and the second air pipe 15, and installed in the second solenoid valve 16 and the second air pipe 15 to regulate the supply and shut off of the air in the second air pipe 15. And a second speed control unit for controlling the air speed in the second air pipe 15, a solvent supply pipe 17 having a solvent tank connected to one side, and a solvent supply pipe 17 installed in the solvent supply pipe 17. Flux of solvent Installed in the flow meter 18 and the solvent supply pipe 17 to adjust the second air valve 19 driven by the control of the second speed control unit and one side is connected to the solvent supply pipe 17, the lower end of the secondary pipe ( Solvent reaction tank 21 and the secondary exhaust pipe 20 is installed is 20, the upper end is composed of the main exhaust pipe 22 and the storage tank installed on the lower end of the main exhaust pipe 22 formed by connecting the reaction chamber.

종래의 배기장치의 동작을 설명하면 다음과 같다.Referring to the operation of the conventional exhaust device is as follows.

우선, 에어탱크에 설치된 제1에어관(10)과 제2에어관(15)으로 에어가 공급이 되며, 이때 에어의 공급과 차단은 각각 제1솔레노이드밸브(11)와 제2솔레노이드밸브(16)가, 또한 에어의 속도는 제1속도조절부와 제2속도조절부에서 조절하며, 각각 제1솔레노이드밸브(11)와 제1속도조절부와 제2솔레노이드밸브(16)와 제2속도조절부를 통하여 제어받은 에어의 속도나 양에 따라 각각 제1에어밸브(14)와 제2에어밸브(19)가 온(ON)되어 케미컬공급관(13)과 용제공급관(17)에 케미컬과 용제가 공급된다.First, air is supplied to the first air pipe 10 and the second air pipe 15 installed in the air tank, and the air supply and the shutoff of the air are the first solenoid valve 11 and the second solenoid valve 16, respectively. In addition, the speed of the air is controlled by the first speed control unit and the second speed control unit, respectively, the first solenoid valve 11, the first speed control unit and the second solenoid valve 16 and the second speed control, respectively. The first air valve 14 and the second air valve 19 are turned on according to the speed or the amount of air controlled through the unit, so that the chemical and the solvent are supplied to the chemical supply pipe 13 and the solvent supply pipe 17. do.

여기에서 제1솔레노이드밸브(11)와 제1속도조절부와 제2솔레노이드밸브(16)와 제2속도조절부를 통하여 제어받은 에어의 속도나 양에 따라 제1에어밸브(14)와 제2에어밸브(19)의 오픈(OPEN)정도가 달라져, 결과적으로 케미컬공급관(13)과 용제공급관(17)에 공급되는 케미컬량과 용제량이 달라진다.Here, the first air valve 14 and the second air according to the speed or amount of air controlled through the first solenoid valve 11, the first speed regulating unit, the second solenoid valve 16, and the second speed regulating unit. The degree of opening of the valve 19 is changed, and as a result, the amount of chemical and the amount of solvent supplied to the chemical supply pipe 13 and the solvent supply pipe 17 are different.

그리고 제1솔레노이드밸브(11)의 제어로 제1에어밸브(14)가 오픈됨에 따라 케미컬공급관(13)내로 공급되는 케미컬은 노즐(12)을 통하여 분사되며, 이때, 노즐(12)은 공정진행 시에는 반응실 내에서 웨이퍼척에 안착되어 회전하는 웨이퍼에 케미컬을 분사하며, 케미컬의 배기는 주배기관(22)을 통하여 배기되어 저장탱크에 임시로 저장된다.As the first air valve 14 is opened by the control of the first solenoid valve 11, the chemical supplied into the chemical supply pipe 13 is injected through the nozzle 12, and the nozzle 12 is in process. At the time, the chemical is sprayed onto the rotating wafer seated on the wafer chuck in the reaction chamber, and the exhaust of the chemical is exhausted through the main exhaust pipe 22 and temporarily stored in the storage tank.

그리고 공정이 진행되지 않을 경우에는 노즐(12)은 용제반응조(21) 내에 대기되며, 대기중인 노즐(12)을 통하여 케미컬이 주기적으로 분사되어 노즐(12)의 입구가 케미컬에 의해서 증착되는 것을 방지한다.When the process does not proceed, the nozzle 12 is waited in the solvent reaction tank 21, and the chemical is periodically sprayed through the waiting nozzle 12 to prevent the inlet of the nozzle 12 from being deposited by the chemical. do.

또한, 용제공급관(17)에 설치된 제2에어밸브(19)가 오픈됨에 따라, 용제는 용제공급관(17)을 통하여 용제반응조(21)로 공급되어 대기중인 노즐(12)에서 분사되는 케미컬을 용해하여 용제반응조(12) 하단에 설치된 부배기관(20)이 막히는 것을 방지한다.In addition, as the second air valve 19 installed in the solvent supply pipe 17 is opened, the solvent is supplied to the solvent reaction tank 21 through the solvent supply pipe 17 to dissolve the chemical sprayed from the nozzle 12 in the air. This prevents the secondary exhaust pipe 20 installed at the bottom of the solvent reaction tank 12 from being blocked.

이러한 용제반응조(12) 내의 용제와 케미컬은 부배기관(20)을 통하여 배기되어 주배기관(22) 하단에 설치된 저장탱크에서 임시로 저장된다.The solvent and the chemical in the solvent reaction tank 12 is exhausted through the secondary exhaust pipe 20 and temporarily stored in a storage tank installed at the lower end of the main exhaust pipe 22.

그러나 종래의 배기장치는 용제반응조와 반응실에서 배기되는 케미컬과, 케미컬과 반응한 용제로 인하여 저장탱크에 연결된 주배기관의 입구가 케미컬에 의해 막히어 저장탱크로의 배기가 원활하지 못한 문제점이 발생한다.However, in the conventional exhaust system, the chemicals exhausted from the solvent reaction tank and the reaction chamber, and the inlet of the main exhaust pipe connected to the storage tank due to the solvent reacted with the chemical are blocked by the chemical, so that the exhaust gas to the storage tank is not smooth. do.

본 발명은 이러한 문제점을 해결하고자 안출된 것으로, 케미컬로 인한 저장 탱크에 연결된 주배기관 입구가 막히는 것을 개선한 배기장치를 그 목적으로 한다.SUMMARY OF THE INVENTION The present invention has been made to solve this problem, and an object of the present invention is to provide an exhaust device that improves the blockage of a main exhaust pipe inlet connected to a storage tank due to chemicals.

본 발명은 용제탱크와 용제공급관 사이에 제2용제공급관을 설치하고, 제2용제공급관의 일단을 주배기관의 입구에 연결하여 용제를 공급하고, 또한 제1솔레노이드밸브와 제2솔레노이드밸브를 전기적으로 연결하여 동시에 같은 신호로 동작하도록 함으로써 케미컬이 반응실 또는 용제반응조에 공급되는 동시에 용제가 용제반응조와 주배기관 입구에 공급되도록 하여, 케미컬로 인하여 주배기관의 입구가 막히는 것을 방지하는 배기장치에 관한 것이다.According to the present invention, a second solvent supply pipe is installed between the solvent tank and the solvent supply pipe, and one end of the second solvent supply pipe is connected to the inlet of the main exhaust pipe to supply the solvent, and the first solenoid valve and the second solenoid valve are electrically connected to each other. The present invention relates to an exhaust system which prevents the inlet of the main exhaust pipe from being blocked by the chemical by supplying the chemical to the reaction chamber or the solvent reaction tank and simultaneously supplying the solvent to the solvent reaction tank and the main exhaust pipe inlet by connecting and operating the same signal at the same time. .

제2도는 본 발명의 배기장치를 설명하기 위한 게통도로, 첨부된 도면을 참고로 하여 본 발명의 배기장치에 대하여 설명하겠다.2 is a communication path for explaining the exhaust device of the present invention, with reference to the accompanying drawings will be described with respect to the exhaust device of the present invention.

제2도와 같이 본 발명의 배기장치는 에어탱크에 연결된 제1에어관(30)과 제2에어관(35)과, 제1에어관(30)에 설치되어, 에어의 공급과 차단을 조절하는 제1솔레노이드밸브(31)와, 제1에어관(30)에 설치되어, 에어속도를 제어하는 제1속도조절부와 일단에는 케미컬탱크가 또 다른 일단에는 노즐(32)이 연결된 케미컬공급관(33)과 케미컬공급관(33)에 설치되어, 제1솔레노이드밸브(31)와 제1속도조절부의 제어에 의해 구동되는 제1에어밸브(34)와 제2에어관(35)에 설치되어, 에어의 공급과 차단을 조절하는 제2솔레노이드밸브(36)와 제2에어관(35)에 설치되어, 에어속도를 제어하는 제2속도조절부와, 일측에 용제탱크가 연결된 제1용제공급관(37)과, 제1용제공급관(37)에 설치되어, 용제의 유량을 조절하는 유량계(38)와, 제1용제공급관(37)에 설치되어, 제2솔레노이드밸브(36) 제2속도조절부의 제어에 의해 구동되는 제2에어밸브(39)와 일측에는 제1용제공급관(37)이 연결되고, 하단에는 부배기관(40)이 설치된 용제반응조(41)와, 일측에는 부배기관(40)이 연결되고, 상단에는 반응실이 연결되어 형성된 주배기관(42), 주배기관(42) 하단에 설치된 저장탱크와, 저장탱크에 연결된 주배기관(42)의 입구에 형성된 케미컬 제거수단으로 이루어진다.As shown in FIG. 2, the exhaust device of the present invention is installed in the first air pipe 30 and the second air pipe 35 and the first air pipe 30 connected to the air tank to control supply and interruption of air. Chemical supply pipe 33 is installed in the first solenoid valve 31, the first air pipe 30, the first speed control unit for controlling the air speed and one end of the chemical tank is connected to the other end nozzle (32) And the first air valve 34 and the second air pipe 35 driven by the control of the first solenoid valve 31 and the first speed regulating unit. It is installed in the second solenoid valve 36 and the second air pipe 35 to control the supply and shutoff, the second speed control unit for controlling the air speed, and the first solvent supply pipe 37 connected to the solvent tank on one side And a flow meter (38) provided in the first solvent supply pipe (37) for adjusting the flow rate of the solvent, and provided in the first solvent supply pipe (37), and the second solenoid valve (36). The second air valve 39 driven by the control of the two-speed control unit and the first solvent supply pipe 37 is connected to one side, the solvent reaction tank 41 is provided with a secondary exhaust pipe 40 at the lower end, and the secondary exhaust pipe at one side 40 is connected, the upper end of the main exhaust pipe 42 is formed by connecting the reaction chamber, the storage tank installed on the lower end of the main exhaust pipe 42, and the chemical removal means formed at the inlet of the main exhaust pipe 42 connected to the storage tank Is done.

이때, 케미컬제거수단으로는 제2솔레노이드밸브(36)와 제2속도조절부 사이의 제2에어관(35)과 연결된 제 3에어관(46)과, 제 3에어관(46)에 설치되어, 에어속도를 제어하는 제 3속도조절부와 용제의 유량을 조절하는 제2유량계(38)와, 제2솔레노이드밸브(36)와 제 3속도조절부의 제어에 의해 구동되는 제 3에어밸브(45)와, 제2유량계(38)와 제 3에어밸브(45)가 설치된 제2용제공급관(43)으로 이루어진다.In this case, the chemical removing means is provided in the third air pipe 46 and the third air pipe 46 connected to the second air pipe 35 between the second solenoid valve 36 and the second speed control part. , The third speed control unit for controlling the air speed, the second flow meter 38 for adjusting the flow rate of the solvent, the third air valve 45 driven by the control of the second solenoid valve 36 and the third speed control unit. And a second solvent supply pipe 43 provided with a second flow meter 38 and a third air valve 45.

그리고 제1솔레노이드밸브(31)와 제2솔레노이드밸브(36)를 연결하여 전기적인 신호로써 동시에 동작되도록 한다.The first solenoid valve 31 and the second solenoid valve 36 are connected to each other so as to be operated simultaneously as an electrical signal.

즉, 본 발명의 배기장치에서는 공정이 진행되지 않을 시, 즉 케미컬이 분사되는 노즐(32)이 용제반응조(41)에 대기중인 경우, 용제반응조(41) 내에 주기적으로 실시되는 노즐(32)을 통한 케미컬분사와 동시에 용제 또한 공급되는 데 이러한 과정은 다음과 같다.That is, in the exhaust device of the present invention, when the process does not proceed, that is, when the nozzle 32 into which the chemical is injected is waiting in the solvent reaction tank 41, the nozzle 32 periodically performed in the solvent reaction tank 41 is removed. Along with chemical spraying, solvents are also supplied.

우선, 주기적으로 노즐(32)을 통한 케미컬 공급시, 제1솔레노이드밸브(31)와 제2솔레노이드밸브(36)가 동시에 온되어 각각 케미컬공급관(33)과 제1용제공급관(37)을 통하여 약액반응조(41) 내로 케미컬과 용제가 동시에 공급이 된 후, 제1솔레노이드밸브(31)와 제2솔레노이드밸브(36)가 동시에 오프되어 각각 케미컬공급관(33)과 제1용제공급관(37)을 통한 케미컬과 용제공급은 차단된다.First, when periodically supplying the chemical through the nozzle 32, the first solenoid valve 31 and the second solenoid valve 36 are turned on at the same time through the chemical supply pipe 33 and the first solvent supply pipe 37, respectively After the chemical and the solvent are simultaneously supplied into the reaction tank 41, the first solenoid valve 31 and the second solenoid valve 36 are simultaneously turned off, respectively, through the chemical supply pipe 33 and the first solvent supply pipe 37. Chemical and solvent supplies are shut off.

또한, 공정 진행시 노즐(32)은 반응실 상부에 위치하며, 케미컬은 웨이퍼척에 안착되어 회전하는 웨이퍼에 분사되어 주배기관(42)으로 배기되는 데 이때, 케미컬공급시 용제도 함께 공급된다.In addition, during the process, the nozzle 32 is positioned in the upper part of the reaction chamber, and the chemical is injected into the rotating wafer seated on the wafer chuck and exhausted to the main exhaust pipe 42. At this time, the solvent is also supplied with the chemical supply.

즉, 제1솔레노이드밸브(31)와 제2솔레노이드밸브(36)가 동시에 온되어, 케미컬은 케미컬공급관(33)을 통하여 반응실에, 용제는 제2용제공급관(43)을 통하여 저장탱크에 연결된 주배기관(42)의 입구에 공급되며, 또한 공정 완료시에는 제1솔레노이드밸브(31)와 제2솔레노이드밸브(36)가 동시에 오프되어 각각 케미컬공급관(33)과 제2용제공급관(43)을 통한 케미컬과 용제공급은 차단된다.That is, the first solenoid valve 31 and the second solenoid valve 36 are turned on at the same time, so that the chemical is connected to the reaction chamber through the chemical supply pipe 33 and the solvent is connected to the storage tank through the second solvent supply pipe 43. It is supplied to the inlet of the main exhaust pipe 42, and when the process is completed, the first solenoid valve 31 and the second solenoid valve 36 are turned off at the same time through the chemical supply pipe 33 and the second solvent supply pipe 43, respectively. Chemical and solvent supplies are shut off.

종래의 배기장치에서는 용제반응조와 반응실에서 배기되는 케미컬과, 케미컬과 반응한 용제로 인하여 저장탱크에 연결된 주배기관의 입구가 케미컬에 의해 막히어 저장탱크로의 배기가 원활하지 못한 문제점이 발생함에 따라, 이를 개선하고자 본 발명에서는 주배기관 입구에 용제를 공급함으로써, 저장탱크에 연결된 주배기관의 입구에 증착된 케미컬을 제거하며, 또한 제1솔레노이드밸브와 제2솔레노이드밸브를 전기적으로 연결하여 동시에 같은 신호로써 온/오프가 가능하도록 하여 케미컬이 케미컬공급관으로 공급되는 동시에 용제가 용제반응조와 상기 저장탱크에 연결된 주배기관의 입구에 공급되도록 한다.In the conventional exhaust system, the chemicals exhausted from the solvent reaction tank and the reaction chamber, and the inlet of the main exhaust pipe connected to the storage tank due to the solvent reacted with the chemical are blocked by the chemical, causing the exhaust gas to the storage tank not to be smooth. Accordingly, in order to improve this, in the present invention, by supplying a solvent to the inlet of the main exhaust pipe, the chemical deposited on the inlet of the main exhaust pipe connected to the storage tank is removed, and the first solenoid valve and the second solenoid valve are electrically connected at the same time. The signal can be turned on and off so that the chemical is supplied to the chemical supply pipe while the solvent is supplied to the solvent reaction tank and the inlet of the main exhaust pipe connected to the storage tank.

따라서, 본 발명의 배기장치에서는 케미컬인 알루미늄킬레이트의 증착으로 인한 배기관 입구의 막힘 현상을 방지가능하다.Therefore, in the exhaust device of the present invention, it is possible to prevent the clogging of the exhaust pipe inlet due to the deposition of chemical aluminum chelate.

Claims (3)

에어탱크에 연결된 제1에어관과 제2에어관과, 상기 제1에어관에 설치되어, 상기 제1에어관 내의 에어의 공급과 차단을 조절하는 제1솔레노이드밸브와, 상기 제1에어관에 설치되어, 상기 제1에어관 내의 에어속도를 제어하는 제1속도조절부와 일단에는 케미컬탱크가 또 다른 일단에는 노즐이 연결된 케미컬공급관과, 상기 케미컬공급관에 설치되어, 상기 제1속도조절부의 제어에 의해 구동되는 제1에어밸브와, 상기 제2에어관에 설치되어, 상기 제2에어관 내의 에어의 공급과 차단을 조절하는 제2솔레노이드밸브와, 상기 제2에어관에 설치되어, 상기 제2에어관 내의 에어속도를 제어하는 제2속도조절부와, 일측에 용제탱크가 연결된 제1용제공급관과, 상기 용제공급관에 설치되어, 상기 용제공급관 내의 용제의 유량을 조절하는 유량계와, 상기 용제공급관에 설치되어, 상기 제2속도조절부의 제어에 의해 구동되는 제2에어밸브와, 일측에는 상기 제1용제공급관이 연결되고, 하단에는 부배기관이 설치된 용제반응조와, 상기 부배기관이 연결되고, 상단에는 반응실이 연결되어 형성된 주배기관과, 상기 주배기관 하단에 설치된 저장탱크를 포함하여 이루어지는 배기장치에 있어서, 상기 저장탱크에 연결된 상기 주배기관의 입구에 증착된 케미컬을 제거하도록 상기 주배기관 입구에 케미컬 제거수단이 부가되는 것을 특징으로 하는 배기장치.A first air pipe connected to an air tank, a second air pipe, a first solenoid valve installed at the first air pipe to regulate supply and interruption of air in the first air pipe, and to the first air pipe. Is installed, the first speed control unit for controlling the air speed in the first air pipe and a chemical tank at one end and a chemical supply pipe connected to the nozzle at one end, and is installed in the chemical supply pipe, the control of the first speed control unit A first air valve driven by the second air pipe, a second solenoid valve installed in the second air pipe to regulate supply and interruption of air in the second air pipe, and a second air pipe installed in the second air pipe. A second speed control unit for controlling the air speed in the two air pipes, a first solvent supply pipe connected to the solvent tank on one side, a flow meter installed in the solvent supply pipe, to adjust the flow rate of the solvent in the solvent supply pipe, and the solvent Supply pipe Is installed, the second air valve driven by the control of the second speed control unit, and the first solvent supply pipe is connected to one side, the lower end of the solvent reaction tank is installed with a secondary exhaust pipe, the secondary exhaust pipe is connected, In the exhaust device comprising a main exhaust pipe formed by connecting the reaction chamber, and the storage tank installed on the lower end of the main exhaust pipe, the chemical at the inlet of the main exhaust pipe to remove the chemical deposited on the inlet of the main exhaust pipe connected to the storage tank An exhaust device, characterized in that the removal means is added. 제1항에 있어서, 상기 케미컬 제거수단으로는 상기 제2에어관에 형성된 상기 제2솔레노이드밸브와 상기 제2속도조절부 사이에 연결된 제 3에어관과, 상기 제 3에어관에 설치되어, 상기 제 3에어관 내의 에어속도를 제어하는 제 3속도조절부와, 일단은 제1용제공급관에 연결되고, 또 다른 일단은 상기 저장탱크에 연결된 상기 주배기관의 입구에 연결되는 제2용제공급관과, 상기 제2용제공급관에 설치되어, 상기 제2용제공급관 내의 용제의 유량을 조절하는 제2유량계와, 상기 제2용제공급관에 설치되어, 상기 제 3속도조절부의 제어에 의해 구동되는 제2에어밸브로 이루어지는 것을 특징으로 하는 배기장치.The method of claim 1, wherein the chemical removing means is installed in the third air pipe and the third air pipe connected between the second solenoid valve and the second speed control unit formed in the second air pipe, A third speed control unit for controlling the air speed in the third air pipe, one end of which is connected to a first solvent supply pipe, and another end of which is connected to an inlet of the main exhaust pipe connected to the storage tank; A second flow rate meter installed in the second solvent supply pipe to adjust the flow rate of the solvent in the second solvent supply pipe, and a second air valve installed in the second solvent supply pipe and driven by the control of the third speed regulating unit; An exhaust device, characterized in that consisting of. 제1항에 있어서, 상기 제1솔레노이드밸브와 상기 제2솔레노이드밸브를 연결하여 전기적인 신호로써 동시에 온/오프 동작하도록 하여, 상기 케미컬공급관으로 케미컬이 공급되는 동시에 용제가 상기 용제반응조와 상기 주배기관의 입구에 공급되는 것을 특징으로 하는 배기장치.The method of claim 1, wherein the first solenoid valve and the second solenoid valve is connected to operate at the same time by an electrical signal, so that the chemical is supplied to the chemical supply pipe at the same time the solvent is the solvent reaction tank and the main exhaust pipe Exhaust device, characterized in that it is supplied to the inlet of.
KR1019960001985A 1996-01-30 1996-01-30 Exhaust apparatus KR100189737B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960001985A KR100189737B1 (en) 1996-01-30 1996-01-30 Exhaust apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960001985A KR100189737B1 (en) 1996-01-30 1996-01-30 Exhaust apparatus

Publications (2)

Publication Number Publication Date
KR970060370A KR970060370A (en) 1997-08-12
KR100189737B1 true KR100189737B1 (en) 1999-06-01

Family

ID=19450309

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960001985A KR100189737B1 (en) 1996-01-30 1996-01-30 Exhaust apparatus

Country Status (1)

Country Link
KR (1) KR100189737B1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010009203A (en) * 1999-07-08 2001-02-05 윤종용 chemical supplying structure for chemical vapor deposition coater
US9772136B2 (en) 2011-03-15 2017-09-26 Lg Electronics Inc. Refrigerator, and apparatus and method for refrigerator diagnosis

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20010009203A (en) * 1999-07-08 2001-02-05 윤종용 chemical supplying structure for chemical vapor deposition coater
US9772136B2 (en) 2011-03-15 2017-09-26 Lg Electronics Inc. Refrigerator, and apparatus and method for refrigerator diagnosis

Also Published As

Publication number Publication date
KR970060370A (en) 1997-08-12

Similar Documents

Publication Publication Date Title
US5887605A (en) Apparatus for cleaning semiconductor wafers
US20090277379A1 (en) Film coating apparatus
US6202653B1 (en) Processing solution supplying apparatus, processing apparatus and processing method
JP2001500796A (en) Aerodynamic aerosol chamber
KR100189737B1 (en) Exhaust apparatus
KR102203976B1 (en) The system of supplying a chemical enabling removal of air-pocket and the method thereof
JP2005166958A (en) Substrate processing method and apparatus
WO2018097974A1 (en) Method for protecting an adhesive delivery apparatus, and this same
KR102534076B1 (en) Deposition apparatus and method using the same
KR200157376Y1 (en) Gate valve for chemical vapor depostion system
US5937878A (en) Apparatus for removing particles from a wafer and for cleaning the wafer
KR200149835Y1 (en) Exhausting apparatus of semiconductor fabricating system
KR930004200Y1 (en) Spin head cleaner for photoresist coating process
JPH0521329A (en) Resist coating device
KR0128231Y1 (en) Rotation unit of sog coating apparatus
JPH05175130A (en) Plasma cvd apparatus
KR200198419Y1 (en) Wafer deposition apparatus
KR100234531B1 (en) Exhausting system of semiconductor low press chemincal vapor deposition system
KR200163935Y1 (en) Process tube for semiconductor device fabrication
KR200211293Y1 (en) Chemical liquid coagulation prevention device of semiconductor wafer etching equipment
JPH08104984A (en) Device and method for introducing gas and formation of tungsten thin film
KR19990001552A (en) Piping structure of spinner for semiconductor device manufacturing
KR19990085144A (en) HMD Supply Equipment
KR20050108064A (en) Apparatus for removing particle on esc and method for removing the same
JPH0132357Y2 (en)

Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20121224

Year of fee payment: 15

FPAY Annual fee payment

Payment date: 20131223

Year of fee payment: 16

FPAY Annual fee payment

Payment date: 20150116

Year of fee payment: 17