CN112283587A - Chemical supply system for manufacturing semiconductor and purification method thereof - Google Patents
Chemical supply system for manufacturing semiconductor and purification method thereof Download PDFInfo
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- CN112283587A CN112283587A CN202011286742.7A CN202011286742A CN112283587A CN 112283587 A CN112283587 A CN 112283587A CN 202011286742 A CN202011286742 A CN 202011286742A CN 112283587 A CN112283587 A CN 112283587A
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- tank
- chemical
- pipeline
- way valve
- bridging pipe
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D1/00—Pipe-line systems
- F17D1/08—Pipe-line systems for liquids or viscous products
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
- F17D—PIPE-LINE SYSTEMS; PIPE-LINES
- F17D3/00—Arrangements for supervising or controlling working operations
- F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
Abstract
The invention discloses a chemical supply system for manufacturing semiconductors, which comprises at least two sets of identical supply equipment and a deposition cavity connected with a liquid outlet of a chemical tank of each set of supply equipment, wherein each set of supply equipment comprises a chemical tank for storing chemical to be deposited, a first bridging pipe is arranged between a gas inlet and a liquid outlet of the chemical tank, and set up first three-way valve on first bridging pipe, the third interface connection of three-way valve is the corresponding interface of the first three-way valve of the first bridging pipe department of another chemical jar, the air inlet of chemical jar passes through the tube coupling booster, chemical jar is equipped with the second bridging pipe on the pipeline of chemical jar to the deposit chamber to the pipeline of booster, the third interface of the second three-way valve on the second bridging pipe and the corresponding interface connection of another chemical jar second bridging pipe department second three-way valve. The invention also discloses a purification method of the purification system.
Description
Technical Field
The present invention relates to a chemical supply system, and more particularly, to a chemical supply system for semiconductor manufacturing and a cleaning method thereof.
Background
Epitaxial engineering (epitoxy) is one of the processes for manufacturing semiconductors, LEDs, Solar cells, etc., and is a coating process for covering a silicon surface with a thin film that is used to place various semiconductor-related materials on monocrystalline silicon. Is the basic engineering for fixing each material at a specific position. The typical epitaxial layer may be a homoepitaxial layer or a heteroepitaxial layer. However, the oxide film, the nitride film, and the like are covered with the insulating film, and epitaxial growth does not occur.
An engineering for the chemical deposition of coating substances using special gases is CVD (chemical Vapor deposition).
Specifically, the epitaxial process may be classified into lpcvd (low Pressure cvd) for chemical reaction deposition with a special gas in a low Pressure environment, apcvd (atmospheric Pressure cvd) for deposition in a general atmospheric Pressure environment, hpcvd (high Pressure cvd) for deposition in a high Pressure environment, pecvd (plasma Enhanced cvd) for plasma deposition using a high voltage, MOCVD (metal organic chemical vapor deposition) for deposition of an organic metal such as gallium, phosphorus, and aluminum, and the like.
The engineering uses TEOS, TiCL4, TMA, LTO520, TEMAZr, TEMAHf, HBO, 4MS, 3MS, TEB, TEPO and other chemicals (special chemical solutions). As the carrier gas (carrier gas), high-purity argon (Ar), helium (He), hydrogen (H2), nitrogen (N2), or the like is used.
The carrier gas, like argon, propels the chemical to be deposited under the action of the pump so that it can flow.
The chemicals are used inside the deposition chamber for deposition of the semiconductor circuit pattern.
The chemicals supplied to the deposition chamber must not be interrupted for the normal formation of the semiconductor circuit pattern. Although a certain amount of chemicals remain in the chemical tank, the supply line needs to be switched before the floc chemicals in the floc chemical tank are used up in consideration of the time required for switching to the second supply line. Since the chemical in the chemical tank is not used up, there is a problem that the cost for manufacturing the semiconductor is increased.
On the basis, when the medicine is conveyed in the pipeline, more or less adhesion is generated in the pipeline, if the front process and the rear process are different from the raw materials, the pollution to the next process can be caused, so the pipeline needs to be kept clean, and the prior technical scheme is that after the process is completely finished, manual cleaning is carried out, which wastes time and labor, and because the semiconductor material generally has certain corrosion and toxicity, the semiconductor material threatens the body of a worker.
Disclosure of Invention
The purpose of the invention is as follows: the invention aims to solve the problems that the existing semiconductor supply system is unreasonable in pipeline cleaning mode and time-consuming and labor-consuming.
The technical scheme is as follows: in order to achieve the purpose, the invention adopts the technical scheme that:
a chemical supply system for manufacturing semiconductors comprises at least two sets of identical supply devices and a deposition cavity connected with a liquid outlet of a chemical tank of each set of supply device, wherein each set of supply device comprises a chemical tank for storing chemicals to be deposited, a first bridging pipe is arranged between a gas inlet and a liquid outlet of the chemical tank, a first three-way valve is arranged on the first bridging pipe, a third interface of the first three-way valve is connected with a corresponding interface of the first three-way valve at the first bridging pipe of another chemical tank, a gas inlet of the chemical tank is connected with a pressure booster through a pipeline, a second bridging pipe is arranged on a pipeline from the chemical tank to the deposition cavity on the pipeline from the chemical tank to the pressure booster, a third interface of a second three-way valve on the second bridging pipe is connected with a corresponding interface of a second three-way valve at the second bridging pipe of another chemical tank, the pipeline of the first three-way valve of the first bridging pipe department of another chemical tank of third interface connection of first three-way valve is first branch road, the pipeline of the corresponding interface of the second three-way valve of another chemical tank second bridging pipe department of third interface connection of second three-way valve is the second branch road, still including being used for depositing the pipeline and washing the waste liquid jar of waste liquid recovery behind the solvent tank of solvent and the flushing line, the liquid outlet of solvent tank is connected on the second branch road, the booster is connected to the air inlet of solvent tank, the waste liquid jar includes two inlets and a gas outlet, two inlets are connected respectively on first branch road and second branch road, vacuum pump and outside gas outlet are connected to the gas outlet.
The deposition chamber is only an option and can be modified in the field to other chambers requiring chemical treatment.
Further, the liquid outlet of each chemical tank simultaneously serves as a liquid inlet.
Further, the junction of any end of each bridging pipe and any pipeline is jointed by a three-way valve.
Furthermore, a liquid outlet pipeline of the solvent tank, an air inlet pipeline of the solvent tank, a liquid inlet pipeline of the waste liquid tank and an air outlet pipeline of the waste liquid tank are respectively provided with a stop valve.
Furthermore, a stop valve is arranged on a pipeline from the joint of the second bridging pipes of the two sets of supply equipment and the liquid inlet pipeline of the chemical tank to the deposition cavity.
Further, all the shutoff valves and the three-way valves are solenoid valves and can be controlled by a controller.
The function that the controller needs to realize is mainly the open and close control to the valve, so the simplest PLC control or singlechip can all realize, for example 89C51 singlechip.
A purging method for a chemical supply system for manufacturing semiconductors, comprising the steps of:
1) when the residual amount of the medicines in one chemical medicine tank is insufficient, a path for conveying the other set of chemical medicine tank to the deposition cavity is opened, meanwhile, the current set of supply equipment conveys the medicines to a bridging pipe of the other set of supply equipment through a first branch or a second branch, and the bridging pipe is opened for conveying the medicines to a tee joint in the direction of the deposition cavity, so that the medicines in the chemical medicine tanks of the current set of supply equipment can be completely used up;
2) when the chemicals in the chemical medicine tank of the current set of supply equipment are completely used up, closing a first three-way valve and a second three-way valve of the other set of supply equipment, and opening a pressure booster connected with a solvent tank, so that the cleaning agent in the solvent tank cleans the pipeline along the direction from a second branch, the second three-way valve, a second bridging pipe, a pipeline from the pressure booster to the first bridging pipe, the first three-way valve, the first branch and a waste liquid tank in the current set of supply equipment;
3) cleaning the pipeline according to the directions of a second branch, a second three-way valve, a second bridging pipe, a pipeline from the deposition cavity to the first bridging pipe, the first three-way valve, the first branch and the waste liquid tank;
4) after the current set of supply equipment is cleaned, replacing a new chemical tank and standing by;
5) when the allowance in the chemical tank of the other set of supply equipment is insufficient, the current set of supply equipment is switched to in the same way, and the pipeline of the other set of supply equipment is cleaned and the chemical tank is replaced by adopting the same cleaning path;
6) and (5) repeating the steps 1-5 until the air pressure in the waste liquid tank reaches the upper limit, opening the vacuum pump and an external air outlet, enabling the waste gas in the waste liquid tank to enter the next treatment process, and replacing the waste liquid tank.
Further, in the step 1) and the step 5), when the residual quantity of the chemicals in the chemical tank is insufficient, the path of the first branch is switched to supply the liquid.
If the path of the second branch is adopted for switching liquid supply, a part of pipeline still exists from the joint of the solvent tank to the second branch to the second three-way valve of another set of supply equipment, so that the residue of cleaning agent may exist, and the subsequent liquid supply is polluted.
Further, in the step 2) and the step 3), all the three-way valves are closed except for the direction of conveying the cleaning agent.
Further, the joint of the liquid outlet pipeline of the solvent tank and the liquid inlet pipeline of the waste liquid tank and the two branches is jointed by a three-way valve, so that when the cleaning agent is cleaned according to the direction of the step 2) or 3), the three-way valve is closed towards the interfaces in other directions.
If the design is adopted, no matter which branch is adopted for the chemical tank, the joint of the solvent tank and the second branch of the three-way valve can be closed, and the joint faces to the direction of a part of pipelines at the second three-way valve of another set of supply equipment, so that the problem of polluting the pipelines by cleaning agents can be avoided. (meanwhile, the pollution in the first branch can be avoided when the first branch is conveyed to the waste liquid tank.)
Has the advantages that: compared with the prior art, the invention has the advantages that:
1) by adopting the design scheme of the invention, all pipelines for supplying the deposition cavity can be completely cleaned;
2) compared with the prior art that the whole pipeline needs to be cleaned after complete deposition is finished, by adopting the design scheme of the invention, half of the pipeline is cleaned after complete deposition is finished, so that only the other half of the pipeline needs to be cleaned, and half of the time can be saved;
3) the cooperation of the booster, the solvent tank, the waste liquid tank and each electromagnetic valve is adopted, so that the full-automatic pipeline cleaning is realized, the labor cost is reduced, and the working danger of workers is reduced.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
Example 1
As shown in FIG. 1, a chemical supply system for manufacturing semiconductors comprises at least two sets of identical supply devices and a deposition chamber 1 connected with a chemical tank outlet of each set of supply device, each set of supply device comprises a chemical tank 2 for storing chemicals to be deposited, a first bridging pipe 3 is arranged between an air inlet and a chemical tank outlet of the chemical tank 2, a first three-way valve P1 is arranged on the first bridging pipe 3, a third interface of the first three-way valve P1 is connected with a corresponding interface of a first three-way valve P1 at a first bridging pipe 3 of another chemical tank 2, an air inlet of the chemical tank 2 is connected with a pressure booster 4 through a pipeline, a second bridging pipe 5 is arranged on a pipeline from the chemical tank 2 to the pressure booster 4 to a pipeline from the chemical tank 2 to the deposition chamber 1, a third interface of a second three-way valve P2 at the second bridging pipe 5 is connected with a corresponding interface of a second three-way valve P2 at a second bridging pipe 5 of another chemical tank 2 The mouth is connected, the pipeline of the corresponding interface of the first three-way valve P1 of the first bridging pipe 3 department of another chemical tank 2 of third interface connection of first three-way valve P1 is first branch 6, the pipeline of the corresponding interface of the second three-way valve P2 of the second bridging pipe 5 department of another chemical tank 2 of third interface connection of second three-way valve P2 is second branch 7, still including being used for depositing the pipeline and washing solvent tank 8 and the waste liquid jar 9 of waste liquid recovery behind the pipeline, the liquid outlet of solvent tank 8 is connected on second branch 7, booster 4 is connected to the air inlet of solvent tank 8, waste liquid jar 9 includes two inlets and a gas outlet, two inlets are connected respectively on first branch 6 and second branch 7, vacuum pump 10 and outside gas outlet 11 are connected to the gas outlet.
The deposition chamber is only an option and can be modified in the field to other chambers requiring chemical treatment.
The liquid outlet of each chemical tank 2 serves as a liquid inlet at the same time.
The joint of any end of each bridging pipe and any pipeline is jointed by a three-way valve.
And a liquid outlet pipeline of the solvent tank 8, an air inlet pipeline of the solvent tank 8, a liquid inlet pipeline of the waste liquid tank 9 and an air outlet pipeline of the waste liquid tank 9 are respectively provided with a stop valve PA.
A stop valve PA is arranged on a pipeline of the deposition cavity 1 at the joint of the second bridging pipes 5 of the two sets of supply equipment and the liquid inlet pipeline of the chemical tank 2.
All the shutoff valves PA and the three-way valves are solenoid valves, and can be controlled by a controller (not shown).
The function that the controller needs to realize is mainly the open and close control to the valve, so the simplest PLC control or singlechip can all realize, for example 89C51 singlechip.
Example 2
A purging method for a chemical supply system for manufacturing semiconductors, comprising the steps of:
1) when the medicine residual quantity in one chemical medicine tank 2 is insufficient, opening a path for conveying the other set of chemical medicine tank 2 to the deposition cavity 1, simultaneously conveying the medicine to a bridging pipe of the other set of supply equipment by the current set of supply equipment through a first branch 6 or a second branch 7, and opening the bridging pipe for conveying the medicine to a tee joint in the direction of the deposition cavity 1, so that the medicine in the chemical medicine tank 2 of the current set of supply equipment can be completely used up;
2) when the chemicals in the chemical tank 2 of the current set of supply equipment are completely used up, the first three-way valve P1 and the second three-way valve P2 of the other set of supply equipment are closed in all directions, the pressure booster 4 connected with the solvent tank 8 is opened, and in the current set of supply equipment, the cleaning agent in the solvent tank 8 cleans the pipelines along the directions of the second branch 7, the second three-way valve P2, the second bridging pipe 5, the pipeline from the pressure booster 4 to the first bridging pipe 3, the first three-way valve P1, the first branch 6 and the waste liquid tank 9;
3) cleaning the pipelines according to the directions of a second branch 7, a second three-way valve P2, a second bridging pipe 5, a pipeline from the deposition chamber 1 to the first bridging pipe 3, a first three-way valve P1, a first branch 6 and a waste liquid tank 9;
4) after the current set of supply equipment is cleaned, a new chemical tank 2 is replaced and stands by;
5) when the allowance in the chemical tank 2 of the other set of supply equipment is insufficient, the current set of supply equipment is switched to by adopting the same mode, and the pipeline of the other set of supply equipment is cleaned and the chemical tank 2 is replaced by adopting the same cleaning path;
6) and (3) repeating the steps 1-5 until the air pressure in the waste liquid tank 9 reaches the upper limit, and opening the vacuum pump 10 and the external air outlet 11 to enable the waste gas in the waste liquid tank 9 to enter the next treatment process and replace the waste liquid tank 9.
In the steps 1) and 5), when the residual amount of the medicine in the chemical tank 2 is insufficient, the liquid supply is switched through the path of the first branch 6.
If the path of the second branch is adopted for switching liquid supply, a part of pipeline still exists from the joint of the solvent tank to the second branch to the second three-way valve of another set of supply equipment, so that the residue of cleaning agent may exist, and the subsequent liquid supply is polluted.
In the step 2) and the step 3), all three-way valves are closed except for the direction of conveying the cleaning agent.
The joint of the liquid outlet pipeline of the solvent tank 8 and the liquid inlet pipeline of the waste liquid tank 9 and the two branches is jointed by a three-way valve, so that when the cleaning agent is cleaned according to the direction of the step 2) or 3), the three-way valve is closed towards the interfaces in other directions.
If the design is adopted, no matter which branch is adopted for the chemical tank, the joint of the solvent tank and the second branch of the three-way valve can be closed, and the joint faces to the direction of a part of pipelines at the second three-way valve of another set of supply equipment, so that the problem of polluting the pipelines by cleaning agents can be avoided. (meanwhile, the pollution in the first branch can be avoided when the first branch is conveyed to the waste liquid tank.)
Claims (10)
1. A chemical supply system for manufacturing semiconductors comprises at least two sets of identical supply devices and a deposition cavity connected with a liquid outlet of a chemical tank of each set of supply device, wherein each set of supply device comprises a chemical tank for storing chemicals to be deposited, a first bridging pipe is arranged between a gas inlet and a liquid outlet of the chemical tank, a first three-way valve is arranged on the first bridging pipe, a third interface of the first three-way valve is connected with a corresponding interface of the first three-way valve at the first bridging pipe of another chemical tank, a gas inlet of the chemical tank is connected with a pressure booster through a pipeline, a second bridging pipe is arranged on a pipeline from the chemical tank to the deposition cavity on the pipeline from the chemical tank to the pressure booster, a third interface of a second three-way valve on the second bridging pipe is connected with a corresponding interface of a second three-way valve at the second bridging pipe of another chemical tank, the method is characterized in that: the pipeline of the first three-way valve of the first bridging pipe department of another chemical tank of third interface connection of first three-way valve is first branch road, the pipeline of the corresponding interface of the second three-way valve of another chemical tank second bridging pipe department of third interface connection of second three-way valve is the second branch road, still including being used for depositing the pipeline and washing the waste liquid jar of waste liquid recovery behind the solvent tank of solvent and the flushing line, the liquid outlet of solvent tank is connected on the second branch road, the booster is connected to the air inlet of solvent tank, the waste liquid jar includes two inlets and a gas outlet, two inlets are connected respectively on first branch road and second branch road, vacuum pump and outside gas outlet are connected to the gas outlet.
2. The chemical supply system for manufacturing semiconductors according to claim 1, characterized in that: the liquid outlet of each chemical tank serves as a liquid inlet at the same time.
3. The chemical supply system for manufacturing semiconductors according to claim 1, characterized in that: the joint of any end of each bridging pipe and any pipeline is jointed by a three-way valve.
4. The chemical supply system for manufacturing semiconductors according to claim 1, characterized in that: and the liquid outlet pipeline of the solvent tank, the air inlet pipeline of the solvent tank, the liquid inlet pipeline of the waste liquid tank and the air outlet pipeline of the waste liquid tank are respectively provided with a stop valve.
5. The chemical supply system for manufacturing semiconductors according to claim 1, characterized in that: and a stop valve is arranged on a pipeline from the joint of the second bridging pipes of the two sets of supply equipment and the liquid inlet pipeline of the chemical tank to the deposition cavity.
6. The chemical supply system for manufacturing a semiconductor according to any one of claims 1 to5, wherein: all the stop valves and the three-way valves are electromagnetic valves and can be controlled by a controller.
7. A purging method of a chemical supply system for manufacturing semiconductors as recited in claim 1, wherein: the method comprises the following steps:
1) when the residual amount of the medicines in one chemical medicine tank is insufficient, a path for conveying the other set of chemical medicine tank to the deposition cavity is opened, meanwhile, the current set of supply equipment conveys the medicines to a bridging pipe of the other set of supply equipment through a first branch or a second branch, and the bridging pipe is opened for conveying the medicines to a tee joint in the direction of the deposition cavity, so that the medicines in the chemical medicine tanks of the current set of supply equipment can be completely used up;
2) when the chemicals in the chemical medicine tank of the current set of supply equipment are completely used up, closing a first three-way valve and a second three-way valve of the other set of supply equipment, and opening a pressure booster connected with a solvent tank, so that the cleaning agent in the solvent tank cleans the pipeline along the direction from a second branch, the second three-way valve, a second bridging pipe, a pipeline from the pressure booster to the first bridging pipe, the first three-way valve, the first branch and a waste liquid tank in the current set of supply equipment;
3) cleaning the pipeline according to the directions of a second branch, a second three-way valve, a second bridging pipe, a pipeline from the deposition cavity to the first bridging pipe, the first three-way valve, the first branch and the waste liquid tank;
4) after the current set of supply equipment is cleaned, replacing a new chemical tank and standing by;
5) when the allowance in the chemical tank of the other set of supply equipment is insufficient, the current set of supply equipment is switched to in the same way, and the pipeline of the other set of supply equipment is cleaned and the chemical tank is replaced by adopting the same cleaning path;
6) and (5) repeating the steps 1-5 until the air pressure in the waste liquid tank reaches the upper limit, opening the vacuum pump and an external air outlet, enabling the waste gas in the waste liquid tank to enter the next treatment process, and replacing the waste liquid tank.
8. The purging method of a chemical supply system for manufacturing a semiconductor according to claim 7, wherein: in the step 1) and the step 5), when the residual amount of the chemicals in the chemical tank is insufficient, liquid supply is switched through the path of the first branch.
9. The purging method of a chemical supply system for manufacturing a semiconductor according to claim 7, wherein: in the step 2) and the step 3), all three-way valves are closed except for the direction of conveying the cleaning agent.
10. The purging method of a chemical supply system for manufacturing a semiconductor according to claim 7, wherein: the joint of the liquid outlet pipeline of the solvent tank and the liquid inlet pipeline of the waste liquid tank and the two branches is jointed by a three-way valve, so that when the cleaning agent is cleaned according to the direction of the step 2) or 3), the three-way valve is closed towards the interfaces in other directions.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011286742.7A CN112283587A (en) | 2020-11-17 | 2020-11-17 | Chemical supply system for manufacturing semiconductor and purification method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011286742.7A CN112283587A (en) | 2020-11-17 | 2020-11-17 | Chemical supply system for manufacturing semiconductor and purification method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114623384A (en) * | 2022-03-14 | 2022-06-14 | 长鑫存储技术有限公司 | Liquid storage bottle processing system and method |
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| CN101514446A (en) * | 2008-02-22 | 2009-08-26 | 普莱克斯技术有限公司 | Multiple ampoule delivery systems |
| KR20130048350A (en) * | 2011-11-02 | 2013-05-10 | 포이스주식회사 | Chemical supply system for manufacturing semi-conductor |
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| CN114623384A (en) * | 2022-03-14 | 2022-06-14 | 长鑫存储技术有限公司 | Liquid storage bottle processing system and method |
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Application publication date: 20210129 |
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