KR102203205B1 - 전사 장치 및 이를 이용한 전사된 기판의 생산 방법 - Google Patents

전사 장치 및 이를 이용한 전사된 기판의 생산 방법 Download PDF

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Publication number
KR102203205B1
KR102203205B1 KR1020200033259A KR20200033259A KR102203205B1 KR 102203205 B1 KR102203205 B1 KR 102203205B1 KR 1020200033259 A KR1020200033259 A KR 1020200033259A KR 20200033259 A KR20200033259 A KR 20200033259A KR 102203205 B1 KR102203205 B1 KR 102203205B1
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KR
South Korea
Prior art keywords
unit
chamber
mold
release agent
substrate
Prior art date
Application number
KR1020200033259A
Other languages
English (en)
Korean (ko)
Inventor
김태완
권상민
김준기
정희석
Original Assignee
주식회사 기가레인
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 주식회사 기가레인 filed Critical 주식회사 기가레인
Priority to CN202011074714.9A priority Critical patent/CN112776464B/zh
Priority to TW111136867A priority patent/TWI818751B/zh
Priority to TW112131438A priority patent/TWI832796B/zh
Priority to TW109135273A priority patent/TWI785395B/zh
Application granted granted Critical
Publication of KR102203205B1 publication Critical patent/KR102203205B1/ko

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F16/00—Transfer printing apparatus
    • B41F16/0006—Transfer printing apparatus for printing from an inked or preprinted foil or band
    • B41F16/004—Presses of the reciprocating type
    • B41F16/0046—Presses of the reciprocating type with means for applying print under heat and pressure, e.g. using heat activable adhesive
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/167—Coating processes; Apparatus therefor from the gas phase, by plasma deposition
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
    • G03F7/70875—Temperature, e.g. temperature control of masks or workpieces via control of stage temperature
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02107—Forming insulating materials on a substrate
    • H01L21/02296—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer
    • H01L21/02299—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment
    • H01L21/02312—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour
    • H01L21/02315—Forming insulating materials on a substrate characterised by the treatment performed before or after the formation of the layer pre-treatment treatment by exposure to a gas or vapour treatment by exposure to a plasma
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Plasma & Fusion (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Architecture (AREA)
  • Epidemiology (AREA)
  • Environmental & Geological Engineering (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Structural Engineering (AREA)
  • Public Health (AREA)
  • Mechanical Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR1020200033259A 2019-11-04 2020-03-18 전사 장치 및 이를 이용한 전사된 기판의 생산 방법 KR102203205B1 (ko)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN202011074714.9A CN112776464B (zh) 2019-11-04 2020-10-09 转印装置及利用其的实施了转印的基板的生产方法
TW111136867A TWI818751B (zh) 2019-11-04 2020-10-13 轉印裝置及利用其的實施了轉印的基板的生產方法
TW112131438A TWI832796B (zh) 2019-11-04 2020-10-13 轉印裝置及利用其的實施了轉印的基板的生產方法
TW109135273A TWI785395B (zh) 2019-11-04 2020-10-13 轉印裝置及利用其的實施了轉印的基板的生產方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190139796 2019-11-04
KR20190139796 2019-11-04

Publications (1)

Publication Number Publication Date
KR102203205B1 true KR102203205B1 (ko) 2021-01-14

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Application Number Title Priority Date Filing Date
KR1020200033259A KR102203205B1 (ko) 2019-11-04 2020-03-18 전사 장치 및 이를 이용한 전사된 기판의 생산 방법
KR1020200033253A KR102206492B1 (ko) 2019-11-04 2020-03-18 전사 장치 및 이를 이용한 전사된 기판의 생산 방법
KR1020200033252A KR102206491B1 (ko) 2019-11-04 2020-03-18 전사 장치 및 이를 이용한 전사된 기판의 생산 방법

Family Applications After (2)

Application Number Title Priority Date Filing Date
KR1020200033253A KR102206492B1 (ko) 2019-11-04 2020-03-18 전사 장치 및 이를 이용한 전사된 기판의 생산 방법
KR1020200033252A KR102206491B1 (ko) 2019-11-04 2020-03-18 전사 장치 및 이를 이용한 전사된 기판의 생산 방법

Country Status (3)

Country Link
KR (3) KR102203205B1 (zh)
CN (1) CN112776464B (zh)
TW (3) TWI832796B (zh)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102203205B1 (ko) * 2019-11-04 2021-01-14 주식회사 기가레인 전사 장치 및 이를 이용한 전사된 기판의 생산 방법

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JP2011005696A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
WO2011089836A1 (ja) * 2010-01-19 2011-07-28 株式会社日立産機システム パターン転写装置及びパターン転写方法
KR20140072141A (ko) * 2011-09-28 2014-06-12 후지필름 가부시키가이샤 나노임프린트 장치, 나노임프린트 방법, 왜곡 부여 디바이스 및 왜곡 부여 방법
KR20140102705A (ko) * 2011-11-25 2014-08-22 에스씨아이브이에이엑스 가부시키가이샤 임프린트 장치 및 임프린트 방법
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KR20180105433A (ko) * 2017-03-15 2018-09-28 주식회사 기가레인 임프린트 장치 및 임프린트 방법

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011005695A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
JP2011005696A (ja) * 2009-06-24 2011-01-13 Tokyo Electron Ltd テンプレート処理装置、インプリントシステム、離型剤処理方法、プログラム及びコンピュータ記憶媒体
WO2011089836A1 (ja) * 2010-01-19 2011-07-28 株式会社日立産機システム パターン転写装置及びパターン転写方法
KR20140072141A (ko) * 2011-09-28 2014-06-12 후지필름 가부시키가이샤 나노임프린트 장치, 나노임프린트 방법, 왜곡 부여 디바이스 및 왜곡 부여 방법
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KR20170067665A (ko) * 2015-12-08 2017-06-16 주식회사 기가레인 임프린트 장치 및 방법
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Also Published As

Publication number Publication date
CN112776464B (zh) 2021-11-19
TW202305503A (zh) 2023-02-01
CN112776464A (zh) 2021-05-11
TW202119128A (zh) 2021-05-16
KR102206492B1 (ko) 2021-01-22
KR102206491B1 (ko) 2021-01-22
TW202347022A (zh) 2023-12-01
TWI785395B (zh) 2022-12-01
TWI818751B (zh) 2023-10-11
TWI832796B (zh) 2024-02-11

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