KR102202997B1 - 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치 - Google Patents

적층 구조체 제조 방법, 적층 구조체, 및 전자 장치 Download PDF

Info

Publication number
KR102202997B1
KR102202997B1 KR1020207002283A KR20207002283A KR102202997B1 KR 102202997 B1 KR102202997 B1 KR 102202997B1 KR 1020207002283 A KR1020207002283 A KR 1020207002283A KR 20207002283 A KR20207002283 A KR 20207002283A KR 102202997 B1 KR102202997 B1 KR 102202997B1
Authority
KR
South Korea
Prior art keywords
resin layer
graphene film
substrate
laminated structure
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207002283A
Other languages
English (en)
Korean (ko)
Other versions
KR20200015947A (ko
Inventor
노조미 기무라
게이스케 시미즈
도시오 후쿠다
Original Assignee
소니 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 소니 주식회사 filed Critical 소니 주식회사
Publication of KR20200015947A publication Critical patent/KR20200015947A/ko
Application granted granted Critical
Publication of KR102202997B1 publication Critical patent/KR102202997B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B32B37/025—Transfer laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/10—Removing layers, or parts of layers, mechanically or chemically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/185—Joining of semiconductor bodies for junction formation
    • H01L21/187—Joining of semiconductor bodies for junction formation by direct bonding
    • H01L29/1606—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • H10D62/881—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials being a two-dimensional material
    • H10D62/882—Graphene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/24—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer not being coherent before laminating, e.g. made up from granular material sprinkled onto a substrate
    • B32B2037/243—Coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/02—2 layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Landscapes

  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Electric Cables (AREA)
  • Carbon And Carbon Compounds (AREA)
  • Position Input By Displaying (AREA)
  • Liquid Crystal (AREA)
  • Electroluminescent Light Sources (AREA)
KR1020207002283A 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치 Active KR102202997B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-084583 2012-04-03
JP2012084583A JP2013214434A (ja) 2012-04-03 2012-04-03 積層構造体の製造方法、積層構造体および電子機器
PCT/JP2013/002101 WO2013150746A1 (en) 2012-04-03 2013-03-27 Laminated structure manufacturing method, laminated structure, and electronic apparatus

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020147016812A Division KR102074004B1 (ko) 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치

Publications (2)

Publication Number Publication Date
KR20200015947A KR20200015947A (ko) 2020-02-13
KR102202997B1 true KR102202997B1 (ko) 2021-01-13

Family

ID=48430897

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1020207002283A Active KR102202997B1 (ko) 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치
KR1020147016812A Active KR102074004B1 (ko) 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR1020147016812A Active KR102074004B1 (ko) 2012-04-03 2013-03-27 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치

Country Status (6)

Country Link
US (1) US10022947B2 (enExample)
EP (1) EP2834071A1 (enExample)
JP (1) JP2013214434A (enExample)
KR (2) KR102202997B1 (enExample)
CN (1) CN104203577A (enExample)
WO (1) WO2013150746A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013051516A1 (ja) 2011-10-03 2013-04-11 日立化成株式会社 導電パターンの形成方法、導電パターン基板及びタッチパネルセンサ
JP6466070B2 (ja) 2014-03-05 2019-02-06 株式会社東芝 透明導電体およびこれを用いたデバイス
CN103935988B (zh) * 2014-03-24 2017-01-11 无锡格菲电子薄膜科技有限公司 一种石墨烯薄膜的转移方法
CN104538562B (zh) * 2015-01-15 2017-04-26 京东方科技集团股份有限公司 一种oled器件及其封装方法和封装装置
CN106201039B (zh) * 2015-04-30 2023-05-23 安徽精卓光显技术有限责任公司 触摸屏及保护膜
KR102581899B1 (ko) * 2015-11-04 2023-09-21 삼성전자주식회사 투명 전극 및 이를 포함하는 소자
FR3045826A1 (fr) * 2015-12-17 2017-06-23 Commissariat Energie Atomique Supports amplificateurs de contraste utilisant un materiau bidimensionnel
JP6649800B2 (ja) * 2016-02-26 2020-02-19 住友電気工業株式会社 電子装置およびその製造方法
WO2018133053A1 (en) * 2017-01-21 2018-07-26 Southern University Of Science And Technology Graphene film and direct method for transfering graphene film onto flexible and transparent substrates
CN106827380B (zh) * 2017-01-23 2019-03-15 业成科技（成都）有限公司 带有抗眩光薄膜的三维工件制作方法
JP2018107138A (ja) * 2018-02-14 2018-07-05 株式会社東芝 透明導電体の製造方法
JP7154698B2 (ja) * 2018-09-06 2022-10-18 株式会社ディスコ ウェーハの加工方法
JP7171134B2 (ja) * 2018-10-17 2022-11-15 株式会社ディスコ ウェーハの加工方法
JP7503886B2 (ja) * 2018-11-06 2024-06-21 株式会社ディスコ ウェーハの加工方法
US12004308B2 (en) * 2021-05-18 2024-06-04 Mellanox Technologies, Ltd. Process for laminating graphene-coated printed circuit boards
US11963309B2 (en) 2021-05-18 2024-04-16 Mellanox Technologies, Ltd. Process for laminating conductive-lubricant coated metals for printed circuit boards
US12163228B2 (en) 2021-05-18 2024-12-10 Mellanox Technologies, Ltd. CVD system with substrate carrier and associated mechanisms for moving substrate therethrough
US12221695B2 (en) 2021-05-18 2025-02-11 Mellanox Technologies, Ltd. CVD system with flange assembly for facilitating uniform and laminar flow
US12289839B2 (en) 2021-05-18 2025-04-29 Mellanox Technologies, Ltd. Process for localized repair of graphene-coated lamination stacks and printed circuit boards

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2833111B2 (ja) * 1989-03-09 1998-12-09 日立化成工業株式会社 回路の接続方法及びそれに用いる接着剤フィルム
JP3531192B2 (ja) * 1993-10-18 2004-05-24 旭硝子株式会社 反射防止層を有する光学物品
JP3153142B2 (ja) * 1997-02-25 2001-04-03 日本電気株式会社 導電性偏光板
DE50212303D1 (de) * 2002-01-18 2008-07-03 Ovd Kinegram Ag Diffraktives sicherheitselement mit integriertem optischen wellenleiter
JP2007197498A (ja) * 2006-01-24 2007-08-09 Sumitomo Metal Mining Co Ltd 導電性接着剤
WO2008128554A1 (en) * 2007-04-20 2008-10-30 MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. Highly conductive, transparent carbon films as electrode materials
KR101372684B1 (ko) * 2007-04-27 2014-03-10 가부시키가이샤 구라레 투명 도전막 및 투명 도전막의 제조 방법
JP4957376B2 (ja) * 2007-05-18 2012-06-20 コニカミノルタホールディングス株式会社 透明性導電膜形成用感光材料、それを用いた透明性導電膜、その製造方法及び電磁波遮蔽材料
CN105462229A (zh) * 2008-01-07 2016-04-06 威斯技术基金会公司 鉴别和表征物料溶剂和复合基质的方法和装置及其使用方法
JP5303957B2 (ja) * 2008-02-20 2013-10-02 株式会社デンソー グラフェン基板及びその製造方法
KR101462401B1 (ko) 2008-06-12 2014-11-17 삼성전자주식회사 그라펜 시트로부터 탄소화 촉매를 제거하는 방법, 탄소화촉매가 제거된 그라펜 시트를 소자에 전사하는 방법, 이에따른 그라펜 시트 및 소자
US8753468B2 (en) * 2009-08-27 2014-06-17 The United States Of America, As Represented By The Secretary Of The Navy Method for the reduction of graphene film thickness and the removal and transfer of epitaxial graphene films from SiC substrates
EP2489520B1 (en) * 2009-10-16 2019-01-09 Graphene Square Inc. Roll-to-roll transfer method of graphene, graphene roll produced by the method, and roll-to-roll transfer equipment for graphene
TW201116606A (en) * 2009-11-03 2011-05-16 Nat Univ Tsing Hua Method and an apparatus for transferring carbonaceous material layer
KR101095097B1 (ko) * 2009-12-23 2011-12-20 삼성전기주식회사 투명 전극 필름 및 이의 제조 방법
KR101656103B1 (ko) * 2010-03-17 2016-09-08 동우 화인켐 주식회사 반사 방지 필름, 이를 포함하는 편광판 및 표시 장치
KR101630291B1 (ko) * 2010-06-17 2016-06-14 한화테크윈 주식회사 그래핀의 전사 방법
KR101793683B1 (ko) * 2010-07-27 2017-11-03 한화테크윈 주식회사 그래핀 제조 방법
CN102166866A (zh) * 2011-01-05 2011-08-31 常州大学 应用石墨烯制备抗静电层压材料的方法
JP5691524B2 (ja) * 2011-01-05 2015-04-01 ソニー株式会社 グラフェン膜の転写方法および透明導電膜の製造方法
KR101920713B1 (ko) * 2011-12-23 2018-11-22 삼성전자주식회사 그래핀 소자 및 그 제조방법

Also Published As

Publication number Publication date
US20150064470A1 (en) 2015-03-05
KR102074004B1 (ko) 2020-02-05
JP2013214434A (ja) 2013-10-17
WO2013150746A1 (en) 2013-10-10
KR20200015947A (ko) 2020-02-13
EP2834071A1 (en) 2015-02-11
US10022947B2 (en) 2018-07-17
CN104203577A (zh) 2014-12-10
KR20150002574A (ko) 2015-01-07

Similar Documents

Publication Publication Date Title
KR102202997B1 (ko) 적층 구조체 제조 방법, 적층 구조체, 및 전자 장치
KR101931831B1 (ko) 그래핀 막의 전사 방법 및 투명 도전막의 제조 방법
US10717260B2 (en) Manufacturing method of laminated structure, laminated structure and electronic device
JP5414426B2 (ja) 複合フィルム
JP5281986B2 (ja) 積層フィルムおよび複合フィルム
JP5847743B2 (ja) バリア性積層体およびガスバリアフィルム
JP5613691B2 (ja) 透明プラスチック基板用フェノキシ樹脂組成物及びそれを用いた透明プラスチック基板素材
KR20120117646A (ko) 점착제층이 형성된 투명 수지 필름, 적층 필름 및 터치 패널
CN104991671A (zh) 一种柔性触控屏传感薄膜及其制备方法
CN109476138B (zh) 阻气膜及太阳能电池以及阻气膜的制造方法
CN106057359A (zh) 一种嵌入式多取向金属纳米线透明导电薄膜的制备方法
WO2015198991A1 (ja) 電子デバイスの製造方法および複合フィルム
CN102208547B (zh) 一种柔性光电子器件用基板及其制备方法
JP5580561B2 (ja) バリア性積層体、ガスバリアフィルムおよびバリア性積層体の製造方法
Xiao et al. Ultra-flexible organic solar cells based on eco-friendly cellulose substrate with efficiency approaching 19%
JP2011138711A (ja) 透明導電性接着剤及び透明導電性接着剤から形成される透明導電性接着層を備える光電変換素子
JP2012020409A (ja) バリア性積層体、ガスバリアフィルムおよびこれらを用いたデバイス、ならびに、バリア性積層体の製造方法
JP2012111141A (ja) 透明導電性フィルム、並びにこれを用いた液晶表示素子、有機ｅｌ素子および有機薄膜太陽電池
CN107852819A (zh) 电路板的制造方法
JP2009220413A (ja) 積層体、積層体の製造方法、バリア性フィルム基板、デバイスおよび光学部材
JP2025150413A (ja) 導電性フィルム
JP2025150414A (ja) 導電性フィルム
JP2009208282A (ja) プラスチックシート

Legal Events

Date Code Title Description
A107 Divisional application of patent
PA0104 Divisional application for international application

Comment text: Divisional Application for International Patent

Patent event code: PA01041R01D

Patent event date: 20200122

Application number text: 1020147016812

Filing date: 20140619

A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20200130

Comment text: Request for Examination of Application

PG1501 Laying open of application
E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20200221

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20200903

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20200221

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
PX0901 Re-examination

Patent event code: PX09011S01I

Patent event date: 20200903

Comment text: Decision to Refuse Application

Patent event code: PX09012R01I

Patent event date: 20200413

Comment text: Amendment to Specification, etc.

PX0701 Decision of registration after re-examination

Patent event date: 20201021

Comment text: Decision to Grant Registration

Patent event code: PX07013S01D

Patent event date: 20200928

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

Patent event date: 20200903

Comment text: Decision to Refuse Application

Patent event code: PX07011S01I

Patent event date: 20200413

Comment text: Amendment to Specification, etc.

Patent event code: PX07012R01I

X701 Decision to grant (after re-examination)
GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20210108

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20210108

End annual number: 3

Start annual number: 1

PG1601 Publication of registration
PR1001 Payment of annual fee

Payment date: 20231227

Start annual number: 4

End annual number: 4

PR1001 Payment of annual fee

Payment date: 20241224

Start annual number: 5

End annual number: 5