KR102200000B1 - Light emitting device and lighting system - Google Patents

Abstract

The embodiment relates to a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system.
The light emitting device according to the embodiment includes a first conductivity type semiconductor layer; A second conductivity type semiconductor layer disposed under the first conductivity type semiconductor layer; An active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; A plurality of holes through which the second conductivity type semiconductor layer and the active layer layer are formed from a bottom surface of the second conductivity type semiconductor layer to expose a part of the first conductivity type semiconductor layer; A first contact electrode connected to the first conductivity type semiconductor layer layer through the plurality of holes from a bottom surface of the second conductivity type semiconductor layer; A bonding layer electrically connected to the first contact electrode and an insulating layer layer disposed in the plurality of hole holes; A support member disposed under the bonding layer; And a second contact electrode connected in a layered manner to the second conductivity type semiconductor layer, wherein the interface between the support member bonding layer overlaps the first interface region overlapping the first contact electrode and the first contact electrode. It includes a second interface region that is not, and a void may be disposed in the second interface region.

Description

Light emitting device and lighting system {LIGHT EMITTING DEVICE AND LIGHTING SYSTEM}

The embodiment relates to a light emitting device, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system.

Light Emitting Device is a pn junction diode that converts electrical energy into light energy. It can be created as a compound semiconductor such as Group III and Group V on the periodic table. Various colors can be realized by controlling the composition ratio of the compound semiconductor. It is possible.

When a forward voltage is applied, the electrons in the n-layer and the holes in the p-layer are combined to emit energy equivalent to the band gap energy of the conduction band and the balance band. Is mainly emitted in the form of heat or light, and becomes a light emitting device when radiated in the form of light.

For example, nitride semiconductors are attracting great interest in the development of optical devices and high-power electronic devices due to their high thermal stability and wide band gap energy. In particular, a blue light-emitting device, a green light-emitting device, and an ultraviolet (UV) light-emitting device using a nitride semiconductor are commercialized and widely used.

Among the conventional light emitting devices, there is a lateral type light emitting device in which an electrode layer is disposed in one direction of the epi layer, and such a horizontal type light emitting device has an operating voltage (Vf) of the light emitting device due to a narrow current flow. ) Increases, the current efficiency decreases, and there is a problem that is vulnerable to electrostatic discharge.

In order to solve this problem, conventionally, a via hole type vertical light emitting device has been developed in which a via hole is formed under an epi layer to place an electrode.

In order to manufacture a via-hole type vertical light emitting device in the prior art, a number of Mesa etching for n-contact is performed, and insulation between n-contact and Mesa etching hole is performed. To form a layer.

Meanwhile, according to the prior art, an n-contact and a bonding layer are formed in order to manufacture a via-hole type vertical light emitting device, and voids are generated when the bonding layer is formed, and these voids are electrically and physically reliable. There is a problem that lowers it.

The embodiment is to provide a light emitting device with enhanced reliability, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system.

The light emitting device according to the embodiment includes a first conductivity type semiconductor layer; A second conductivity type semiconductor layer disposed under the first conductivity type semiconductor layer; An active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; A plurality of holes penetrating the second conductive type semiconductor layer and the active layer from the bottom surface of the second conductive type semiconductor layer to expose a part of the first conductive type semiconductor layer; A first contact electrode electrically connected to the first conductivity type semiconductor layer through the plurality of holes from the bottom of the second conductivity type semiconductor layer; An insulating layer disposed between the first contact electrode and the plurality of holes; A bonding layer electrically connected to the first contact electrode; A support member disposed under the bonding layer; And a second contact electrode electrically connected to the second conductivity type semiconductor layer, wherein an interface between the support member and the bonding layer includes a second interface region overlapping the first contact electrode and the first contact It includes a first interface region that does not overlap with the electrode, and a void may be disposed in the first interface region.

The lighting system according to the embodiment may include a light emitting unit including the light emitting device.

According to the embodiment, it is possible to provide a light emitting device with improved physical and electrical reliability, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system by controlling a distribution area of voids generated when a bonding layer is formed.

1 is a plan view of a light emitting device according to an embodiment.
2 is an enlarged cross-sectional view of a light emitting device according to the embodiment.
3 to 11 are cross-sectional views of a method of manufacturing a light emitting device according to the embodiment.
12 is a cross-sectional view of a light emitting device package according to an embodiment.
13 is an exploded perspective view of a lighting device according to an embodiment.

In the description of the embodiment, each layer (film), region, pattern, or structure is "on/over" or "under" of the substrate, each layer (film), region, pad, or patterns. In the case of being described as being formed in, "on/over" and "under" include both "directly" or "indirectly" formed do. In addition, standards for the top/top or bottom of each layer will be described based on the drawings.

(Example)

1 is a plan view of a light emitting device 100 according to an exemplary embodiment, and FIG. 2 is an enlarged cross-sectional view taken along line A-A' of FIG. 1.

The light emitting device 100 according to the embodiment includes a first conductivity type semiconductor layer 112, a second conductivity type semiconductor layer 116 disposed under the first conductivity type semiconductor layer 112, and the first conductivity type. The active layer 114 disposed between the type semiconductor layer 112 and the second conductivity type semiconductor layer 116, and the second conductivity type semiconductor layer 116 from the bottom of the second conductivity type semiconductor layer 116 A plurality of holes (H) penetrating through the active layer 114 to expose a part of the first conductivity type semiconductor layer 112, and the plurality of holes (H) from the bottom surface of the second conductivity type semiconductor layer 116 ) Through a first contact electrode 160 electrically connected to the first conductivity type semiconductor layer 112, and an insulating layer 140 disposed between the first contact electrode 160 and the plurality of holes H. ) And a first electrode layer 150 electrically connected to the first contact electrode 160 and a second contact electrode 132 electrically connected to the second conductivity type semiconductor layer 116.

The first electrode layer 150 may include a bonding layer 156 electrically connected to the first contact electrode 160 and a support member 158 disposed under the bonding layer 156.

In an embodiment, the interface between the support member 158 and the bonding layer 156 overlaps the second interface region P2 overlapping the first contact electrode 160 and the first contact electrode 160 A first interface region P1 that is not used may be included, and a void may be disposed in the first interface region P1.

In addition, in an embodiment, the interface between the support member 158 and the bonding layer 156 may include a third interface region P3 overlapping the first contact electrode 160 and in which a void is disposed. The third interface region P3 may have a void concentration lower than that of the first interface region P1.

Accordingly, according to the embodiment, physical and electrical reliability may be improved by minimizing the arrangement of voids in the region of the first contact electrode 160 that is a carrier passage. For example, by minimizing voids at the interface overlapping the region of the first contact electrode 160, the physical bonding force between the bonding layer 156 and the support member 158 is excellent, so that reliability may be improved.

In addition, according to the embodiment, the arrangement of voids in the region of the first contact electrode 160 that is a carrier passage is minimized, thereby improving electrical reliability.

According to the embodiment, it is possible to provide a light emitting device with improved physical and electrical reliability, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system by controlling a distribution area of voids generated when a bonding layer is formed.

Hereinafter, a method of manufacturing a light emitting device according to an embodiment will be described with reference to FIGS. 3 to 11.

First, as shown in FIG. 3, the light emitting structure layer 110 may be formed on the growth substrate 105. The light emitting structure layer 110 may include a first conductivity type semiconductor layer 112, an active layer 114, and a second conductivity type semiconductor layer 116.

The growth substrate 105 may be loaded onto the growth equipment and formed in a layer or pattern form using a compound semiconductor of a group II to VI element thereon.

The growth equipment is an electron beam evaporator, physical vapor deposition (PVD), chemical vapor deposition (CVD), plasma laser deposition (PLD), dual-type thermal evaporator sputtering, metal organic chemical vapor (MOCVD). deposition), etc. may be employed, but is not limited to such equipment.

The growth substrate 105 may be a conductive substrate or an insulating substrate. For example, the growth substrate 105 may be selected from the group consisting of a sapphire substrate (Al ₂ 0 ₃ ), GaN, SiC, ZnO, Si, GaP, InP, Ga ₂ 0 ₃ , and GaAs.

A buffer layer (not shown) may be formed on the growth substrate 105. The buffer layer reduces the difference in lattice constant between the growth substrate 105 and the nitride semiconductor layer, and the material is GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP. Can be selected from.

An undoped semiconductor layer (not shown) may be formed on the buffer layer, and the undoped semiconductor layer may be formed of an undoped GaN-based semiconductor, and may be formed as a semiconductor layer having a lower conductivity than an n-type semiconductor layer. .

Thereafter, a first conductivity type semiconductor layer 112 is formed on the buffer layer or the undoped semiconductor layer. Thereafter, an active layer 114 may be formed on the first conductivity type semiconductor layer 112, and a second conductivity type semiconductor layer 116 may be sequentially stacked on the active layer 114.

Other layers may be further disposed above or below each of the semiconductor layers, and may be formed in a superlattice structure using, for example, a group III-V compound semiconductor layer, but is not limited thereto.

The first conductivity type semiconductor layer 112 is a compound semiconductor of a group III-V element doped with a first conductivity type dopant, such as GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, It can be selected from GaAsP, AlGaInP, and the like. For example, the first conductivity type semiconductor layer 112 has a composition formula of In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1) It may be formed as a semiconductor layer having.

The first conductivity-type semiconductor layer 112 may be an n-type semiconductor layer, and the first conductivity-type dopant may include an n-type dopant such as Si, Ge, Sn, Se, and Te.

The first conductivity type semiconductor layer 112 may be formed as a single layer or multiple layers, and two different layers among GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP are alternately formed. It may include a super lattice structure arranged as.

The active layer 114 may include a single quantum well structure, a multiple quantum well structure, a quantum wire structure, or a quantum dot structure. The active layer 114 may be formed in a cycle of a well layer and a barrier layer using a compound semiconductor material of a group III-V element. The well layer includes a semiconductor layer having a composition formula of In _x Al _y Ga _{1 -x- y} N (0≤x≤1, 0≤y≤1, 0≤x+y≤1), and the barrier layer is In _x Al _y Ga _{1 -x- y} N (0≦x≦1, 0≦y≦1, 0≦x+y≦1) may be formed as a semiconductor layer having a composition formula. The barrier layer may be formed of a material having a band gap higher than that of the well layer.

The active layer 114 may include, for example, at least one of a period of an InGaN well layer/GaN barrier layer, a period of an InGaN well layer/AlGaN barrier layer, and a period of an InGaN well layer/InGaN barrier layer. .

The second conductivity type semiconductor layer 116 is formed on the active layer 114, and the second conductivity type semiconductor layer 116 is a compound semiconductor of a group III-V element doped with a second conductivity type dopant, for example, It can be selected from GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, AlGaInP, and the like. The second conductivity type semiconductor layer 116 is formed of a semiconductor layer having a composition formula of In _x Al _y Ga _1-xy N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). I can.

The second conductivity-type semiconductor layer 116 may be a p-type semiconductor layer, and the second conductivity-type dopant includes a p-type dopant such as Mg and Zn. The second conductivity type semiconductor layer 116 may be formed as a single layer or multiple layers, but is not limited thereto.

The second conductivity type semiconductor layer 116 may include a superlattice structure in which two different layers of GaN, AlN, AlGaN, InGaN, InN, InAlGaN, AlInN, AlGaAs, GaP, GaAs, GaAsP, and AlGaInP are alternately disposed. I can.

The first conductivity type semiconductor layer 112, the active layer 114, and the second conductivity type semiconductor layer 116 may be defined as a light emitting structure layer 110. In addition, a third conductivity type semiconductor layer (not shown), for example, a semiconductor layer having a polarity opposite to that of the second conductivity type may be formed on the second conductivity type semiconductor layer 116.

Accordingly, the light emitting structure layer 110 may include at least one of an n-p junction, a p-n junction, an n-p-n junction, and a p-n-p junction structure. In the following description, a structure in which the second conductivity type semiconductor layer 116 is disposed on the uppermost layer of the light emitting structure layer 110 will be described as an example.

Next, as shown in FIG. 4, a mesa etching process for removing a part of the light emitting structure may be performed.

For example, a plurality of holes H may be formed through the second conductivity type semiconductor layer 116 and the active layer 114 to expose a part of the first conductivity type semiconductor layer 112.

In the embodiment, the plurality of holes H is at a predetermined angle from the first conductivity-type semiconductor layer 112 to the top surface of the second conductivity-type semiconductor layer 116, for example, with respect to the top surface of the light emitting structure layer 110. It can be formed at an obtuse angle.

In the embodiment, the horizontal width of the plurality of holes H may decrease toward the lower side. Meanwhile, in FIG. 2, according to claim 1, the horizontal width of the plurality of holes H may decrease toward an upper side.

2, according to the embodiment, the horizontal width of the plurality of holes H decreases upwardly, thereby reducing the areas of the active layer 114 and the first conductivity-type semiconductor layer 112 that are removed, thereby reducing the luminous efficiency. Can contribute to

Next, as shown in FIG. 5, a channel layer 120 may be formed on the plurality of holes H. The channel layer 120 may not be formed in a region where the first contact electrode 160 to be formed later is to be formed. Through this, a part of the first conductivity type semiconductor layer 112 may be exposed.

The channel layer 120 may function as an electrical insulating layer between the first contact electrode 160, the active layer 114, and the second conductivity type semiconductor layer 116 formed later.

The channel layer 120 may be formed of at least one material selected from SiO _x , SiO _x N _y , Al ₂ O ₃ , and TiO ₂ .

In addition, in an embodiment, the channel layer 120 may have a reflectance of more than 50%. For example, the channel layer 120 may be formed of a material selected from SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ , and a reflective material is included in the insulating material. It can be formed in a mixed form.

For example, the channel layer 120 may be formed in a form in which any one or more of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, or Hf is mixed with an insulating material. I can.

According to the embodiment, when the emitted light travels downward, it is reflected in the channel layer 120 to minimize light absorption and increase light efficiency.

Next, a second contact electrode 132 may be formed on the second conductivity type semiconductor layer 116.

The second contact electrode 132 is in ohmic contact with the second conductivity type semiconductor layer 116, includes at least one conductive material, and may be formed of a single layer or multiple layers.

For example, the second contact electrode 132 may include at least one of metal, metal oxide, and metal nitride.

The second contact electrode 132 includes a light-transmitting material, for example, indium tin oxide (ITO), indium zinc oxide (IZO), IZO nitride (IZON), indium zinc tin oxide (IZTO), indium aluminum oxide (IAZO). zinc oxide), IGZO(indium gallium zinc oxide), IGTO(indium gallium tin oxide), AZO(aluminum zinc oxide), ATO(antimony tin oxide), GZO(gallium zinc oxide), IrOx, RuOx, RuOx/ITO, Ni It may include at least one of /IrOx/Au, Ni/IrOx/Au/ITO, Pt, Ni, Au, Rh, or Pd.

Next, a reflective layer 134 may be formed on the second contact electrode 132.

The reflective layer 134 is disposed on the second contact electrode 132 and may reflect light incident through the second contact electrode 132.

The reflective layer 134 includes a metal, for example, one layer or a plurality of materials composed of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, and two or more alloys thereof. It can be formed in layers.

Next, a capping layer 136 may be formed on the reflective layer 134. Including the second contact electrode 132, the reflective layer 134, and the capping layer 136, it may be referred to as a second electrode layer 130, and the second electrode layer 130 includes power supplied from the pad electrode 180 May be supplied to the second conductivity type semiconductor layer 116.

The capping layer 136 is disposed on the reflective layer 134 and may supply power supplied from the pad electrode 180 to the reflective layer 134. The capping layer 136 may function as a current diffusion layer.

The capping layer 136 includes a metal and is a material having high electrical conductivity, such as Sn, Ga, In, Bi, Cu, Ni, Ag, Mo, Al, Au, Nb, W, Ti, Cr, Ta, It may contain at least one of Al, Pd, Pt, Si and optional alloys thereof.

Next, as shown in FIG. 6, an insulating layer 140 may be formed on the capping layer 136 and the channel layer 120.

The insulating layer 140 may be formed to expose the first contact electrode 160.

The insulating layer 140 electrically insulates the first contact electrode 160 from another semiconductor layer.

In addition, the insulating layer 140 may be disposed between the first electrode layer 150 and the channel layer 120 to be formed thereafter to block electrical contact.

The insulating layer 140 may be formed of a material selected from SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ .

The insulating layer 140 may have a reflectance of more than 50%. For example, the insulating layer 140 may be formed of a material selected from SiO ₂ , SiO _x , SiO _x N _y , Si ₃ N ₄ , Al ₂ O ₃ , and TiO ₂ , and the reflective material is included in the insulating material. It can be formed in a mixed form.

For example, any one or more of Ag, Ni, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, or Hf is mixed with the insulating layer 140 Can be formed as

According to the embodiment, the physical properties of the insulating layer 140 formed between the first contact electrode 160 and the plurality of holes H are formed of a reflective layer material, so that light absorption in the insulating layer 140 functioning as a passivation is achieved. By minimizing it, light efficiency can be increased.

Next, a first contact electrode 160 may be formed on the exposed first conductivity type semiconductor layer 112.

The first contact electrode 160 may come into ohmic contact with the exposed first conductivity type semiconductor layer 112. When viewed from above, the first contact electrode 160 may have a circular or polygonal shape, but is not limited thereto.

The upper surface of the first contact electrode 160 may be disposed between the upper surface of the active layer 114 and the upper surface of the first conductivity type semiconductor layer 112.

The surface of the first conductivity type semiconductor layer 112 to which the first contact electrode 160 is in contact is a Ga-face, and may be formed in a flat structure, but is not limited thereto.

Referring to FIG. 6, in an embodiment, the width of the first contact electrode 160 may increase from the bottom surface to the top surface. Meanwhile, with reference to FIG. 2, the width of the first contact electrode 160 may decrease from an upper surface to a lower surface.

Through this, the possibility of a short circuit between the first contact electrode 160 and the material of the second electrode layer 130 to be formed later is reduced, and the area in which the first contact electrode 160 contacts the first conductivity type semiconductor layer 112 is maximized. Meanwhile, the area occupied by the first contact electrode 160 may be reduced to increase light efficiency.

On the other hand, when described with reference to FIG. 2, by making the horizontal width of the bottom surface of the first contact electrode 160 and the horizontal width of the diffusion barrier layer 154 in contact with the first contact electrode 160 match, the diffusion barrier layer 154, while minimizing an area occupied by the first contact electrode 160, electrical characteristics may not be deteriorated.

Next, as shown in FIG. 7, a diffusion barrier layer 154 is formed on the insulating layer 140 and the first contact electrode 160, and a bonding layer 156 is formed on the diffusion barrier layer 154. I can.

The diffusion barrier layer 154 or the bonding layer 156 may include at least one of Ti, Au, Sn, Ni, Cr, Ga, In, Bi, Cu, Ag, and Ta.

The diffusion barrier layer 154 or the bonding layer 156 may be formed by at least one of a deposition method, a sputtering method, and a plating method, or may be attached as a conductive sheet.

The bonding layer 156 may not be formed, but is not limited thereto.

Next, as shown in FIG. 8, a support member 158 may be formed on the bonding layer 156.

It may be referred to as a first electrode layer 150 including the diffusion barrier layer 154, the bonding layer 156, and the support member 158, and the first electrode layer 150 controls power supplied from the lower electrode 159. It can be supplied to the 1 conductive type semiconductor layer 112.

The support member 158 may be bonded to the bonding layer 156, but is not limited thereto.

The support member 158 may be a conductive support member, and as a base substrate, at least one of copper (Cu), gold (Au), nickel (Ni), molybdenum (Mo), copper-tungsten (Cu-W), etc. It can be one.

In addition, the support member 158 may be implemented as a carrier wafer (eg, Si, Ge, GaAs, ZnO, SiC, SiGe, Ga ₂ 0 ₃ , GaN, etc.), and Can be bonded with solder.

In an embodiment, the interface between the support member 158 and the bonding layer 156 overlaps the second interface region P2 overlapping the first contact electrode 160 and the first contact electrode 160 A first interface region P1 that is not used may be included, and a void may be disposed in the first interface region P1.

In addition, in an embodiment, the interface between the support member 158 and the bonding layer 156 may include a third interface region P3 overlapping the first contact electrode 160 and in which a void is disposed. The third interface region P3 may have a void concentration lower than that of the first interface region P1.

According to the embodiment, the thickness of the bonding layer 156 is made thicker than the conventional one, so that the void formation region or concentration can be controlled. For example, referring to the above-described background (paragraph [0008]), FIG. 4 and paragraphs [0043] to [0046], in the embodiment, a mesa etching process for removing a part of the light emitting structure may be performed. Accordingly, the upper surface of the bonding layer 156 formed on the mesa-etched region may not form a flat surface with the upper surface of the bonding layer 156 formed on a region where the mesa-etched region has not been performed. Accordingly, in the embodiment, by forming the thickness of the bonding layer 156 to a thickness of about 7 μm or more, for example, about 7 μm to 10 μm, the upper surface of the bonding layer 156 can be controlled to be flat. Therefore, it is possible to minimize the occurrence of voids during bonding with the support member 158.

Accordingly, according to the embodiment, physical and electrical reliability may be improved by minimizing the arrangement of voids in the region of the first contact electrode 160 that is a carrier passage. For example, by minimizing voids at the interface overlapping the region of the first contact electrode 160, the physical bonding force between the bonding layer 156 and the support member 158 is excellent, so that reliability may be improved.

In addition, according to the embodiment, the arrangement of voids in the region of the first contact electrode 160 that is a carrier passage is minimized, thereby improving electrical reliability.

According to the embodiment, it is possible to provide a light emitting device with improved physical and electrical reliability, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system by controlling a distribution area of voids generated when a bonding layer is formed.

Next, as shown in FIG. 9, the growth substrate 105 may be removed. At this time, the surface of the first conductivity type semiconductor layer 112 may be exposed by removing the undoped semiconductor layer (not shown) remaining after the growth substrate 105 is removed.

The growth substrate 105 may be removed by a physical or/and chemical method. For example, the method of removing the growth substrate 105 may be removed through a laser lift off (LLO) process. For example, the growth substrate 105 is lifted off by irradiating the growth substrate 105 with a laser having a wavelength of a predetermined region.

Alternatively, the growth substrate 105 may be separated by removing a buffer layer (not shown) disposed between the growth substrate 105 and the first conductivity type semiconductor layer 112 using a wet etching solution.

By removing the growth substrate 105 and removing the buffer layer by etching or polishing, the upper surface of the first conductivity type semiconductor layer 112 may be exposed.

The top surface of the first conductivity type semiconductor layer 112 is an N-face, and may be a surface closer to the growth substrate.

The upper surface of the first conductivity-type semiconductor layer 112 may be etched by a method such as ICP/RIE (Inductively Coupled Plasma/Reactive Ion Etching) or polished with a polishing equipment.

Next, as shown in FIG. 10, a part of the light emitting structure layer 110 may be removed to expose part of the channel layer 120.

For example, a portion of the first conductivity type semiconductor layer 112, the active layer 114, and the second conductivity type semiconductor layer 116 in the region where the pad electrode 180 is to be formed may be removed.

For example, by performing wet etching or dry etching, the circumference of the light emitting structure layer 110, that is, a channel region or an isolation region, which is a boundary region between a chip and a chip, may be removed, and the channel layer 120 is exposed. Can be.

A light extraction structure may be formed on an upper surface of the first conductivity type semiconductor layer 112, and the light extraction structure may be formed in a roughness or pattern. The light extraction structure may be formed by a wet or dry etching method.

Next, as shown in FIG. 11, a passivation layer 170 may be formed on the exposed channel layer 120 and the light emitting structure layer 110.

Thereafter, a portion of the passivation layer 170 and the channel layer 120 in the region where the pad electrode 180 is to be formed may be removed to expose a portion of the capping layer 136.

Next, the pad electrode 180 may be formed on the exposed capping layer 136.

The pad electrode 180 may be formed of Ti/Au, but is not limited thereto.

The pad electrode 180 is a portion to be bonded with a wire, and may be disposed on a predetermined portion of the light emitting structure layer 110, and may be formed in one or a plurality.

In addition, as shown in FIG. 2, a first electrode 159 may be formed under the first electrode layer 150, and the first electrode 159 is made of a material having high conductivity, for example, Ti, Al, Ni, etc. Materials may be used, but are not limited thereto.

According to the embodiment, it is possible to provide a light emitting device with improved physical and electrical reliability, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system by controlling a distribution area of voids generated when a bonding layer is formed.

12 is a diagram illustrating a light emitting device package to which a light emitting device according to an embodiment is applied.

Referring to FIG. 12, the light emitting device package according to the embodiment includes a body 205, a first lead electrode 213 and a second lead electrode 214 disposed on the body 205, and the body 205 A light emitting device 100 provided in the first lead electrode 213 and electrically connected to the second lead electrode 214 and a molding member 240 surrounding the light emitting device 100 may be included. .

The body 205 may be formed of a silicon material, a synthetic resin material, or a metal material, and an inclined surface may be formed around the light emitting device 100.

The first lead electrode 213 and the second lead electrode 214 are electrically separated from each other, and supply power to the light emitting device 100. In addition, the first lead electrode 213 and the second lead electrode 214 reflect light generated from the light emitting device 100 to increase light efficiency, and heat generated from the light emitting device 100 It can also play a role of discharging to outside.

The light emitting device 100 may be disposed on the body 205 or may be disposed on the first lead electrode 213 or the second lead electrode 214.

The light emitting device 100 may be electrically connected to the first lead electrode 213 and the second lead electrode 214 by any one of a wire method, a flip chip method, or a die bonding method.

In the embodiment, the light emitting device 100 is mounted on the second lead electrode 214 and may be connected to the first lead electrode 213 and the wire 250, but the embodiment is not limited thereto.

The molding member 240 may surround the light emitting device 100 to protect the light emitting device 100. In addition, the molding member 240 may include a phosphor 232 to change a wavelength of light emitted from the light emitting device 100.

A plurality of light emitting devices or light emitting device packages according to the embodiment may be arrayed on a substrate, and an optical member such as a lens, a light guide plate, a prism sheet, and a diffusion sheet may be disposed on an optical path of the light emitting device package. Such a light emitting device package, a substrate, and an optical member may function as a light unit. The light unit may be implemented in a top view or a side view type, and may be provided to display devices such as portable terminals and notebook computers, or may be variously applied to lighting devices and indication devices. Another embodiment may be implemented as a lighting device including the light emitting device or the light emitting device package described in the above-described embodiments. For example, the lighting device may include a lamp, a street light, an electric sign, and a headlamp.

13 is an exploded perspective view of a lighting device according to an embodiment.

Referring to FIG. 13, a lighting device according to an embodiment includes a cover 2100, a light source module 2200, a radiator 2400, a power supply unit 2600, an inner case 2700, and a socket 2800. I can. In addition, the lighting device according to the embodiment may further include one or more of a member 2300 and a holder 2500. The light source module 2200 may include a light emitting device package according to the embodiment.

For example, the cover 2100 may have a shape of a bulb or a hemisphere, and may be provided in a shape with a hollow and an open portion. The cover 2100 may be optically coupled to the light source module 2200. For example, the cover 2100 may diffuse, scatter, or excite light provided from the light source module 2200. The cover 2100 may be a kind of optical member. The cover 2100 may be coupled to the radiator 2400. The cover 2100 may have a coupling portion coupled to the radiator 2400.

A milky white paint may be coated on the inner surface of the cover 2100. The milky white paint may include a diffuser that diffuses light. The surface roughness of the inner surface of the cover 2100 may be larger than the surface roughness of the outer surface of the cover 2100. This is to allow light from the light source module 2200 to be sufficiently scattered and diffused to be emitted to the outside.

The material of the cover 2100 may be glass, plastic, polypropylene (PP), polyethylene (PE), polycarbonate (PC), or the like. Here, polycarbonate is excellent in light resistance, heat resistance, and strength. The cover 2100 may be transparent or opaque so that the light source module 2200 is visible from the outside. The cover 2100 may be formed through blow molding.

The light source module 2200 may be disposed on one surface of the radiator 2400. Accordingly, heat from the light source module 2200 is conducted to the radiator 2400. The light source module 2200 may include a light source unit 2210, a connection plate 2230, and a connector 2250.

The member 2300 is disposed on an upper surface of the radiator 2400 and has guide grooves 2310 into which a plurality of light source units 2210 and a connector 2250 are inserted. The guide groove 2310 corresponds to the substrate and the connector 2250 of the light source unit 2210.

The surface of the member 2300 may be coated or coated with a light reflective material. For example, the surface of the member 2300 may be coated or coated with a white paint. The member 2300 reflects light reflected on the inner surface of the cover 2100 and returning toward the light source module 2200 toward the cover 2100. Therefore, it is possible to improve the light efficiency of the lighting device according to the embodiment.

The member 2300 may be made of an insulating material, for example. The connection plate 2230 of the light source module 2200 may include an electrically conductive material. Accordingly, electrical contact may be made between the radiator 2400 and the connection plate 2230. The member 2300 may be formed of an insulating material to block an electrical short between the connection plate 2230 and the radiator 2400. The radiator 2400 receives heat from the light source module 2200 and heat from the power supply unit 2600 to radiate heat.

The holder 2500 blocks the receiving groove 2719 of the insulating part 2710 of the inner case 2700. Accordingly, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510. The guide protrusion 2510 has a hole through which the protrusion 2610 of the power supply unit 2600 passes.

The power supply unit 2600 processes or converts an electrical signal provided from the outside and provides it to the light source module 2200. The power supply unit 2600 is accommodated in the storage groove 2719 of the inner case 2700 and is sealed inside the inner case 2700 by the holder 2500.

The power supply unit 2600 may include a protrusion 2610, a guide portion 2630, a base 2650, and an extension 2670.

The guide portion 2630 has a shape protruding outward from one side of the base 2650. The guide part 2630 may be inserted into the holder 2500. A number of components may be disposed on one surface of the base 2650. A number of components include, for example, a DC converter for converting AC power provided from an external power source to DC power, a driving chip for controlling the driving of the light source module 2200, and an ESD for protecting the light source module 2200. (ElectroStatic discharge) may include a protection element, but is not limited thereto.

The extension part 2670 has a shape protruding outward from the other side of the base 2650. The extension part 2670 is inserted into the connection part 2750 of the inner case 2700 and receives an electrical signal from the outside. For example, the extension part 2670 may be provided equal to or smaller than the width of the connection part 2750 of the inner case 2700. Each end of the "+ wire" and "- wire" may be electrically connected to the extension part 2670, and the other end of the "+ wire" and "- wire" may be electrically connected to the socket 2800. .

The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding part is a part where the molding liquid is solidified, and allows the power supply part 2600 to be fixed inside the inner case 2700.

Features, structures, effects, and the like described in the embodiments above are included in at least one embodiment, and are not necessarily limited to only one embodiment. Further, the features, structures, effects, etc. illustrated in each embodiment may be implemented by combining or modifying other embodiments by a person having ordinary knowledge in the field to which the embodiments belong. Therefore, contents related to such combinations and modifications should be interpreted as being included in the scope of the embodiments.

Although the embodiments have been described above, these are only examples and are not intended to limit the embodiments, and those of ordinary skill in the field to which the embodiments belong are not departing from the essential characteristics of the embodiments. It will be seen that branch transformation and application are possible. For example, each component specifically shown in the embodiment can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the embodiments set in the appended claims.

The first conductivity type semiconductor layer 112, the second conductivity type semiconductor layer 116, the active layer 114,
A plurality of holes H, the first contact electrode 160, the insulating layer 140,
Bonding layer 156, support member 158, second contact electrode 132,
The first interface region P1, the second interface region P2, and the third interface region P3

Claims (11)

A first conductivity type semiconductor layer;
A second conductivity type semiconductor layer disposed under the first conductivity type semiconductor layer;
An active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer;
A plurality of holes penetrating the second conductive type semiconductor layer and the active layer from the bottom surface of the second conductive type semiconductor layer to expose a part of the first conductive type semiconductor layer;
A first contact electrode electrically connected to the first conductivity type semiconductor layer through the plurality of holes from the bottom of the second conductivity type semiconductor layer;
An insulating layer disposed between the first contact electrode and the plurality of holes;
A bonding layer electrically connected to the first contact electrode;
A support member disposed under the bonding layer; And
And a second contact electrode electrically connected to the second conductivity type semiconductor layer,
The bonding layer has a thickness of 7 μm to 10 μm,
The lower surface of the bonding layer facing the support member is flat,
The interface between the support member and the bonding layer,
A first interface region not overlapping with the first contact electrode and in which a void is disposed;
A second interface region overlapping the first contact electrode; And
And a third interface region overlapping the first contact electrode and including the void; and
The third interface region is a light emitting device having a void concentration lower than that of the first interface region. delete delete The method of claim 1,
The insulating layer is a light emitting device having a reflectance of more than 50%. The method of claim 1,
A light emitting device further comprising a channel layer surrounding the first contact electrode. The method of claim 5,
The channel layer is a light emitting device including a reflective material. delete delete delete delete delete

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