KR102192288B1 - 워크의 연마장치 - Google Patents

워크의 연마장치 Download PDF

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Publication number
KR102192288B1
KR102192288B1 KR1020157032613A KR20157032613A KR102192288B1 KR 102192288 B1 KR102192288 B1 KR 102192288B1 KR 1020157032613 A KR1020157032613 A KR 1020157032613A KR 20157032613 A KR20157032613 A KR 20157032613A KR 102192288 B1 KR102192288 B1 KR 102192288B1
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KR
South Korea
Prior art keywords
polishing
work
template
polishing cloth
cloth
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KR1020157032613A
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English (en)
Korean (ko)
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KR20160008550A (ko
Inventor
히로마사 하시모토
마사나오 사사키
Original Assignee
신에쯔 한도타이 가부시키가이샤
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Publication of KR20160008550A publication Critical patent/KR20160008550A/ko
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Publication of KR102192288B1 publication Critical patent/KR102192288B1/ko
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/27—Work carriers
    • B24B37/30—Work carriers for single side lapping of plane surfaces
    • B24B37/32—Retaining rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02002—Preparing wafers
    • H01L21/02005—Preparing bulk and homogeneous wafers
    • H01L21/02008—Multistep processes
    • H01L21/0201—Specific process step
    • H01L21/02024—Mirror polishing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020157032613A 2013-05-16 2014-04-10 워크의 연마장치 Active KR102192288B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2013-103719 2013-05-16
JP2013103719A JP5870960B2 (ja) 2013-05-16 2013-05-16 ワークの研磨装置
PCT/JP2014/002066 WO2014185003A1 (ja) 2013-05-16 2014-04-10 ワークの研磨装置

Publications (2)

Publication Number Publication Date
KR20160008550A KR20160008550A (ko) 2016-01-22
KR102192288B1 true KR102192288B1 (ko) 2020-12-17

Family

ID=51897996

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020157032613A Active KR102192288B1 (ko) 2013-05-16 2014-04-10 워크의 연마장치

Country Status (8)

Country Link
US (1) US20160082567A1 (enrdf_load_stackoverflow)
JP (1) JP5870960B2 (enrdf_load_stackoverflow)
KR (1) KR102192288B1 (enrdf_load_stackoverflow)
CN (1) CN105189045B (enrdf_load_stackoverflow)
DE (1) DE112014002107T5 (enrdf_load_stackoverflow)
SG (1) SG11201509094YA (enrdf_load_stackoverflow)
TW (1) TWI597127B (enrdf_load_stackoverflow)
WO (1) WO2014185003A1 (enrdf_load_stackoverflow)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10333959B2 (en) * 2016-08-31 2019-06-25 Nicira, Inc. Use of public cloud inventory tags to configure data compute node for logical network
JP6312229B1 (ja) * 2017-06-12 2018-04-18 信越半導体株式会社 研磨方法及び研磨装置
JP7139126B2 (ja) * 2018-03-16 2022-09-20 富士紡ホールディングス株式会社 保持具及びその製造方法
CN110394706A (zh) * 2019-07-25 2019-11-01 西安奕斯伟硅片技术有限公司 一种硅片处理装置及方法
CN111644977A (zh) * 2020-07-17 2020-09-11 中国科学院微电子研究所 研磨用固定环以及研磨头

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020182867A1 (en) * 2001-06-04 2002-12-05 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2005169568A (ja) * 2003-12-11 2005-06-30 Mitsui Chemicals Inc リテーナリング及びそれを用いた研磨装置

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5267418A (en) * 1992-05-27 1993-12-07 International Business Machines Corporation Confined water fixture for holding wafers undergoing chemical-mechanical polishing
TW400567B (en) * 1995-04-10 2000-08-01 Matsushita Electric Ind Co Ltd The polishing device and its polishing method for the substrate
JP3615592B2 (ja) * 1995-07-11 2005-02-02 不二越機械工業株式会社 研磨装置
JPH1190820A (ja) 1997-09-12 1999-04-06 Shin Etsu Handotai Co Ltd ウエーハ研磨用テンプレートと該テンプレートを利用したウエーハ剥がし方法
US6899610B2 (en) * 2001-06-01 2005-05-31 Raytech Innovative Solutions, Inc. Retaining ring with wear pad for use in chemical mechanical planarization
US7086939B2 (en) * 2004-03-19 2006-08-08 Saint-Gobain Performance Plastics Corporation Chemical mechanical polishing retaining ring with integral polymer backing
CN101023511A (zh) * 2004-09-30 2007-08-22 株式会社瑞萨科技 半导体器件的制造方法
DE112005003420T5 (de) * 2005-04-12 2008-02-07 Nippon Seimitsu Denshi Co., Ltd., Yokohama Haltering für CMP-Vorrichtung und Herstellungsverfahren dafür, und CMP-Vorrichtung
US20070224864A1 (en) * 2005-05-24 2007-09-27 John Burns CMP retaining ring
JP4534165B2 (ja) * 2006-12-18 2010-09-01 エルピーダメモリ株式会社 半導体装置の製造装置及び、半導体装置の製造方法
JP5615589B2 (ja) * 2010-05-07 2014-10-29 富士紡ホールディングス株式会社 枠材および枠材を有する保持具
JP5683398B2 (ja) * 2011-07-06 2015-03-11 株式会社クレハ 研磨装置用ワークピース保持リング

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020182867A1 (en) * 2001-06-04 2002-12-05 Multi Planar Technologies, Inc. Chemical mechanical polishing apparatus and method having a retaining ring with a contoured surface
JP2005169568A (ja) * 2003-12-11 2005-06-30 Mitsui Chemicals Inc リテーナリング及びそれを用いた研磨装置

Also Published As

Publication number Publication date
DE112014002107T5 (de) 2016-01-14
KR20160008550A (ko) 2016-01-22
WO2014185003A1 (ja) 2014-11-20
JP2014223692A (ja) 2014-12-04
CN105189045B (zh) 2017-05-10
TWI597127B (zh) 2017-09-01
TW201505762A (zh) 2015-02-16
US20160082567A1 (en) 2016-03-24
CN105189045A (zh) 2015-12-23
SG11201509094YA (en) 2015-12-30
JP5870960B2 (ja) 2016-03-01

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