KR102187948B1 - 도전 입자, 절연 피복 도전 입자, 이방 도전성 접착제 및 도전 입자의 제조 방법 - Google Patents

도전 입자, 절연 피복 도전 입자, 이방 도전성 접착제 및 도전 입자의 제조 방법 Download PDF

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KR102187948B1
KR102187948B1 KR1020140056727A KR20140056727A KR102187948B1 KR 102187948 B1 KR102187948 B1 KR 102187948B1 KR 1020140056727 A KR1020140056727 A KR 1020140056727A KR 20140056727 A KR20140056727 A KR 20140056727A KR 102187948 B1 KR102187948 B1 KR 102187948B1
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KR
South Korea
Prior art keywords
particles
layer
palladium
conductive particles
conductive
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KR1020140056727A
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English (en)
Korean (ko)
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KR20140135631A (ko
Inventor
요시노리 에지리
마사시 나카가와
구니히코 아카이
겐지 다카이
다이조우 야마무라
야스시 와타나베
나나 에노모토
미츠하루 마츠자와
도시아키 마츠자키
Original Assignee
쇼와덴코머티리얼즈가부시끼가이샤
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Publication of KR20140135631A publication Critical patent/KR20140135631A/ko
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Powder Metallurgy (AREA)
KR1020140056727A 2013-05-16 2014-05-12 도전 입자, 절연 피복 도전 입자, 이방 도전성 접착제 및 도전 입자의 제조 방법 KR102187948B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2013-104314 2013-05-16
JP2013104314 2013-05-16

Publications (2)

Publication Number Publication Date
KR20140135631A KR20140135631A (ko) 2014-11-26
KR102187948B1 true KR102187948B1 (ko) 2020-12-07

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KR1020140056727A KR102187948B1 (ko) 2013-05-16 2014-05-12 도전 입자, 절연 피복 도전 입자, 이방 도전성 접착제 및 도전 입자의 제조 방법

Country Status (3)

Country Link
JP (1) JP5900535B2 (zh)
KR (1) KR102187948B1 (zh)
CN (1) CN204102589U (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI735465B (zh) * 2015-09-24 2021-08-11 日商積水化學工業股份有限公司 導電性粒子、導電材料及連接構造體
KR102164893B1 (ko) * 2015-09-30 2020-10-13 덕산하이메탈(주) 합금도전입자, 그 제조방법 및 이를 포함하는 도전성 재료
CN105513673B (zh) * 2016-02-03 2017-07-07 郑州职业技术学院 一种导电粒子及其制备方法
KR102573777B1 (ko) * 2017-04-28 2023-08-31 가부시끼가이샤 레조낙 접착제 조성물 및 접속체의 제조 방법
JP7128115B2 (ja) * 2017-09-20 2022-08-30 積水化学工業株式会社 金属含有粒子、接続材料、接続構造体、接続構造体の製造方法、導通検査用部材及び導通検査装置
WO2019194135A1 (ja) * 2018-04-04 2019-10-10 積水化学工業株式会社 絶縁性粒子付き導電性粒子、導電材料及び接続構造体
KR102598343B1 (ko) * 2020-10-06 2023-11-06 덕산네오룩스 주식회사 도전입자, 도전재료 및 접속 구조체
WO2022075663A1 (ko) * 2020-10-06 2022-04-14 덕산하이메탈(주) 도전입자, 도전재료 및 접속 구조체

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035573A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、及び、異方性導電材料
JP2011159471A (ja) 2010-01-29 2011-08-18 Nippon Chem Ind Co Ltd 導電性粉体及びそれを含む導電性材料並びに導電性粒子の製造方法
WO2013042785A1 (ja) 2011-09-22 2013-03-28 株式会社日本触媒 導電性微粒子及びそれを含む異方性導電材料

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4674096A (en) 1985-03-04 1987-06-16 California Institute Of Technology Lateral coupled cavity semiconductor laser
JP5184612B2 (ja) 2010-11-22 2013-04-17 日本化学工業株式会社 導電性粉体、それを含む導電性材料及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035573A (ja) * 2005-07-29 2007-02-08 Sekisui Chem Co Ltd 導電性微粒子、及び、異方性導電材料
JP2011159471A (ja) 2010-01-29 2011-08-18 Nippon Chem Ind Co Ltd 導電性粉体及びそれを含む導電性材料並びに導電性粒子の製造方法
WO2013042785A1 (ja) 2011-09-22 2013-03-28 株式会社日本触媒 導電性微粒子及びそれを含む異方性導電材料

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Publication number Publication date
KR20140135631A (ko) 2014-11-26
JP5900535B2 (ja) 2016-04-06
CN204102589U (zh) 2015-01-14
JP2014241276A (ja) 2014-12-25

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