KR102179737B1 - 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법, 및 물품 제조 방법 Download PDF

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KR102179737B1
KR102179737B1 KR1020197016503A KR20197016503A KR102179737B1 KR 102179737 B1 KR102179737 B1 KR 102179737B1 KR 1020197016503 A KR1020197016503 A KR 1020197016503A KR 20197016503 A KR20197016503 A KR 20197016503A KR 102179737 B1 KR102179737 B1 KR 102179737B1
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South Korea
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mold
substrate
gas
imprint
stage
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Korean (ko)
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KR20190073573A (ko
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가즈키 나카가와
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
    • B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70808—Construction details, e.g. housing, load-lock, seals or windows for passing light in or out of apparatus
    • G03F7/70825—Mounting of individual elements, e.g. mounts, holders or supports
    • H01L21/027—
    • H01L21/67063—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Epidemiology (AREA)
  • Public Health (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020197016503A 2016-11-18 2017-10-05 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 Active KR102179737B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2016-225375 2016-11-18
JP2016225375A JP6735656B2 (ja) 2016-11-18 2016-11-18 インプリント装置、インプリント方法及び物品の製造方法
PCT/JP2017/036246 WO2018092454A1 (ja) 2016-11-18 2017-10-05 インプリント装置、インプリント方法及び物品の製造方法

Publications (2)

Publication Number Publication Date
KR20190073573A KR20190073573A (ko) 2019-06-26
KR102179737B1 true KR102179737B1 (ko) 2020-11-17

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KR1020197016503A Active KR102179737B1 (ko) 2016-11-18 2017-10-05 임프린트 장치, 임프린트 방법, 및 물품 제조 방법

Country Status (5)

Country Link
US (1) US11333971B2 (https=)
JP (1) JP6735656B2 (https=)
KR (1) KR102179737B1 (https=)
TW (1) TWI661925B (https=)
WO (1) WO2018092454A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837607B (zh) * 2022-03-10 2024-04-01 永嘉光電股份有限公司 大規模壓印之方法

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7149872B2 (ja) * 2019-02-14 2022-10-07 キヤノン株式会社 インプリント方法、インプリント装置、および物品の製造方法
US11181819B2 (en) * 2019-05-31 2021-11-23 Canon Kabushiki Kaisha Frame curing method for extrusion control
JP7386742B2 (ja) * 2020-03-24 2023-11-27 株式会社Ｓｃｒｅｅｎホールディングス 露光装置
US12353127B2 (en) 2021-04-14 2025-07-08 Canon Kabushiki Kaisha Imprint apparatus, imprint method and article manufacturing method
JP7731831B2 (ja) 2022-03-11 2025-09-01 キオクシア株式会社 インプリント方法、半導体装置の製造方法、及びインプリント装置
US12463042B2 (en) * 2022-05-31 2025-11-04 Canon Kabushiki Kaisha Planarization system and method

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260273A (ja) 2007-03-16 2008-10-30 Canon Inc インプリント方法、チップの製造方法及びインプリント装置
JP2014183069A (ja) 2013-03-18 2014-09-29 Dainippon Printing Co Ltd インプリント方法およびインプリント装置
JP2015115413A (ja) 2013-12-10 2015-06-22 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016031952A (ja) 2014-07-25 2016-03-07 キヤノン株式会社 インプリント装置及び物品の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2133154A5 (https=) 1971-04-09 1972-11-24 Cii
JP2007098779A (ja) 2005-10-05 2007-04-19 Nikon Corp 樹脂の剥離方法及びパターン転写装置
JP5235506B2 (ja) * 2008-06-02 2013-07-10 キヤノン株式会社 パターン転写装置及びデバイス製造方法
JP5868215B2 (ja) * 2012-02-27 2016-02-24 キヤノン株式会社 インプリント装置およびインプリント方法、それを用いた物品の製造方法
JP6661397B2 (ja) * 2015-04-22 2020-03-11 キヤノン株式会社 インプリント装置、インプリント方法、および物品の製造方法
JP6603678B2 (ja) * 2016-02-26 2019-11-06 キヤノン株式会社 インプリント装置およびその動作方法ならびに物品製造方法
JP6643145B2 (ja) * 2016-02-29 2020-02-12 キヤノン株式会社 インプリント装置、モールド、インプリント方法及び物品の製造方法
JP6732475B2 (ja) * 2016-02-29 2020-07-29 キヤノン株式会社 インプリント装置、物品の製造方法、保持装置および露光装置
JP6704769B2 (ja) * 2016-03-29 2020-06-03 キヤノン株式会社 インプリント装置、および物品の製造方法
US10754244B2 (en) * 2016-03-31 2020-08-25 Canon Kabushiki Kaisha Pattern forming method as well as production methods for processed substrate, optical component, circuit board, electronic component and imprint mold

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008260273A (ja) 2007-03-16 2008-10-30 Canon Inc インプリント方法、チップの製造方法及びインプリント装置
JP2014183069A (ja) 2013-03-18 2014-09-29 Dainippon Printing Co Ltd インプリント方法およびインプリント装置
JP2015115413A (ja) 2013-12-10 2015-06-22 キヤノン株式会社 インプリント装置及び物品の製造方法
JP2016031952A (ja) 2014-07-25 2016-03-07 キヤノン株式会社 インプリント装置及び物品の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI837607B (zh) * 2022-03-10 2024-04-01 永嘉光電股份有限公司 大規模壓印之方法

Also Published As

Publication number Publication date
JP6735656B2 (ja) 2020-08-05
US11333971B2 (en) 2022-05-17
TWI661925B (zh) 2019-06-11
JP2018082127A (ja) 2018-05-24
WO2018092454A1 (ja) 2018-05-24
KR20190073573A (ko) 2019-06-26
TW201819153A (zh) 2018-06-01
US20190265589A1 (en) 2019-08-29

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